BALL Other Function Interface ICs 393

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX3374EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX3390EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX13043EEBC+

Maxim Integrated

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

2.5/3.3

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

Not Qualified

e1

30

260

MAX3390EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3007EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3379EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3006EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

8

BICMOS

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-XBGA-B20

1

.67 mm

Not Qualified

e0

MAX13056EEWG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

BGA

UNSPECIFIED

UNSPECIFIED

YES

3.6 V

1

GRID ARRAY

2.2 V

85 Cel

-40 Cel

BOTTOM

X-XBGA-B24

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

MAX3000EEBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3377EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3377EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

1.52 mm

MAX7370EWA+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.62 V

1.62 V

.4 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B25

1

.69 mm

2.09 mm

e2

30

260

2.09 mm

MAX13014EBL-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

2

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA9,3X3,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

e0

245

1.52 mm

MAX3376EEBL-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA9,3X3,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

1.52 mm

MAX14834EWL+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

4.75 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B9

1

.69 mm

1.568 mm

e2

30

260

2 mm

MAX3009EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3343EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

3.6 V

5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

1.8 V

Other Interface ICs

4 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX3005EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

8

BICMOS

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-XBGA-B20

1

.67 mm

Not Qualified

e0

MAX7370AWA+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.62 V

1.62 V

.4 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

S-PBGA-B25

.69 mm

2.09 mm

NOT SPECIFIED

NOT SPECIFIED

2.09 mm

MAX3341EEBE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

2/3.3,5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

4 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX3001EEBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX13045EEBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.2 V

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

2.12 mm

MAX3013EBP+T

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/3.3

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

Not Qualified

MAX3340EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

3.6 V

5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

1.8 V

Other Interface ICs

4 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX13057EEWG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

BGA

UNSPECIFIED

UNSPECIFIED

YES

3.6 V

1

GRID ARRAY

2.2 V

85 Cel

-40 Cel

BOTTOM

X-XBGA-B24

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

MAX3341EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

2/3.3,5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

4 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.65 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX3375EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn63Pb37)

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX13044EEBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.2 V

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

2.12 mm

MAX3013EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

8

BICMOS

3.3 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.65 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX13043EEBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.12 mm

MAX3394EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA9,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B9

Not Qualified

e0

MAX3012EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

245

2.54 mm

MAX3003EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3000EEBP

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

Not Qualified

MAX13004EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX13001EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX13013EBT+T

Maxim Integrated

INDUSTRIAL

BALL

6

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/3.3

GRID ARRAY, FINE PITCH

BGA6,2X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

Not Qualified

e1

30

260

MAX14595EWA+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.2 V

5.5 V

1.2/5,1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA8,2X4,16

1.65 V

Other Interface ICs

.9 V

.4 mm

85 Cel

3 V

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B8

1

.69 mm

.837 mm

Not Qualified

e2

30

260

1.627 mm

TC358748XBG

Toshiba

INTERFACE CIRCUIT

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.3 V

1

CMOS

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,10X10,25

1.1 V

.65 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B80

1 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TC7LX1101WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

6

FBGA

RECTANGULAR

PLASTIC

YES

CMOS

1.2/3.6

GRID ARRAY, FINE PITCH

BGA6,2X3,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

Not Qualified

T3GE9WBG(EL)

Toshiba

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.8,2.9

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

TC9595XBG

Toshiba

INTERFACE CIRCUIT

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

1

CMOS

AEC-Q100

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,10X10,25

1.71 V

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B80

1 mm

7 mm

7 mm

T3GF3WBG(EL)

Toshiba

OTHER

BALL

25

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA25,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B25

Not Qualified

TC7LX1108WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

FBGA

SQUARE

PLASTIC

YES

CMOS

1.5/3.3

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B24

Not Qualified

TC7LX1204WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.2/3.3

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B24

Not Qualified

TC7LX1102WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

RECTANGULAR

PLASTIC

YES

CMOS

1.2/3.3

GRID ARRAY, FINE PITCH

BGA8,2X4,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B8

Not Qualified

TC7LX1104WBG(EL)

Toshiba

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

1.2/3.6

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

TC358748XBG(ES)

Toshiba

INTERFACE CIRCUIT

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.3 V

1

CMOS

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,10X10,25

1.1 V

.65 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B80

1 mm

7 mm

7 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.