Analog Devices Other Function Interface ICs 2,370

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	No. of Digits/Characters	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX13016EBL-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	2	BICMOS			2.5 V	3.2 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20		1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3011EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	8	BICMOS				5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			1.65 V		1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX14430EASE+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V			SMALL OUTLINE					1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	3	1.75 mm	3.9 mm			e3	30	260	9.9 mm
MAX22290CASA+	Analog Devices	INTERFACE CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
MAX203E	Analog Devices
MAX22164FAEE+	Analog Devices	INTERFACE CIRCUIT
MAX13042EEBC+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			2.2 V		1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm			e1	30	260	2.12 mm
MAX20463AGTCB/V+	Analog Devices	INTERFACE CIRCUIT
MAX3646ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20			Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX22245EAWA+	Analog Devices	INTERFACE CIRCUIT
MAX3015EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX6956AAX/V	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES	5.5 V	1	CMOS	AEC-Q100	7-DIGIT	3.3 V		3/5	SMALL OUTLINE, SHRINK PITCH	SOP36,.4,32	7		Display Drivers	2.5 V	.8 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G36	1	2.64 mm	7.5 mm	Not Qualified	COMMON-ANODE				15.375 mm
MAX3022EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX14936DAWE+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			1					e3	30	260
MAX1741EUB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX14432EASE+T	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			3					e3	30	260
MAX3643ETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20			Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX22444MAWE+	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm				30	260	10.3 mm
MAX13003EEBE+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20			Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified					2.02 mm
MAX13047EEVB+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED		YES	3.6 V	2	BICMOS			1.8 V	5.5 V	1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.07,16		1.65 V	Other Interface ICs	1.1 V	.4 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N10	1	.55 mm	1.4 mm	Not Qualified		e4	30	260	1.8 mm
MAX14431VASE+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			3					e3	30	260
MAX22345CAAP+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			1					e3	30	260
MAX14430EAEE+T	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			1					e3	30	260
MAX31915AUI+	Analog Devices	Digital I/P Module	AUTOMOTIVE	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	36 V	1	BICMOS			24 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH					7 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G38	1	1.1 mm	4.4 mm			e3	30	260	9.7 mm
MAX22291CASA+	Analog Devices	INTERFACE CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
MAX3021EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX22505GTG+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			1					e3	30	260
MAX14436BAWE+	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			1.8 V			SMALL OUTLINE					1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm			e3	30	260	10.3 mm
MAX31914AUI+T	Analog Devices	Digital I/P Module	AUTOMOTIVE	GULL WING	38	HTSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	36 V	1	BICMOS			24 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH					7 V	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G38	1	1.1 mm	4.4 mm			e3	30	260	9.7 mm
MAX22166FAEE+/V	Analog Devices	INTERFACE CIRCUIT
MAX22446FAWE+	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm				30	260	10.3 mm
MAX3012EUP+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	8	BICMOS				5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX12930BASA+T	Analog Devices	DIGITAL ISOLATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V			SMALL OUTLINE	SOP8,.25				1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm			e3	30	260	4.9 mm
MAX253MJA+	Analog Devices	INTERFACE CIRCUIT	MILITARY	THROUGH-HOLE	8	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED		NO	5.5 V	1	CMOS	MIL-STD-883		5 V			IN-LINE					4.5 V	2.54 mm	125 Cel		-55 Cel	Matte Tin (Sn) - annealed	DUAL	R-GDIP-T8		5.08 mm	7.62 mm	Not Qualified		e3
MAX22163FAEE/V+	Analog Devices	INTERFACE CIRCUIT
MAX22163FAEE+	Analog Devices	INTERFACE CIRCUIT
MAX22199ATJ+	Analog Devices	INTERFACE CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
MAX14930AAWE+T	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm		Also has VDDB supply from 1.71V to 5.5V	e3	30	260	10.3 mm
MAX22444FAWE+	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm			e3	30	260	10.3 mm
MAX3391EEUD+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS			1.8 V	5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e3	30	260	5 mm
MAX3287CUE+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					3 V	.65 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
MAX13056EETI+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED		YES	3.6 V	1							CHIP CARRIER					2.2 V		85 Cel		-40 Cel		QUAD	R-XQCC-N28	1			Not Qualified
MAX14936CAWE+T	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			1					e3	30	260
MAX13014EKA+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	2	BICMOS			2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1		1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
MAX22445VAWE+	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm				30	260	10.3 mm
MAX14834ETB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	34 V	1	BICMOS			24 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE					4.75 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N10	1	.8 mm	3 mm			e3	30	260	3 mm
MAX253MJA	Analog Devices	INTERFACE CIRCUIT	MILITARY	THROUGH-HOLE	8	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED		NO	5.5 V	1	CMOS	MIL-STD-883		5 V		5	IN-LINE	DIP8,.3			Other Interface ICs	4.5 V	2.54 mm	125 Cel		-55 Cel	TIN LEAD	DUAL	R-GDIP-T8	1	5.08 mm	7.62 mm	Not Qualified		e0
MAX22517AWA+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			3					e3	30	260

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.