Analog Devices Other Function Interface ICs 2,370

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	No. of Digits/Characters	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX22166EAEE+/V	Analog Devices	INTERFACE CIRCUIT
MAX3017EGP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX13005EEUE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25			Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16	1	1.2 mm	4.4 mm	Not Qualified					5 mm
MAX14838GWC+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	34 V	1	BICMOS			24 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					7 V	.5 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.885 mm			e1	30	260	2.215 mm
MAX22345SAAP+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			1					e3	30	260
MAX3022EBP-T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3130CAI+	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V			SMALL OUTLINE, SHRINK PITCH					3 V	.65 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified		e3			10.2 mm
MAX14936BAWE+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V	5.5 V		SMALL OUTLINE			1.71 V		1.71 V	1.27 mm	125 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm			e3	30	260	10.3 mm
MAX22518AWA+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			3					e3	30	260
MAX22165CAEE+	Analog Devices	INTERFACE CIRCUIT
MAX3738ETG+TGD0	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm			e3	30	260	4 mm
MAX14431UASE+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			3					e3	30	260
MAX3372EETA	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED		YES	5.5 V	2	BICMOS			3.3 V	5.5 V	1.8/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8		.8 mm	3 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			3 mm
MAX14930EAWE+T	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm		Also has VDDB supply from 1.71V to 5.5V	e3	30	260	10.3 mm
MAX13001EEUE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25			Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified					5 mm
MAX1840EUB+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				1.8 V	5.5 V	1.8,1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		1.4 V	Other Interface ICs	1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
MAX14935EAWE+	Analog Devices	INTERFACE CIRCUIT																											Matte Tin (Sn) - annealed			1					e3	30	260
MAX22165BAEE/V+	Analog Devices	INTERFACE CIRCUIT
MAX22446EAWE+	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	3	2.65 mm	7.5 mm			e3	30	260	10.3 mm
MAX3002ETP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BICMOS				5.5 V	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified					5 mm
MAX22290FASA+	Analog Devices	INTERFACE CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
MAX7304EWA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16			Display Drivers	1.62 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25	1	.69 mm	2.09 mm	Not Qualified					2.09 mm
MAX22165EAEE+	Analog Devices	INTERFACE CIRCUIT
MAX13035EEBE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e1	30	260	2.02 mm
MAX3014EUP	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.2 V	8	BICMOS			1.8 V	3.6 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX13042EETD+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	SQUARE	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			2.2 V		1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-N14	1	.8 mm	3 mm			e3	30	260	3 mm
MAX13013EXT+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified		e4	30	260	2 mm
MAX22420FASA+	Analog Devices	INTERFACE CIRCUIT
MAX13031EETE+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		2.2 V	Other Interface ICs	1.62 V	.65 mm	85 Cel	3.3 V	-40 Cel		QUAD	S-XQCC-N16		.8 mm	4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
MAX3740ETG+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V			CHIP CARRIER, VERY THIN PROFILE					2.97 V	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX14930BAWE+T	Analog Devices	INTERFACE CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS			3.3 V			SMALL OUTLINE	SOP16,.4				1.71 V	1.27 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	2.65 mm	7.5 mm		Also has VDDB supply from 1.71V to 5.5V	e3	30	260	10.3 mm
MAX22821CAWA+	Analog Devices	INTERFACE CIRCUIT
MAX22246EAWA+	Analog Devices	INTERFACE CIRCUIT
MAX3982UTE+T	Analog Devices	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20				3 V	.5 mm	85 Cel		0 Cel		QUAD	S-XQCC-N16		.8 mm	3 mm						3 mm
MAX3982UTE+	Analog Devices	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20				3 V	.5 mm	85 Cel		0 Cel		QUAD	S-XQCC-N16	1	.8 mm	3 mm				30	260	3 mm
MAX22196ATJ+T	Analog Devices	INTERFACE CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
MAX22196ATJ+	Analog Devices	INTERFACE CIRCUIT																																				NOT SPECIFIED	NOT SPECIFIED
MAX3740AETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20			Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3261E/D	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	38	DIE	SQUARE	UNSPECIFIED		YES	5.25 V	1				5 V			UNCASED CHIP					4.75 V		85 Cel		-40 Cel	TIN LEAD	UPPER	S-XUUC-N38				Not Qualified		e0
MAX24287ETK+G1X	Analog Devices	INTERFACE CIRCUIT
MAX3967AETG+T	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20			Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADUM341E0WBRWZ-RL	Analog Devices	INTERFACE CIRCUIT
MAX17079GTL+W	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V			CHIP CARRIER					2.3 V		105 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1					e3	30	260
MAX3741HETE#G16-T	Analog Devices	INTERFACE CIRCUIT
MAX6956AAX/V+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES	5.5 V	1	CMOS	AEC-Q100	7-DIGIT	3.3 V		3/5	SMALL OUTLINE, SHRINK PITCH	SOP36,.4,32	7		Display Drivers	2.5 V	.8 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G36	1	2.64 mm	7.5 mm	Not Qualified	COMMON-ANODE	e3	30	260	15.375 mm
ADUM341E0BRWZ-RL	Analog Devices	INTERFACE CIRCUIT
MAX13036ATI+TGH7	Analog Devices	INTERFACE CIRCUIT
MAX20355EWO+	Analog Devices	INTERFACE CIRCUIT

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.