Maxim Integrated Other Function Interface ICs 545

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3374EEKA	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.8 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH				1.2 V	.65 mm	85 Cel		-40 Cel	Nickel/Gold/Palladium (Ni/Au/Pd)	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm				30	260	2.9 mm
MAX7300ATI+T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	125 Cel		-40 Cel		QUAD	S-XQCC-N28		.8 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX253C/D	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	7	DIE	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	CMOS	5 V		5	UNCASED CHIP	DIE OR CHIP		Other Interface ICs	4.5 V		70 Cel		0 Cel	TIN LEAD	UPPER	R-XUUC-N	1			Not Qualified		e0
MAX7300AGL+	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1	CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				2.5 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40		.85 mm	6 mm	Not Qualified		e3			6 mm
MAX13058EEWG+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	24	BGA	UNSPECIFIED	UNSPECIFIED	YES	3.6 V	1					GRID ARRAY				2.2 V		85 Cel		-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	X-XBGA-B24	1			Not Qualified		e2	30	260
MAX13014EKA-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	2	BICMOS	2.5 V	3.2 V	1.8/3.3	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	1.2 V	Other Interface ICs	1.65 V	.65 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		e0		245	2.9 mm
MAX17079GTL+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BICMOS	3.3 V			CHIP CARRIER				2.3 V		105 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1					e3	30	260
MAX3863ETJ+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3.15 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
MAX3001EEWP+T	Maxim Integrated	INTERFACE CIRCUIT																							TIN SILVER COPPER			1					e1	30	260
MAX3393EEBC	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES			BICMOS			1.8/5	GRID ARRAY, FINE PITCH	BGA12,3X4,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1			Not Qualified		e0
MAX3003EUP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX6618AUB+TG11	Maxim Integrated	INTERFACE CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				3 V	.5 mm	120 Cel		-20 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm			e3	30	260	3 mm
MAX3130EAI+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		3.3 V			SMALL OUTLINE, SHRINK PITCH				3 V	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified		e3			10.2 mm
MAX3783UCM-TD	Maxim Integrated	INTERFACE CIRCUIT	OTHER	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BIPOLAR	3.3 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH				3 V	.5 mm	85 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified		e0			7 mm
MAX3296CHJ-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	28	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3 V	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G28	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3011EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3371ELT+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5,3/5	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	1.6 V	Other Interface ICs	2.5 V	.5 mm	85 Cel		-40 Cel	Gold/Nickel (Au/Ni)	DUAL	R-PDSO-N6	1	.8 mm	1 mm	Not Qualified		e4	30	260	1.5 mm
MAX3299CUE-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR	3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX7304ATG+	Maxim Integrated	INTERFACE CIRCUIT																							MATTE TIN			1					e3	30	260
MAX3003EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3298CUE	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR	3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3005EUP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS		5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3735E/D	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	RECTANGULAR	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V			UNCASED CHIP				2.97 V		85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N29				Not Qualified		e0
MAX3340EEBE	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		5 V	3.6 V	5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	1.8 V	Other Interface ICs	4 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0		245	2.02 mm
MAX13004EEUE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS	3.3 V		1.8/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Other Interface ICs	1.5 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G16	1	1.1 mm	5 mm	Not Qualified		e0			5 mm
MAX13003EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6	BICMOS	1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX3006EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX14595EWA+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	BICMOS	1.2 V	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V		.9 V	.4 mm	85 Cel	3 V	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B8	1	.69 mm	.837 mm			e2	30	260	1.627 mm
MAX1740EUB	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		3 V	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		1.425 V		2.25 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0		245	3 mm
MAX3286CHJ	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	28	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3 V	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G28	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3261ECJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1	BIPOLAR	5 V		5	FLATPACK, THIN PROFILE, FINE PITCH	QFP32,.35SQ,32		Display Drivers	4.75 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3376EEBL	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	FBGA	SQUARE	PLASTIC/EPOXY	YES			BICMOS			1.8/5	GRID ARRAY, FINE PITCH	BGA8,3X3,20		Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1			Not Qualified		e0
MAX3667ECJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32		Display Drivers	3.135 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e0			7 mm
MAX3261CCJ-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1	BIPOLAR	5 V		5	FLATPACK, THIN PROFILE, FINE PITCH	QFP32,.35SQ,32		Display Drivers	4.75 V	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3008EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3869EGJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	1		3.3 V		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	1 mm	5 mm	Not Qualified		e0			5 mm
MAX3343EEUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		5 V	3.6 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	1.8 V	Other Interface ICs	4 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX24002TL+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.4 mm	95 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm	5 mm			e3	30	260	5 mm
MAX3392EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	4	BICMOS	3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			2.02 mm
MAX3298CUE-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	UNSPECIFIED	YES	5.5 V	1	BIPOLAR	3.3 V		3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25		Display Drivers	3 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	R-XDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX3667ECJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32		Display Drivers	3.135 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e0			7 mm
MAX3646ETG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1	BIPOLAR	3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3005EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	BICMOS			1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX31953AUM+	Maxim Integrated	Digital I/P Module																																30	260
MAX31912AUI+	Maxim Integrated	Digital I/P Module	AUTOMOTIVE	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	36 V	1		24 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH				7 V	.65 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.1 mm	4.4 mm			e3	30	260	9.7 mm
MAX13032EEBE+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.2 V	1	BICMOS	1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20	2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2 mm	Not Qualified		e1	30	260	2 mm
MAX3668EHJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	BIPOLAR	3.3 V		3.3/5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3261ECJ+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1		5 V			FLATPACK, THIN PROFILE, FINE PITCH				4.75 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e3			5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.