INDUSTRIAL Other Function Interface ICs 2,400+

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3015EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3022EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX1741EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3643ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX13003EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX13047EEVB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	2	BICMOS	1.8 V	5.5 V	1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16	1.65 V	Other Interface ICs	1.1 V	.4 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N10	1	.55 mm	1.4 mm	Not Qualified		e4	30	260	1.8 mm
MAX3021EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3012EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX3391EEUD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	1.8 V	5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e3	30	260	5 mm
MAX13056EETI+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1					CHIP CARRIER				2.2 V		85 Cel		-40 Cel		QUAD	R-XQCC-N28	1			Not Qualified
MAX13014EKA+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
MAX14834ETB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.75 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3391EEBC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	12	VFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				1.2 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.54 mm			e1	30	260	2.02 mm
MAX3019EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3393EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX13055EETI+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1					CHIP CARRIER				2.2 V		85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-XQCC-N28	1			Not Qualified		e3	30	260
MAX3012EUP+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX14838GTC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				7 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3025EBC-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e0			2.02 mm
MAX3379EETD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX3002EBP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V		1.2 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm			e1	30	260	2.54 mm
MAX24101ELU+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	60	HQCCN	RECTANGULAR	UNSPECIFIED	YES	2.75 V	1	BICMOS	2.5 V			CHIP CARRIER, HEAT SINK/SLUG				2.312 V	.5 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-N60		1.14 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm
MAX13044EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	2.2 V	Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14		.8 mm	3 mm	Not Qualified		e3			3 mm
MAX3015EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX1840EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		1.8 V	5.5 V	1.8,1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	1.4 V	Other Interface ICs	1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX13015EKA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		e0		245	2.9 mm
MAX13058EETI+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1					CHIP CARRIER				2.2 V		85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-XQCC-N28	1			Not Qualified		e3	30	260
MAX3026EBC-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified		e0			2.02 mm
MAX13013EXT+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	30	260	2 mm
DS28E17Q+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	CMOS	3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.45 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	4 mm			e3	40	260	4 mm
MAX4895EETE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BICMOS	3.3 V	5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V		2 V	.5 mm	85 Cel	5 V	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3967ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3			4 mm
MAX3008EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX3374EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	5.5 V	2	BICMOS	3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX14839GTC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				4.75 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MAX3007EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3015EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX14839GWC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	34 V	1	BICMOS	24 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				4.75 V	.5 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.885 mm			e1	30	260	2.215 mm
MAX13004EEUE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16	1	1.2 mm	4.4 mm	Not Qualified					5 mm
MAX3024EUD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3019EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX13045EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16	2.2 V	Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14		.8 mm	3 mm	Not Qualified		e3			3 mm
MAX3377EEUD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	1.8 V	5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e3	30	260	5 mm
MAX3736ETE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX13030EEBE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e1	30	260	2.02 mm
MAX3643ETG+G1N	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm			e3	30	260	4 mm
MAX3017EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.2 V	8	BICMOS	1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX13005EEUE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16	1	1.2 mm	4.4 mm	Not Qualified					5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.