BALL Other Function Interface ICs 393

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

ST4G3234BJR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

11

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.65 V

1.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA11,3X7,17/10

Other Interface ICs

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B11

.715 mm

1.41 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

ST1G3234BJR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

5

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

1.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA5,3X3,20/10

Other Interface ICs

1.4 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B5

.715 mm

1.02 mm

Not Qualified

e1

1.36 mm

ST6G3237BTBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1.16 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

ST6G3238NETBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.65 V

GRID ARRAY

1.4 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

3

1.16 mm

3 mm

Not Qualified

e1

30

260

3 mm

ST6G3238BE

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1.16 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

ST6G3240TBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B36

1.16 mm

3.6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3.6 mm

TDA8026ET/C3

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

2.7 V

.8 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B64

1.2 mm

7 mm

7 mm

NVT4556BUK

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.55 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.412 mm

1.205 mm

1.605 mm

TDA8026ET/C2

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY

2.7 V

.8 mm

85 Cel

-25 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

2

1.2 mm

7 mm

Not Qualified

ALSO OPERATE FROM 5.25 TO 5.5 V SUPPLY

e1

30

260

7 mm

TDA8026ET/C3K

NXP Semiconductors

INTERFACE CIRCUIT

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA64,8X8,32

2.7 V

.8 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B64

2

1.2 mm

7 mm

260

7 mm

NVT4555UKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.2 V

1.2/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,16

Other Interface ICs

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.6 mm

1.19 mm

Not Qualified

IT ALSO REQUIRES 2.5 TO 5.5V

NOT SPECIFIED

NOT SPECIFIED

1.62 mm

NVT4556AUKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.55 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.412 mm

1.205 mm

NOT SPECIFIED

NOT SPECIFIED

1.605 mm

NTB0104UK-Q100Z

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

AEC-Q100

1.2/3.6,1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

NVT4556BUKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.55 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.412 mm

1.205 mm

NOT SPECIFIED

NOT SPECIFIED

1.605 mm

NVT4857UK

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.9 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

.53 mm

1.7 mm

2.1 mm

NVT4556AUK

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.55 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.412 mm

1.205 mm

1.605 mm

IP4853CX24/LF/P,13

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

935371405118

NXP Semiconductors

INTERFACE CIRCUIT

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA42,6X7,16

.8 V

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B42

1

1 mm

2.6 mm

e1

3 mm

IP4853CX24,135

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

IP4855CX25/C

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.55 mm

2.05 mm

2.05 mm

IP4853CX24/LF/T3

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

IP4855CX25

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.05 mm

2.05 mm

IP4855CX25,14

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.05 mm

2.05 mm

IP4856CX25/C

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.8 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.55 mm

2.05 mm

2.05 mm

IP4853CX24/P,135

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

IP4855CX25/P

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

4 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

2.04 mm

IP4856CX25

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

2.9 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.8 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.05 mm

2.05 mm

IP4855CX25Z

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

IP4855CX25/CAZ

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

PI2EQX6814NJE

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

1.14 V

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.7 mm

11 mm

11 mm

PI2EQX3202BNBE

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

84

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1

1.5 V

1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA84,10X10,32

Other Interface ICs

1.4 V

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B84

3

1.46 mm

9 mm

Not Qualified

e1

9 mm

PI2EQX6814NJEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

1.14 V

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.7 mm

11 mm

11 mm

PI2EQX4402NBX

Diodes Incorporated

COMMERCIAL

BALL

84

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA84,10X10,32

Other Interface ICs

.8 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B84

Not Qualified

e0

PI2EQX3202NBX

Diodes Incorporated

COMMERCIAL

BALL

84

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA84,10X10,32

Other Interface ICs

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B84

Not Qualified

PI2EQX6804-ANJE

Diodes Incorporated

INTERFACE CIRCUIT

COMMERCIAL

BALL

100

BGA

SQUARE

PLASTIC/EPOXY

YES

1.25 V

1

1.2 V

GRID ARRAY

1.15 V

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B100

1.96 mm

11 mm

Not Qualified

e1

11 mm

PI2EQX3202NBEX

Diodes Incorporated

COMMERCIAL

BALL

84

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA84,10X10,32

Other Interface ICs

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B84

Not Qualified

PI2EQX5904NJE

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.25 V

1

800 mA

1.2 V

1.2

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

Other Interface ICs

1.15 V

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.7 mm

11 mm

Not Qualified

11 mm

PI2EQX3202BNBEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

84

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.9 V

1

1.5 V

1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA84,10X10,32

Other Interface ICs

1.4 V

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B84

3

1.46 mm

9 mm

Not Qualified

e1

9 mm

MAX8521EBX-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

36

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B36

1

.67 mm

3.06 mm

Not Qualified

e0

3.06 mm

DS1862B

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.6 V

1.5/3.3,3/5.5

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA25,5X5,30

1.6 V

Display Drivers

2.9 V

.8 mm

100 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

DS1862B+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.6 V

1.5/3.3,3/5.5

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA25,5X5,30

1.6 V

Display Drivers

2.9 V

.8 mm

100 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e1

30

260

5 mm

DS1862B+T&R

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.6 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 V

2.9 V

.8 mm

100 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e1

30

260

5 mm

DS1861B

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

BALL

16

LBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

GRID ARRAY, LOW PROFILE

2.85 V

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B16

1

1.5 mm

4 mm

Not Qualified

4 mm

MAX8521EBX

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

36

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B36

1

.67 mm

3.06 mm

Not Qualified

e0

3.06 mm

DS1861B+

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

BALL

16

LBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

GRID ARRAY, LOW PROFILE

2.85 V

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

3

1.5 mm

4 mm

Not Qualified

e1

4 mm

MAX7360EWX+T

Maxim Integrated

INTERFACE CIRCUIT

BALL

36

VFBGA

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA36,6x6,16

1.62 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B36

.69 mm

2.57 mm

2.57 mm

MAX3005EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3004EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.