BALL Other Function Interface ICs 393

Reset All
Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX14591EWA+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.2 V

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

.9 V

.4 mm

85 Cel

3 V

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B8

1

.69 mm

.837 mm

e2

30

260

1.627 mm

MAX3375EEBL-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA9,3X3,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

1.52 mm

MAX13002EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX13032EEBE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e1

30

260

2.02 mm

MAX3010EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

8

BICMOS

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-XBGA-B20

1

.67 mm

Not Qualified

e0

MAX3975UBA-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,20

Display Drivers

2.97 V

.5 mm

85 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

1

.67 mm

2.54 mm

Not Qualified

e0

2.54 mm

MAX3372EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX3803UBP-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

BALL

14

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

BOTTOM

R-XBGA-B14

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3601CWO+

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.9 V

1

1.8 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA42,6X7,20

Display Drivers

1.7 V

.5 mm

70 Cel

0 Cel

BOTTOM

R-PBGA-B42

.69 mm

3.395 mm

Not Qualified

IT ALSO REQUIRES 3.3V

3.515 mm

MAX3006EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3393EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX13058EEWG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

BGA

UNSPECIFIED

UNSPECIFIED

YES

3.6 V

1

GRID ARRAY

2.2 V

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

X-XBGA-B24

1

Not Qualified

e2

30

260

MAX3393EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3340EEBE

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

3.6 V

5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

1.8 V

Other Interface ICs

4 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

245

2.02 mm

MAX13003EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX14595EWA+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.2 V

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

.9 V

.4 mm

85 Cel

3 V

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B8

1

.69 mm

.837 mm

e2

30

260

1.627 mm

MAX3376EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX3392EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX13032EEBE+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.67 mm

2 mm

Not Qualified

e1

30

260

2 mm

MAX3012EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

8

BICMOS

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-XBGA-B20

1

.67 mm

Not Qualified

e0

MAX3379EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX3803UBP

Maxim Integrated

INTERFACE CIRCUIT

OTHER

BALL

14

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B14

1

.67 mm

2.03 mm

e0

2.54 mm

MAX3011EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX13000EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

.67 mm

2.02 mm

Not Qualified

e0

2.02 mm

MAX3002EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

e0

2.54 mm

MAX3023EBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e0

2.02 mm

MAX13034EEBE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B16

.67 mm

2.02 mm

Not Qualified

e3

2.02 mm

MAX3395EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B12

Not Qualified

e0

MAX3010EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3372EEBL-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA9,3X3,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

1.52 mm

MAX3008EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

8

BICMOS

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-XBGA-B20

1

.67 mm

Not Qualified

e0

MAX3373EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B8

Not Qualified

MAX3001EEBP

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

Not Qualified

e0

MAX13033EEBE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B16

.67 mm

2.02 mm

Not Qualified

e3

2.02 mm

MAX13055EEWG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

BGA

UNSPECIFIED

UNSPECIFIED

YES

3.6 V

1

GRID ARRAY

2.2 V

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

X-XBGA-B24

1

Not Qualified

e2

30

260

MAX3392EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3023EBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.02 mm

MAX13013EBT-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA6,2X3,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B6

1

.67 mm

1.75 mm

Not Qualified

e0

245

1.98 mm

MAX3003EBP

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

Not Qualified

e0

MAX3004EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

245

2.54 mm

MAX3011EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

8

BICMOS

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-XBGA-B20

1

.67 mm

Not Qualified

e0

MAX3009EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

8

BICMOS

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-XBGA-B20

1

.67 mm

Not Qualified

e0

MAX3391EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX13031EEBE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B16

.67 mm

2.02 mm

Not Qualified

e3

2.02 mm

MAX3008EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

245

2.54 mm

MAX3027EBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e0

2.02 mm

MAX3374EEBL-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA9,3X3,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

1.52 mm

MAX14591EWA+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.2 V

5.5 V

1.2/5,1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA8,2X4,16

1.65 V

Other Interface ICs

.9 V

.4 mm

85 Cel

3 V

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B8

1

.69 mm

.835 mm

Not Qualified

e2

30

260

1.625 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.