INDUSTRIAL Other Function Interface ICs 2,400+

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3370EXK+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.8 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.5 V		1.6 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G5	1	1.1 mm	1.25 mm			e3	30	260	2 mm
MAX3373EEKA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.8 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH				1.2 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm			e4	30	260	2.9 mm
MAX3021EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3016EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3001EETP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified					5 mm
MAX3017EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel		BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified				245	2.54 mm
MAX3378EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX3000EEUP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX14839GTC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.75 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MAX7370ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.62 V		1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.85 mm	3.5 mm			e3	30	260	3.5 mm
MAX3025EUD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3397EELA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	UNSPECIFIED	YES	5.5 V	1	BICMOS	1.8 V	5.5 V	1.8/5	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.08,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	GOLD NICKEL	DUAL	S-XDSO-N8	1	.8 mm	2 mm	Not Qualified		e4	30	260	2 mm
MAX3017EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3643ETG	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0		245	4 mm
MAX3009EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS		5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX3005EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS		5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX13015EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3020EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3016EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3735ETG	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3002ETP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BICMOS		5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm			e3	30	260	5 mm
MAX13004EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX3013EUP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
DS28E18Q+U	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	1					SMALL OUTLINE, HEAT SINK/SLUG	SOLCC8,.12,20			2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-N8	1	.8 mm	2 mm			e3	30	260	3 mm
MAX3027EUD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3740ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V			CHIP CARRIER, VERY THIN PROFILE				2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3			4 mm
MAX3391EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX3014EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX13045EEBC+	Analog Devices		INDUSTRIAL	BALL	12	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			2.5/3.3	GRID ARRAY, FINE PITCH	BGA12,3X4,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	BOTTOM	R-PBGA-B12				Not Qualified		e3
MAX3002EUP/GG8	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm				NOT SPECIFIED	NOT SPECIFIED	6.5 mm
MAX3020EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3018EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3028EBC-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e0			2.02 mm
MAX3375EEKA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.8 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH				1.2 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm			e4	30	260	2.9 mm
MAX3393EEUD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	1.8 V	5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e3	30	260	5 mm
MAX13014EKA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
MAX13002EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX13017EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3395EEUD+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs		.635 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G14				Not Qualified		e3
MAX1740EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.25 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3019EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX1841EUB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		1.8 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.4 V		1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
MAX13002EEUE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16	1	1.2 mm	4.4 mm	Not Qualified					5 mm
MAX3023EUD+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
MAX13016EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3011EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS		5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX13042EEBC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.2 V		1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm			e1	30	260	2.12 mm
MAX3646ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.