Maxim Integrated Other Function Interface ICs 545

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX7307ALB+	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	10	VSON	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V		1.8/3.3	SMALL OUTLINE, VERY THIN PROFILE	SOLCC10,.08,16		Display Drivers	1.62 V	.4 mm	125 Cel		-40 Cel	GOLD NICKEL	DUAL	S-XDSO-N10	1	.8 mm	2 mm	Not Qualified		e4	30	260	2 mm
MAX3288CUE-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR	3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3656E/D	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	31	DIE	RECTANGULAR	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V			UNCASED CHIP				3 V		85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N31	1			Not Qualified		e0
MAX24001TL+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.4 mm	95 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm	5 mm			e3	30	260	5 mm
MAX7370ATG+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.62 V		1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.85 mm	3.5 mm			e3	30	260	3.5 mm
MAX3634ETM	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified		e0		245	7 mm
MAX13001EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6	BICMOS	1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX3379EEUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V		1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs	1.65 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			5 mm
MAX13013EBT+T	Maxim Integrated		INDUSTRIAL	BALL	6	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			1.8/3.3	GRID ARRAY, FINE PITCH	BGA6,2X3,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1			Not Qualified		e1	30	260
MAX3009EUP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX1741EUB+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.25 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
MAX3371ELT+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.8 V	5.5 V		SMALL OUTLINE, VERY THIN PROFILE		2.5 V		1.6 V	.5 mm	85 Cel	3.3 V	-40 Cel	GOLD NICKEL	DUAL	R-PDSO-N6	1	.8 mm	1 mm			e4	30	260	1.5 mm
MAX3869ETJ+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3.14 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
MAX3377EEUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V		1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs	1.65 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			5 mm
MAX14595EWA+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.2 V	5.5 V	1.2/5,1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA8,2X4,16	1.65 V	Other Interface ICs	.9 V	.4 mm	85 Cel	3 V	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B8	1	.69 mm	.837 mm	Not Qualified		e2	30	260	1.627 mm
MAX7301ATL+GH7	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	125 Cel		-40 Cel		QUAD	S-XQCC-N40	1	.8 mm	6 mm						6 mm
MAX3131EAI-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified		e0			10.2 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.