SQUARE Other Function Interface ICs 1,418

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Screening Level	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Maximum Receive Delay
AD9984AKSTZ-170	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1		CMOS				1.8 V				FLATPACK, LOW PROFILE				1.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
LTC4302CMS-1#PBF	Analog Devices	BUS BUFFERS	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1										SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MD2134K7-G	Microchip Technology	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V	1						5 V	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.20SQ,16	4.75 V		4.75 V	.4 mm	70 Cel	5 V	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N40		.8 mm	5 mm	Not Qualified		e4			5 mm
SEC1110-A5-02NC	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1						5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.2SQ,32			3.6 V	.8 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N16		1 mm	5 mm						5 mm
AD9984AKSTZ-140	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1		CMOS				1.8 V				FLATPACK, LOW PROFILE				1.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
ADN2873ACPZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1						3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADN8833ACPZ-R7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1						3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	.8 mm	4 mm			e3			4 mm
CJ135	Robert Bosch	INTERFACE CIRCUIT		NO LEAD	36	QCCN	SQUARE	UNSPECIFIED	YES		1										CHIP CARRIER										QUAD	S-XQCC-N36					QFPEPAD32,WWW.BOSCH-SEMICONDUCTORS.COM/AUTOMOTIVE-SYSTEM-ICS/ENGINE-MANAGEMENT-SYSTEMS/CJ135/		NOT SPECIFIED	NOT SPECIFIED
DS90C189TWRTDRQ1	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.89 V	1			AEC-Q100			1.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.71 V	.5 mm	115 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N64	3	.9 mm	9 mm			e4	30	260	9 mm
DS90C189TWRTDTQ1	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.89 V	1			AEC-Q100			1.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.71 V	.5 mm	115 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N64	3	.9 mm	9 mm			e4	30	260	9 mm
HI-8422PQIF	Holt Integrated Circuits	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8		CMOS				5 V				FLATPACK, LOW PROFILE				4.5 V	.8 mm	85 Cel		-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G32	3	1.6 mm	7 mm	Not Qualified		e3	40	260	7 mm
HI-8425PCIF	Holt Integrated Circuits	INTERFACE CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		SOI-CMOS				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20			3 V	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N40	3	.82 mm	6 mm			e4	NOT SPECIFIED	260	6 mm
HI-8426PQT	Holt Integrated Circuits	INTERFACE CIRCUIT		GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		SOI-CMOS				3.3 V				FLATPACK, THIN PROFILE	TQFP32,.35SQ,32			3 V	.8 mm	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G32	3	1.2 mm	7 mm			e0	30	240	7 mm
HI-8437PQT	Holt Integrated Circuits	INTERFACE CIRCUIT	MILITARY	GULL WING	44	QFP	SQUARE	PLASTIC	YES	3.6 V	1		CMOS		GENRAL PURPOES		3.3 V				FLATPACK				3 V	.8 mm	125 Cel		-55 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G44	3	2.7 mm	10 mm			e0			10 mm
IC-WKNDFN10	Laser Components	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	15 V	1										SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				2.4 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N10		.9 mm	4 mm		SEATED HGT-NOM				4 mm
LTC4301LIMS8	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC4304IMS#PBF	Analog Devices	BUS BUFFERS	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4316CDD#PBF	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	10	VSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS				3.3 V	16.5 V			SMALL OUTLINE, VERY THIN PROFILE		12 V		2.25 V	.5 mm	70 Cel	15 V	0 Cel	MATTE TIN	DUAL	S-PDSO-N10		.8 mm	3 mm			e3			3 mm
LTC6957IDD-1#TRPBF	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.45 V	1		CMOS				3.3 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,18			3.15 V	.45 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3		260	3 mm
LV5609LP-E	Onsemi		COMMERCIAL EXTENDED	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES				BICMOS				3.3 V		3.3		CHIP CARRIER	LCC24,.13SQ,20		Other Interface ICs		.5 mm	80 Cel		-20 Cel		QUAD	S-PQCC-N24	1			Not Qualified			30	260
MADR-009150	M/a-com Technology Solutions	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1				GENERAL PURPOSE		3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20			3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	1	1 mm	3 mm			e4			3 mm
MAX3377EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4		BICMOS				3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX7370ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	VSON	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		BICMOS				3.3 V		1.8/3.3		SMALL OUTLINE, VERY THIN PROFILE	LCC24,.13SQ,16		Display Drivers	1.62 V	.4 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N24	1	.85 mm	3.5 mm	Not Qualified		e3	30	260	3.5 mm
MC33CD1030AE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	36 V	1		SMARTMOS				16 V				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	125 Cel		-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
MD1712FG-G	Microchip Technology	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5 V	1						3.3 V	12.6 V		-10 V	FLATPACK, LOW PROFILE, FINE PITCH	SPQFP48,.28SQ,20	8 V		1.8 V	.5 mm	70 Cel	10 V	0 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
