Maxim Integrated Other Function Interface ICs 545

Reset All
Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX1841EUB

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

1.8 V

5.5 V

1.8,1.8/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

1.4 V

Other Interface ICs

1.7 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

245

3 mm

MAX7300ANI

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

1

CMOS

IN-LINE

2.5 V

2.54 mm

125 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

1

4.572 mm

7.62 mm

Not Qualified

e0

245

34.795 mm

MAX31912AUI+T

Maxim Integrated

Digital I/P Module

AUTOMOTIVE

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

36 V

1

24 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

7 V

.65 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G28

1

1.1 mm

4.4 mm

e3

30

260

9.7 mm

MAX3343EEUD+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

5 V

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.8 V

4 V

.65 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

DUAL

R-PDSO-G14

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX3273ETG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX3391EEUD-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

Other Interface ICs

1.65 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G14

1

1.1 mm

4.4 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

5 mm

MAX3786UTJ+

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX13005EEUE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

1.8/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Interface ICs

1.5 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G16

1

1.1 mm

5 mm

Not Qualified

e0

5 mm

MAX13047EETB+T

Maxim Integrated

INTERFACE CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MAX3982UTE

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

245

3 mm

MAX3371ELT-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

3.3 V

5.5 V

1.8/5,3/5

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.06,20

1.6 V

Other Interface ICs

2.5 V

.5 mm

85 Cel

1.8 V

-40 Cel

GOLD

DUAL

R-PDSO-N6

1

.8 mm

1 mm

Not Qualified

BIDIRECTIONAL LEVEL SHIFTER

e4

1.5 mm

MAX3669EHJ

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

Display Drivers

3.14 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

MAX3130CAI-T

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G28

1

1.99 mm

5.29 mm

Not Qualified

e0

10.2 mm

MAX3867ECM-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

3.14 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G48

1

1.6 mm

7 mm

Not Qualified

e0

7 mm

MAX3600AGTL/V+

Maxim Integrated

INTERFACE CIRCUIT

AEC-Q100

MATTE TIN

1

e3

30

260

MAX3982UTE-T

Maxim Integrated

INTERFACE CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3863EGJ-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Display Drivers

3.15 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.9 mm

5 mm

Not Qualified

e0

245

5 mm

MAX3010EBP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

.67 mm

2.03 mm

Not Qualified

e0

2.54 mm

MAX3372EEBL-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA9,3X3,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B9

1

.67 mm

1.52 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

1.52 mm

MAX3967ETG

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e0

4 mm

MAX3289CUE

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Display Drivers

3 V

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-XDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX3737EGJ-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX3008EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

8

BICMOS

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-XBGA-B20

1

.67 mm

Not Qualified

e0

MAX3850EGJ-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

VQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

3.6 V

1

BIPOLAR

3.3 V

CHIP CARRIER, VERY THIN PROFILE

3 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-CQCC-N32

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX13043EETD+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

14

HVSON

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12,16

2.2 V

Other Interface ICs

1.62 V

.4 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

DUAL

S-PDSO-N14

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3377EEUD-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

Other Interface ICs

1.65 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G14

1

1.1 mm

4.4 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

5 mm

MAX3737ETJ-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX6956ANI+

Maxim Integrated

INTERFACE CIRCUIT

AUTOMOTIVE

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

SEGMENT

NO

5.5 V

1

CMOS

7-DIGIT

3.3 V

3/5

IN-LINE

DIP28,.3

7

Display Drivers

2.5 V

2.54 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T28

1

4.572 mm

7.62 mm

Not Qualified

COMMON-ANODE

e3

34.795 mm

MAX3373EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B8

Not Qualified

MAX3967AETG

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

.8 mm

4 mm

Not Qualified

e0

4 mm

MAX3372EEKA-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

BICMOS

3.3 V

5.5 V

1.8/5

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP8,.1

1.65 V

Other Interface ICs

1.2 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.9 mm

MAX3001EEBP

Maxim Integrated

INDUSTRIAL

BALL

20

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA20,4X5,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B20

1

Not Qualified

e0

MAX3286C/D

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

28

DIE

RECTANGULAR

UNSPECIFIED

YES

5.5 V

1

3.3 V

UNCASED CHIP

3 V

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N28

1

Not Qualified

e0

MAX13033EEBE+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.2 V

1

BICMOS

1.8 V

3.6 V

2.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

2.2 V

Other Interface ICs

1.62 V

.5 mm

85 Cel

3.3 V

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B16

.67 mm

2.02 mm

Not Qualified

e3

2.02 mm

MAX3600ACTL+

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

CHIP CARRIER

LCC40,.2SQ,16

Display Drivers

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-N40

1

Not Qualified

e3

30

260

MAX3288CUE+

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

70 Cel

0 Cel

TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX13055EEWG+

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

24

BGA

UNSPECIFIED

UNSPECIFIED

YES

3.6 V

1

GRID ARRAY

2.2 V

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

X-XBGA-B24

1

Not Qualified

e2

30

260

MAX3013EGP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

8

BICMOS

3.3 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

Other Interface ICs

1.65 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N20

1

1 mm

5 mm

Not Qualified

e0

5 mm

MAX3009EUP-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

8

BICMOS

1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Other Interface ICs

1.2 V

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e0

6.5 mm

MAX13174ECAG+

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

BICMOS

5 V

+-5

-5 V

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Bus Terminators

4.5 V

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.99 mm

5.29 mm

Not Qualified

e3

30

260

8.2 mm

MAX13014EKA

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

BICMOS

2.5 V

3.2 V

1.8/3.3

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP8,.1

1.2 V

Other Interface ICs

1.65 V

.65 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

Not Qualified

e0

245

2.9 mm

MAX3340EEUD-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

5 V

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.8 V

4 V

.65 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

DUAL

R-PDSO-G14

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX3392EEBC

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

Not Qualified

e0

MAX3967ETG-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e0

4 mm

MAX3023EBC+T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

e1

30

260

2.02 mm

MAX3736ETE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.63 V

1

BIPOLAR

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Display Drivers

2.97 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3263C/D

Maxim Integrated

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

5.25 V

1

5 V

UNCASED CHIP

4.75 V

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N

Not Qualified

e0

MAX13047EETA+T

Maxim Integrated

INTERFACE CIRCUIT

1

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.