Analog Devices Other Function Interface ICs 2,370

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX253EUA+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

4.5 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

e3

30

260

3 mm

MAX14434BAWE+

Analog Devices

INTERFACE CIRCUIT

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.8 V

SMALL OUTLINE

1.71 V

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

3

2.65 mm

7.5 mm

e3

30

260

10.3 mm

MAX14838GWC+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

34 V

1

BICMOS

24 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

7 V

.5 mm

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.69 mm

1.885 mm

e1

30

260

2.215 mm

MAX7306AUB+

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

1.8/3.3

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

Display Drivers

1.62 V

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3372EEKA+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.8 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.2 V

.65 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

30

260

2.9 mm

MAX14430FASE+

Analog Devices

INTERFACE CIRCUIT

Matte Tin (Sn) - annealed

3

e3

30

260

MAX3003EUP+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

BICMOS

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.65 V

1.2 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

6.5 mm

MAX3373EETA

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

S-XDSO-N8

.8 mm

3 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

3 mm

MAX13016EKA

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

BICMOS

2.5 V

3.2 V

1.8/3.3

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP8,.1

1.2 V

Other Interface ICs

1.65 V

.65 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

Not Qualified

e0

245

2.9 mm

MAX3014EGP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

QUAD

S-XQCC-N20

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX14935DAWE+

Analog Devices

INTERFACE CIRCUIT

Matte Tin (Sn) - annealed

1

e3

30

260

MAX3004EUP+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

BICMOS

5.5 V

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

6.5 mm

MAX3016EGP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

QUAD

S-XQCC-N20

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX22444BAWE+

Analog Devices

INTERFACE CIRCUIT

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

3.3 V

SMALL OUTLINE

SOP16,.4

1.71 V

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

3

2.65 mm

7.5 mm

e3

30

260

10.3 mm

MAX3643ETG+TG1N

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N24

1

.8 mm

4 mm

e3

30

260

4 mm

MAX1841EUB+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

1.8 V

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.4 V

1.7 V

.5 mm

85 Cel

1.8 V

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3390EEUD+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

1.8 V

5.5 V

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G14

1

1.1 mm

4.4 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e3

30

260

5 mm

MAX14430CASE+

Analog Devices

INTERFACE CIRCUIT

Matte Tin (Sn) - annealed

3

e3

30

260

MAX3600BCTL+

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

CHIP CARRIER

LCC40,.2SQ,16

Display Drivers

.4 mm

70 Cel

0 Cel

QUAD

S-PQCC-N40

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

MAX3374EEKA+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.8 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.2 V

.65 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

30

260

2.9 mm

MAX22445RAWE+T

Analog Devices

INTERFACE CIRCUIT

Matte Tin (Sn) - annealed

3

e3

30

260

MAX3289CUE+T

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

5 mm

MAX3018EBP-T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3010EUP+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

BICMOS

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.65 V

1.2 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

6.5 mm

MAX3392EETD

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12,16

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

S-XDSO-N8

1

.8 mm

3 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

3 mm

MAX22165CAEE+/V

Analog Devices

INTERFACE CIRCUIT

MAX253MSA/PR+

Analog Devices

INTERFACE CIRCUIT

Matte Tin (Sn) - annealed

1

e3

30

260

MAX3002ETP+

Analog Devices

INDUSTRIAL

NO LEAD

20

QCCN

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

CHIP CARRIER

LCC20,.20SQ,25

Other Interface ICs

.635 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-N20

1

Not Qualified

e3

30

260

MAX31913AUI+T

Analog Devices

Digital I/P Module

AUTOMOTIVE

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

2.3 mA

24 V

7/36

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Line Driver or Receivers

7 V

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G28

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

9.7 mm

MAX22291EASA/V+

Analog Devices

INTERFACE CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MAX14432BASE+T

Analog Devices

INTERFACE CIRCUIT

Matte Tin (Sn) - annealed

3

e3

30

260

MAX13046EELT+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

1.8 V

5.5 V

1.8/5

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

1.65 V

Other Interface ICs

1.1 V

.5 mm

85 Cel

3.3 V

-40 Cel

GOLD NICKEL

DUAL

R-PDSO-N6

1

.8 mm

1 mm

Not Qualified

e4

30

260

1.5 mm

MAX14932AAWE+T

Analog Devices

INTERFACE CIRCUIT

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

SMALL OUTLINE

SOP16,.4

1.71 V

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

2.65 mm

7.5 mm

Also has VDDB supply from 1.71V to 5.5V

e3

30

260

10.3 mm

MAX13057EETI+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

28

QCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

CHIP CARRIER

2.2 V

85 Cel

-40 Cel

QUAD

R-XQCC-N28

1

Not Qualified

MAX3001EEUP+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

BICMOS

5.5 V

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

6.5 mm

MAX7304ETG+T

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVSON

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.62 V

.4 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N24

1

.85 mm

3.5 mm

e3

30

260

3.5 mm

DS28E17Q+

Analog Devices

INTERFACE CIRCUIT

Matte Tin (Sn) - annealed

1

e3

30

260

MAX3370EXK+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

5

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.8 V

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.5 V

1.6 V

.65 mm

85 Cel

3.3 V

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G5

1

1.1 mm

1.25 mm

e3

30

260

2 mm

MAX3373EEKA+

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

1.8 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

1.2 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

e4

30

260

2.9 mm

MAX3021EGP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

QUAD

S-XQCC-N20

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX14432FASE+T

Analog Devices

INTERFACE CIRCUIT

Matte Tin (Sn) - annealed

3

e3

30

260

MAX14932BASE+T

Analog Devices

INTERFACE CIRCUIT

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

SMALL OUTLINE

SOP16,.25

1.71 V

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Also has VDDB supply from 1.71V to 5.5V

e3

30

260

9.9 mm

MAX22291EASA+

Analog Devices

INTERFACE CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MAX3016EUP

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.2 V

8

BICMOS

1.8 V

3.6 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e0

6.5 mm

MAX22164EAEE/V+

Analog Devices

INTERFACE CIRCUIT

MAX3600GCTL+

Analog Devices

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

CHIP CARRIER

LCC40,.2SQ,16

Display Drivers

.4 mm

70 Cel

0 Cel

QUAD

S-PQCC-N40

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

MAX14430BASE+T

Analog Devices

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

3.3 V

SMALL OUTLINE

1.71 V

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

3

1.75 mm

3.9 mm

e3

30

260

9.9 mm

MAX14931BASE+T

Analog Devices

INTERFACE CIRCUIT

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

SMALL OUTLINE

SOP16,.25

1.71 V

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Also has VDDB supply from 1.71V to 5.5V

e3

30

260

9.9 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.