MD2131K7-G	Microchip Technology	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	2.7 V	1						2.5 V	5.25 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4.75 V		2.3 V	.4 mm	70 Cel	5 V	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N40		.8 mm	5 mm			e4			5 mm
NB4L16MMNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	1					55 mA	2.5 V		2.5/3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Line Driver or Receivers	2.375 V	.5 mm	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N16	1	1 mm	3 mm	Not Qualified			30	260	3 mm	.265 ns
NB4L16MMNR2G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	1					55 mA	2.5 V		2.5/3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Line Driver or Receivers	2.375 V	.5 mm	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N16	1	1 mm	3 mm	Not Qualified			30	260	3 mm	.265 ns
NB4N527SMNR2G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1					53 mA	3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Line Driver or Receivers	3 V	.5 mm	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N16	1	1 mm	3 mm	Not Qualified			30	260	3 mm	.47 ns
NB7L216MNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.465 V	1					35 mA	2.5 V		+-2.5/+-3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Line Driver or Receivers	2.375 V	.5 mm	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N16	1	1 mm	3 mm	Not Qualified			30	260	3 mm
NLHV1T0434ZR2G	Onsemi	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	TSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS								SMALL OUTLINE, LOW PROFILE	TSSOP8,.19			3 V	.65 mm	125 Cel		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e4	30	260	3 mm
PI3EQX6801AZDEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1.575 V	1						1.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20			1.425 V	.5 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N20		.8 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
PI4GTL2002UEX	Diodes Incorporated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5 V	1							5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	0 V		0 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm		Also required VDREF 0 to 5V		NOT SPECIFIED	NOT SPECIFIED	3 mm
PTN5110DHQZ	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,16			2.7 V	.4 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N16	1	.4 mm	2.6 mm					260	2.6 mm
SEC1110-A5-02-TR	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1						5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.2SQ,32			3.6 V	.8 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N16		1 mm	5 mm						5 mm
SEC1210I-CN-02-TR	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1						5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25			3.6 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		1 mm	5 mm						5 mm
SY88022ALMG	Microchip Technology	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1						3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20			3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	2	.9 mm	3 mm			e4	40	260	3 mm
SY88022ALMG-TR	Microchip Technology	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1						3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20			3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16		.9 mm	3 mm			e4			3 mm
TCA9509RVHR	Texas Instruments	BUS BUFFERS	INDUSTRIAL	NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1						1.1 V	5.5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V		.9 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N8	1	.4 mm	1.6 mm		ALSO OPERATES WITH 2.7 TO 5.5V	e4	30	260	1.6 mm
TDP158RSBR	Texas Instruments	INTERFACE CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.27 V	1	4					1.1 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1 V	.4 mm	85 Cel		0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N40	2	.8 mm	5 mm		ALSO HAVE 3 NOM AND 3.6 MAX AND 3.3 NOM INPUT AND ALSO HAVE 313 MIN AND 3.47 MAX AND 3.3 NOM INPUT	e4	30	260	5 mm
TPD2S300YFFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	4.5 V	1						3.3 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH				2.7 V	.4 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B9	1	.625 mm	1.4 mm		ALSO REQUIRED VM = 2.7V TO 22V SUPPLY	e1	NOT SPECIFIED	NOT SPECIFIED	1.4 mm
DS250DF410ABMR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	101	TFBGA	SQUARE	PLASTIC/EPOXY	YES		1	4									GRID ARRAY, THIN PROFILE, FINE PITCH					.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B101	3	1.03 mm	6 mm			e1	30	260	6 mm
V62/19608-01XE	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1.6 V	1						1.5 V				FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ			1.4 V	.5 mm	110 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G100	3	1.2 mm	14 mm			e4	30	260	14 mm
ONET4211LDRGER	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					45 mA	3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
DS90CR481VJD/NOPB	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					210 mA	3.3 V		3.3		FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ		Line Driver or Receivers	3 V	.5 mm	70 Cel		-10 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQFP-G100	3	1.2 mm	14 mm	Not Qualified		e4	NOT SPECIFIED	260	14 mm
XCMD3140IRTER	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1						3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,20			3 V	.5 mm	125 Cel		-40 Cel		QUAD	S-PQCC-N20		.8 mm	3 mm						3 mm
LM2512ASMX	Texas Instruments	INTERFACE CIRCUIT	OTHER	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2 V	1						1.8 V				GRID ARRAY, THIN PROFILE, FINE PITCH				1.6 V	.5 mm	85 Cel		-30 Cel		BOTTOM	S-PBGA-B49		1.14 mm	4 mm	Not Qualified					4 mm
ONET4201LDRGER	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1					55 mA	3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified		e4	30	260	4 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.