Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
.01 mA |
1.8 V |
5.5 V |
1.8/3.3,2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
2.3 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
3.3 V |
3-STATE |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B12 |
1 |
.625 mm |
1.4 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
260 |
1.87 mm |
||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
.01 mA |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.65 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
2 |
1 mm |
2 mm |
ALSO REQUIRE SUPPLY FROM 2.3V TO 5.5V AND ESD VALUE 3B FOR PORT B |
e1 |
30 |
260 |
2.5 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
4 |
.01 mA |
1.8 V |
5.5 V |
1.8/3.3,2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
2.3 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
3.3 V |
3-STATE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.61 mm |
2 mm |
Not Qualified |
e1 |
30 |
260 |
2.5 mm |
||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
8 |
.01 mA |
1.5 V |
5.5 V |
1.2/3.6,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
1.8 V |
3-STATE |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B20 |
1 |
.5 mm |
1.9 mm |
Not Qualified |
HTTP://WWW.TI.COM/LIT/ML/MXBG100B/MXBG100B.PDF |
e1 |
NOT SPECIFIED |
260 |
2.4 mm |
|||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
64 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,9X9,20 |
1.65 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
3 |
1 mm |
5 mm |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
8 |
.008 mA |
1.65 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
1.4 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B20 |
2 |
1.6 mm |
2.5 mm |
e1 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
8 |
.008 mA |
2.5 V |
1.2/3.6,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B20 |
1 |
.61 mm |
2.5 mm |
Not Qualified |
ALSO OPERATES WITH 1.65 TO 5.5 VOLT |
e1 |
30 |
260 |
3 mm |
||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
64 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,9X9,20 |
1.65 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
3 |
1 mm |
5 mm |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
8 |
.01 mA |
1.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.2 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B20 |
1 |
.5 mm |
1.888 mm |
ALSO HAVE 1.65 TO 5.5 INPUT VOLTAGE |
e1 |
30 |
260 |
2.388 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
2 |
.01 mA |
1.8 V |
5.5 V |
1.8/3.3,2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
2.3 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
2.5 V |
3-STATE |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B8 |
1 |
.5 mm |
.9 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
260 |
1.9 mm |
||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
8 |
.01 mA |
1.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
1.2 V |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B20 |
2 |
.5 mm |
1.888 mm |
IT HAS 1.65 TO 5V PORT B SUPPLY VOLTAGE |
e1 |
30 |
260 |
2.388 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
4 |
.01 mA |
1.4 V |
5.5 V |
1.8/3.3,2.5/5 |
13.7 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
1.8 V |
3-STATE |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B12 |
1 |
.625 mm |
1.37 mm |
Not Qualified |
TRUE |
ALSO REQUIRED 1.8V SUPPLY NOMINAL |
e1 |
NOT SPECIFIED |
260 |
1.87 mm |
|||||||||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
5.5 V |
1.8/3.3,2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
2.3 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.61 mm |
2 mm |
Not Qualified |
e0 |
240 |
2.5 mm |
|||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
64 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
1 |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,9X9,20 |
1.14 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
3 |
1 mm |
5 mm |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
64 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
1 |
2 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,9X9,20 |
1.65 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
3 |
1 mm |
5 mm |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
1.8 V |
5.5 V |
1.8/3.3,2.5/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
2.3 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
2.5 V |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B8 |
1 |
.5 mm |
.888 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
260 |
1.888 mm |
|||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
.0125 mA |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B12 |
1 |
.5 mm |
1.442 mm |
e1 |
30 |
260 |
1.942 mm |
||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
1 |
800 mA |
1.2 V |
1.2 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Other Interface ICs |
1.15 V |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B100 |
1.7 mm |
11 mm |
Not Qualified |
11 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
2 |
.008 mA |
1.5 V |
5.5 V |
1.2/3.6,1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
1.8 V |
3-STATE |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B8 |
1 |
.5 mm |
.9 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
260 |
1.9 mm |
||||||||||||||||||||||
|
Toshiba |
INTERFACE CIRCUIT |
BALL |
72 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.3 V |
1 |
CMOS |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA72,9x9,16 |
1.1 V |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B72 |
1 mm |
4.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.5 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
2 |
2 |
LATCH |
3 V |
5.5 V |
1.3 ns |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
1.8 V |
Other Interface ICs |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B8 |
1 |
.625 mm |
.9 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
260 |
1.9 mm |
|||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
2.02 mm |
||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4.5 V |
1 |
2 |
.0125 mA |
LATCH |
3.3 V |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,2X4,20 |
1.8 V |
1 V |
.5 mm |
125 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B8 |
1 |
.625 mm |
.888 mm |
e1 |
NOT SPECIFIED |
260 |
1.888 mm |
||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.9 V |
