Maxim Integrated Other Function Interface ICs 545

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	No. of Digits/Characters	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3299CUE+T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					3 V	.65 mm	70 Cel		0 Cel	TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3			5 mm
MAX13174EEAG+	Maxim Integrated	INTERFACE CIRCUIT																												MATTE TIN			1					e3	30	260
MAX3391EEBC	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	12	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			1.8 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH					1.2 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.54 mm			e1	30	260	2.02 mm
MAX3996CGP-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	20	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20			Display Drivers	3 V	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-CQCC-N20	1	1 mm	4 mm	Not Qualified		e0		245	4 mm
MAX3273EGG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20			Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	1 mm	4 mm	Not Qualified		e0			4 mm
MAX13174ECAG+T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			5 V			-5 V	SMALL OUTLINE, SHRINK PITCH					4.5 V	.65 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G24	1	1.99 mm	5.29 mm			e3	30	260	8.2 mm
MAX3000EEBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS				5.5 V	1.8/5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3669E/D	Maxim Integrated	INTERFACE CIRCUIT		NO LEAD	48	DIE	RECTANGULAR	UNSPECIFIED		YES	5.5 V	1				3.3 V				UNCASED CHIP					3.14 V					TIN LEAD	UPPER	R-XUUC-N48	1			Not Qualified		e0
MAX3740ETG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V				CHIP CARRIER, VERY THIN PROFILE					2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX31953AUM+T	Maxim Integrated	Digital I/P Module																																					30	260
MAX6956AAI-T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	SEGMENT	YES	5.5 V	1	CMOS		7-DIGIT	3.3 V		3/5		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	7		Display Drivers	2.5 V	.65 mm	125 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	COMMON-ANODE	e0			10.2 mm
MAX3297CUE-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED		YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25			Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX17079GTL+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					2.3 V	.5 mm	105 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified		e3	30	260	6 mm
MAX17120ETJ+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					2.2 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	1	.8 mm	5 mm			e4	30	260	5 mm
MAX3377EEBC	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	FBGA	RECTANGULAR	PLASTIC/EPOXY		YES			BICMOS					1.8/5		GRID ARRAY, FINE PITCH	BGA12,3X4,20			Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1			Not Qualified		e0
MAX3377EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS			3.3 V	5.5 V	1.8/5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX3869EGJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				3.3 V		3.3/5		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20			Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	1 mm	5 mm	Not Qualified		e0		245	5 mm
MAX3130EAI	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V				SMALL OUTLINE, SHRINK PITCH					3 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified		e0			10.2 mm
MAX3967AE/D	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	22	DIE	RECTANGULAR	UNSPECIFIED		YES	5.5 V	1	BIPOLAR			3.3 V				UNCASED CHIP					2.97 V		85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N22				Not Qualified		e0
MAX7370EWA+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			1.62 V		1.62 V	.4 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B25	1	.69 mm	2.09 mm			e2	30	260	2.09 mm
MAX3865EGJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	3.6 V	1	BIPOLAR			3.3 V		3.3/5		CHIP CARRIER, VERY THIN PROFILE	LCC32,.2SQ,20			Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-CQCC-N32	1	1 mm	5 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e0			5 mm
MAX3343EEUD+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				5 V	3.6 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			1.8 V		4 V	.65 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e3			5 mm
MAX3634ETM+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified		e3	30	260	7 mm
MAX3370EXK-TG077	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			1.8 V	5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			2.5 V		1.6 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G5	1	1.1 mm	1.25 mm			e0			2 mm
MAX13014EBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	2	BICMOS			2.5 V	3.2 V	1.8/3.3		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20		1.2 V	Other Interface ICs	1.65 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified		e0		245	1.52 mm
MAX3130CAI	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V				SMALL OUTLINE, SHRINK PITCH					3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified		e0	20	240	10.2 mm
MAX13001EEUE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	CMOS			3.3 V		1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25			Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G16	1	1.1 mm	5 mm	Not Qualified		e0			5 mm
MAX3600AGTL/V+T	Maxim Integrated	INTERFACE CIRCUIT												AEC-Q100																MATTE TIN			1					e3	30	260
MAX13037ATX+T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED		YES	26 V	1	BICMOS			14 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					6 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N36	1	.8 mm	6 mm			e3	30	260	6 mm
MAX17119ETI+TCH9	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED		YES	38 V	1	BICMOS			30 V			-6.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					12 V	.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.8 mm	4 mm			e3	30	260	4 mm
MAX3010EUP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS				5.5 V	1.8/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3766E/D	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED		YES		1								UNCASED CHIP							85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N	1			Not Qualified		e0
MAX3967E/D	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	22	DIE	RECTANGULAR	UNSPECIFIED		YES	5.5 V	1	BIPOLAR			3.3 V				UNCASED CHIP					2.97 V		85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N22				Not Qualified		e0
MAX3008EUP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS				5.5 V	1.8/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3741ETE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20			Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e0		245	3 mm
MAX13000EEUE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	6	BICMOS			1.65 V		1.8/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25			Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3663ETG+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3.14 V	.5 mm	85 Cel		-40 Cel	TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3			4 mm
MAX3376EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	2	BICMOS			3.3 V	5.5 V	1.8/5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX3786UTJ+TG069	Maxim Integrated	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.5 mm	85 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm			e3	30	260	5 mm
MAX3600ACTL+T	Maxim Integrated	INTERFACE CIRCUIT																												MATTE TIN			1					e3	30	260
MAX14834EWL+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	34 V	1	BICMOS			24 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH					4.75 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B9	1	.69 mm	1.568 mm			e2	30	260	2 mm
MAX24002TL+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.4 mm	95 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm	5 mm			e3	30	260	5 mm
MAX1840EUB	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				1.8 V	5.5 V	1.8,1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		1.4 V	Other Interface ICs	1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0		245	3 mm
MAX17108ETI+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED		YES	20 V	1	BICMOS			16 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					6 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.8 mm	5 mm			e3	30	260	5 mm
MAX13043EETD+	Maxim Integrated		INDUSTRIAL	NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY		YES			BICMOS					2.5/3.3		SMALL OUTLINE	SOLCC14,.12,16			Other Interface ICs		.4 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-N14	1			Not Qualified		e3	30	260
MAX3736E/D	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V				UNCASED CHIP					2.97 V		85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N20	1			Not Qualified		e0
MAX3009EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS				5.5 V	1.8/5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX14569EEE+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			3 V	5.5 V			SMALL OUTLINE, SHRINK PITCH			2.3 V		1.6 V	.635 mm	85 Cel	3.6 V	-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.75 mm	3.89 mm			e3	30	260	4.9 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.