Analog Devices Other Function Interface ICs 2,370

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Interface Standard	No. of Digits/Characters	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX22165FAEE+	Analog Devices	INTERFACE CIRCUIT
MAX12930CASA+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	2	BICMOS	EIA-232; EIA-422; EIA-485		3.3 V			SMALL OUTLINE	SOP8,.25				1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm			e3	30	260	4.9 mm
MAX22166CAEE+/V	Analog Devices	INTERFACE CIRCUIT
MAX6956AAI+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES	5.5 V	1	CMOS		7-DIGIT	3.3 V		3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	7		Display Drivers	2.5 V	.65 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	COMMON-ANODE	e3	30	260	10.2 mm
MAX22445UAWE+	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm				30	260	10.3 mm
MAX22820CAWA+	Analog Devices	INTERFACE CIRCUIT
MAX14435VAWE+	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			1.8 V			SMALL OUTLINE					1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm			e3	30	260	10.3 mm
MAX3008EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	8	BICMOS				5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX22164BAEE/V+	Analog Devices	INTERFACE CIRCUIT
MAX4633MJA	Analog Devices
MAX3002ETP/GG8	Analog Devices	INTERFACE CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
MAX3289CUE+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					3 V	.65 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
MAX3374EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED		YES	5.5 V	2	BICMOS			3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX31910AUI+T	Analog Devices	Digital I/P Module	AUTOMOTIVE	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	36 V	1				24 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH					7 V	.65 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.1 mm	4.4 mm			e3	30	260	9.7 mm
MAX22444EAWE+	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm				30	260	10.3 mm
MAX3288CUE+T	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					3 V	.65 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3			5 mm
MAX14431EASE+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			3					e3	30	260
MAX14839GTC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY		YES	34 V	1	BICMOS			24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					4.75 V	.5 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm	3 mm			e3	30	260	3 mm
MAX20463AGTCA/V+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			1					e3	30	260
MAX22165BAEE+	Analog Devices	INTERFACE CIRCUIT
MAX7304AWA+T	Analog Devices	INTERFACE CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
MAX3007EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS				5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX22245CAWA+	Analog Devices	INTERFACE CIRCUIT
MAX22445EAWE+T	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			3					e3	30	260
MAX426CBA	Analog Devices
MAX14430EASE+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			3					e3	30	260
MAX22246BAWA+	Analog Devices	INTERFACE CIRCUIT
MAX22165EAEE+/V	Analog Devices	INTERFACE CIRCUIT
MAX3015EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX7306AUB+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20			Display Drivers	1.62 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX14839GWC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	34 V	1	BICMOS			24 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					4.75 V	.5 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.885 mm			e1	30	260	2.215 mm
MAX22420EASA+	Analog Devices	INTERFACE CIRCUIT
MAX14932BAWE+T	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm		Also has VDDB supply from 1.71V to 5.5V	e3	30	260	10.3 mm
MAX13004EEUE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25			Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16	1	1.2 mm	4.4 mm	Not Qualified					5 mm
MAX3024EUD	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	4	BICMOS			2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3019EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX22163BAEE+	Analog Devices	INTERFACE CIRCUIT
MAX13045EETD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,16		2.2 V	Other Interface ICs	1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14		.8 mm	3 mm	Not Qualified		e3			3 mm
MAX22163CAEE/V+	Analog Devices	INTERFACE CIRCUIT
MAX31914AUI+	Analog Devices	Digital I/P Module	AUTOMOTIVE	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	36 V	1	BICMOS			24 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH					7 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G38	1	1.1 mm	4.4 mm			e3	30	260	9.7 mm
MAX14936CAWE+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			1					e3	30	260
MAX3377EEUD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS			1.8 V	5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e3	30	260	5 mm
MAX14813EWX+T	Analog Devices	INTERFACE CIRCUIT																											TIN SILVER COPPER NICKEL			1					e2	30	260
MAX22192ARC+	Analog Devices	Digital I/P Module																																				NOT SPECIFIED	NOT SPECIFIED
MAX3736ETE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20			Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX22821BAWA+	Analog Devices	INTERFACE CIRCUIT
MAX13030EEBE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e1	30	260	2.02 mm
MAX3643ETG+G1N	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm			e3	30	260	4 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.