1 |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
3.5 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.625 mm |
1.29 mm |
e1 |
30 |
260 |
1.99 mm |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
1 |
CMOS |
1.8 V |
5 V |
1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
3 V |
Level Translators |
1.62 V |
.4 mm |
85 Cel |
3.4 V |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
.65 mm |
2 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
|||||||||||||||||||||||||||
Toshiba |
INTERFACE CIRCUIT |
BALL |
80 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.3 V |
1 |
CMOS |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA80,10X10,25 |
1.1 V |
.65 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B80 |
1 mm |
7 mm |
7 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
3 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
|||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.1 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
.625 mm |
1.37 mm |
IT ALSO HAS 1.1 TO 3.6V SUPPLY VOLTAGE |
NOT SPECIFIED |
NOT SPECIFIED |
1.87 mm |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
BALL |
1408 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B1408 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
2 |
.04 mA |
1.2 V |
3.6 V |
1.2/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,16 |
1.1 V |
Other Interface ICs |
1.1 V |
.4 mm |
85 Cel |
1.2 V |
PUSH-PULL |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.5 mm |
1.17 mm |
Not Qualified |
e1 |
30 |
260 |
1.57 mm |
|||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
BALL |
15 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
4.32 V |
1 |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA15,3X5,14 |
3 V |
.35 mm |
85 Cel |
-20 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B15 |
1 |
.5 mm |
1.303 mm |
e1 |
260 |
2.003 mm |
||||||||||||||||||||||||||||||||
|
Nexperia |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.7 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
1 |
.55 mm |
2.05 mm |
VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6 |
30 |
260 |
2.05 mm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
4 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA25,5X5,16 |
Level Translators |
2.5 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
.5 mm |
2.04 mm |
Not Qualified |
2.04 mm |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.9 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B20 |
.53 mm |
1.7 mm |
e2 |
30 |
260 |
2.1 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
32 |
LBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
BGA32,8X11,50 |
3 V |
1.27 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B32 |
4 |
3.62 mm |
15 mm |
30 |
245 |
11.25 mm |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
12 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
1.8/3.3,2.5/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,16 |
Other Interface ICs |
.4 mm |
125 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B12 |
Not Qualified |
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|
NXP Semiconductors |
INTERFACE CIRCUIT |
BALL |
42 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA42,6X7,16 |
.8 V |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B42 |
1 |
1 mm |
2.6 mm |
e1 |
30 |
260 |
3 mm |
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|
Renesas Electronics |
DIGITAL I/O MODULE |
BALL |
24 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
36 V |
1 |
HV-CMOS |
24 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA24,4X6,16 |
9 V |
.4 mm |
105 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
.5834 mm |
1.98 mm |
2.572 mm |
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|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
.0125 mA |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
125 Cel |
3-STATE |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B12 |
1 |
.5 mm |
1.442 mm |
e1 |
30 |
260 |
1.942 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
COMMERCIAL |
BALL |
24 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
6 |
SPI |
5 V |
GRID ARRAY |
BGA24,6X9,40 |
3 V |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
R-PBGA-B24 |
3.11 mm |
6.25 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
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|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Other Interface ICs |
1.5 V |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B16 |
1 |
.67 mm |
2.02 mm |
Not Qualified |
2.02 mm |
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Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
6 |
BICMOS |
1.65 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
Other Interface ICs |
1.5 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B16 |
1 |
.67 mm |
2.02 mm |
Not Qualified |
e0 |
245 |
2.02 mm |
|||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B9 |
1 |
.67 mm |
1.52 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
1.52 mm |
||||||||||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.9 V |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B20 |
.53 mm |
1.7 mm |
2.1 mm |
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|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.7 V |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B25 |
1 |
.66 mm |
2.54 mm |
e1 |
30 |
260 |
2.54 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
DIGITAL ISOLATOR |
INDUSTRIAL |
BALL |
32 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
5.5 V |
GRID ARRAY |
BGA32,8X11,50 |
1.62 V |
1.62 V |
1.27 mm |
85 Cel |
3.3 V |
-40 Cel |
BOTTOM |
R-PBGA-B32 |
4 |
3.62 mm |
11.25 mm |
30 |
245 |
15 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.2 V |
1 |
BICMOS |
1.8 V |
3.6 V |
2.5/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
2.2 V |
Other Interface ICs |
1.62 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B16 |
1 |
.67 mm |
2 mm |
Not Qualified |
e1 |
30 |
260 |
2 mm |
||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
.0009 mA |
2.5 V |
2.5/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Other Interface ICs |
2.3 V |
.4 mm |
85 Cel |
PUSH-PULL |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B6 |
1 |
.5 mm |
.77 mm |
Not Qualified |
e1 |
30 |
260 |
1.17 mm |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.