INDUSTRIAL Other Function Interface ICs 2,400+

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Maximum Receive Delay
MAX14838GWC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	34 V	1	BICMOS			24 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH						7 V	.5 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.885 mm			e1	30	260	2.215 mm
MAX3022EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		1.65 V		Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3738ETG+TGD0	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm			e3	30	260	4 mm
MAX3372EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED		YES	5.5 V	2	BICMOS			3.3 V	5.5 V	1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX13001EEUE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25				Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified					5 mm
MAX1840EUB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				1.8 V	5.5 V	1.8,1.8/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		1.4 V		Other Interface ICs	1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX3002ETP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BICMOS				5.5 V	1.8/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified					5 mm
MAX7304EWA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16				Display Drivers	1.62 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25	1	.69 mm	2.09 mm	Not Qualified					2.09 mm
MAX13035EEBE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		2.2 V		Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e1	30	260	2.02 mm
MAX3014EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V		Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX13042EETD+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			2.2 V			1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14	1	.8 mm	3 mm			e3	30	260	3 mm
MAX13013EXT+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			2.5 V	3.2 V	1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		1.2 V		Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	30	260	2 mm
MAX13031EETE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		2.2 V		Other Interface ICs	1.62 V	.65 mm	85 Cel	3.3 V	-40 Cel		QUAD	S-XQCC-N16		.8 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
MAX3740ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V				CHIP CARRIER, VERY THIN PROFILE						2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3740AETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3261E/D	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	38	DIE	SQUARE	UNSPECIFIED		YES	5.25 V	1				5 V				UNCASED CHIP						4.75 V		85 Cel		-40 Cel	TIN LEAD	UPPER	S-XUUC-N38				Not Qualified		e0
MAX3967AETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX17079GTL+W	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V				CHIP CARRIER						2.3 V		105 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1					e3	30	260
MAX3869EHJ+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V		3.3/5		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ				Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e3	30	260	5 mm
MAX17119ETI+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED		YES	38 V	1	BICMOS			30 V			-6.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						12 V	.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.8 mm	4 mm			e3	30	260	4 mm
MAX3795ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX17119ETI+TW	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED		YES	38 V	1	BICMOS			30 V			-6.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						12 V	.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.8 mm	4 mm			e3	30	260	4 mm
MAX3669ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				3.3 V		3.3/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX17119ETI+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED		YES	38 V	1	BICMOS			30 V			-6.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						12 V	.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.8 mm	4 mm			e3	30	260	4 mm
MAX3955ETJ+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.47 V	1	BICMOS			3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.85 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm			e3	30	260	5 mm
MAX17119ETI+CH9	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED		YES	38 V	1	BICMOS			30 V			-6.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						12 V	.4 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N28		.8 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
MAX3669ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V		3.3/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3967AETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3737ETJ+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
MAX3737ETJ+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20				Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
MAX17119ETI+W	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED		YES	38 V	1	BICMOS			30 V			-6.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						12 V	.4 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N28		.8 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
MAX17079GTL+CAZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V				CHIP CARRIER						2.3 V		105 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1					e3	30	260
MAX3656ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20				Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
NB4N855SMR4G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1				3.3 V		3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20				Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LC75827E	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES			CMOS		.5 mA			3/5		FLATPACK	QFP64,.66SQ,32	200		4-BP	Other Interface ICs		.8 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G64				Not Qualified
NLHV18T3244MNTWG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	50	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	5.5 V	1				3.3 V	25 V	2.5/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC50,.2X.4,20		5 V		Other Interface ICs	2 V	.5 mm	85 Cel	15 V	-40 Cel	MATTE TIN	QUAD	R-XQCC-N50	3	1 mm	5 mm	Not Qualified	ALSO REQUIRED NEG SUPPLY VOLTAGE -13V TO 0	e3	30	260	10 mm
NLPS591MNTWG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	VQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1								CHIP CARRIER, VERY THIN PROFILE	LCC16,.07X.1,16					1.65 V	.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N16	1	.8 mm	1.8 mm			e4	30	260	2.6 mm
NLVSV2T244DMR2G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	4.5 V	2		AEC-Q100		3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						.9 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e3	30	260	3 mm
LC75814VS-MPB-E	Onsemi		INDUSTRIAL	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES			CMOS		.46 mA			3/5		SMALL OUTLINE, SHRINK PITCH	SSOP30,.3	16		4-BP	Other Interface ICs		.635 mm	85 Cel		-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G30	4			Not Qualified		e6	30	260
LC75883W	Onsemi		INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES			CMOS		.46 mA	5 V		5		FLATPACK	QFP80,.55SQ,20	55		3-BP	Other Interface ICs		.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G80				Not Qualified
NB4N527SMNR2	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1			53 mA	3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20				Line Driver or Receivers	3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N16		1 mm	3 mm	Not Qualified		e0		235	3 mm	.47 ns
LC75811W	Onsemi		INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES			CMOS			5 V		5		FLATPACK	QFP80,.55SQ,20	60		8/10-BP	Other Interface ICs		.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G80				Not Qualified
NB4N855SMR4	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1				3.3 V		3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20				Other Interface ICs	3 V	.5 mm	85 Cel		-40 Cel	Tin/Lead (Sn80Pb20)	DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified		e0	30	235	3 mm
NB4L16MMN	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V	1			55 mA	2.5 V		2.5/3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20				Line Driver or Receivers	2.375 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N16		1 mm	3 mm	Not Qualified		e0		235	3 mm	.265 ns
LC7584N	Onsemi		INDUSTRIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES			CMOS		4 mA	5 V		5		FLATPACK	QFP80,.75X1,32	48		0-BP	Other Interface ICs		.8 mm	85 Cel		-40 Cel		QUAD	R-PQFP-G80				Not Qualified
NB7VPQ16MMNHTBG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	2.625 V	1				1.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						1.71 V	.5 mm	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N16	1	1 mm	3 mm				30	260	3 mm
MDC5101R2	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES		1	BIPOLAR			2.75 V		-5,2.75	-5 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs		.65 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
NLSX0102FCT2G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	2				3.3 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH						1.5 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B8	1	.5 mm	.9 mm			e1	30	260	1.9 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.