Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Display Mode | Surface Mount | Maximum Supply Voltage | Maximum Output Current | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Built-in Protections | Interface Standard | Maximum Supply Current | No. of Digits/Characters | Output Latch/Register | Nominal Supply Voltage | Maximum Supply Voltage-1 | Turn-on Time | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | No. of Segments | Minimum Supply Voltage-1 | No. of Backplanes | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Driver No. of Bits | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Nominal Output Peak Current Limit | Width | Turn-off Time | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Maximum Receive Delay |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
10 |
HTSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
1.8 V |
5.5 V |
1.8,1.8/5 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
1.4 V |
Other Interface ICs |
1.7 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
245 |
3 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
1 |
CMOS |
IN-LINE |
2.5 V |
2.54 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
e0 |
245 |
34.795 mm |
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|
Maxim Integrated |
Digital I/P Module |
AUTOMOTIVE |
GULL WING |
28 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
36 V |
1 |
24 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
7 V |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
e3 |
30 |
260 |
9.7 mm |
||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.8 V |
4 V |
.65 mm |
85 Cel |
3.3 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
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|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
3.14 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
3.3 V |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
Other Interface ICs |
1.65 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
5 mm |
|||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
3.3 V |
1.8/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Interface ICs |
1.5 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G16 |
1 |
1.1 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
245 |
3 mm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
3.3 V |
5.5 V |
1.8/5,3/5 |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.06,20 |
1.6 V |
Other Interface ICs |
2.5 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
GOLD |
DUAL |
R-PDSO-N6 |
1 |
.8 mm |
1 mm |
Not Qualified |
BIDIRECTIONAL LEVEL SHIFTER |
e4 |
1.5 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
3.3/5 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP32,.28SQ |
Display Drivers |
3.14 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
|||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
3 V |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e0 |
10.2 mm |
||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3.14 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AEC-Q100 |
MATTE TIN |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Display Drivers |
3.15 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
1 |
.9 mm |
5 mm |
Not Qualified |
e0 |
245 |
5 mm |
|||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B20 |
1 |
.67 mm |
2.03 mm |
Not Qualified |
e0 |
2.54 mm |
|||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
9 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA9,3X3,20 |
1.65 V |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B9 |
1 |
.67 mm |
1.52 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
1.52 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
HTSSOP |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
BIPOLAR |
3.3 V |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Display Drivers |
3 V |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-XDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e0 |
5 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
8 |
BICMOS |
1.8/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA20,4X5,20 |
Other Interface ICs |
1.2 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-XBGA-B20 |
1 |
.67 mm |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
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|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
14 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.2 V |
1 |
BICMOS |
1.8 V |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,16 |
2.2 V |
Other Interface ICs |
1.62 V |
.4 mm |
85 Cel |
3.3 V |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N14 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
3.3 V |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
Other Interface ICs |
1.65 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
5 mm |
|||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
SEGMENT |
NO |
5.5 V |
1 |
CMOS |
7-DIGIT |
3.3 V |
3/5 |
IN-LINE |
DIP28,.3 |
7 |
Display Drivers |
2.5 V |
2.54 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T28 |
1 |
4.572 mm |
7.62 mm |
Not Qualified |
COMMON-ANODE |
e3 |
34.795 mm |
|||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
8 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA8,3X3,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B8 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
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Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
BICMOS |
3.3 V |
5.5 V |
1.8/5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
1.65 V |
Other Interface ICs |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION |
e0 |
2.9 mm |
||||||||||||||||||||||||||
Maxim Integrated |
INDUSTRIAL |
BALL |
20 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA20,4X5,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B20 |
1 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
28 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
1 |
3.3 V |
UNCASED CHIP |
3 V |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N28 |
1 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.2 V |
1 |
BICMOS |
1.8 V |
3.6 V |
2.5/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA16,4X4,20 |
2.2 V |
Other Interface ICs |
1.62 V |
.5 mm |
85 Cel |
3.3 V |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B16 |
.67 mm |
2.02 mm |
Not Qualified |
e3 |
2.02 mm |
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|
Maxim Integrated |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.3 V |
3.3 |
CHIP CARRIER |
LCC40,.2SQ,16 |
Display Drivers |
.4 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-N40 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
3 V |
.65 mm |
70 Cel |
0 Cel |
TIN |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
24 |
BGA |
UNSPECIFIED |
UNSPECIFIED |
YES |
3.6 V |
1 |
GRID ARRAY |
2.2 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
X-XBGA-B24 |
1 |
Not Qualified |
e2 |
30 |
260 |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
8 |
BICMOS |
3.3 V |
1.8/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.20SQ,25 |
Other Interface ICs |
1.65 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N20 |
1 |
1 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
BICMOS |
1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
Other Interface ICs |
1.2 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e0 |
6.5 mm |
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|
Maxim Integrated |
INTERFACE CIRCUIT |
COMMERCIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
BICMOS |
5 V |
+-5 |
-5 V |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
Bus Terminators |
4.5 V |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e3 |
30 |
260 |
8.2 mm |
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Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
1.2 V |
Other Interface ICs |
1.65 V |
.65 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e0 |
245 |
2.9 mm |
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Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
5 V |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.8 V |
4 V |
.65 mm |
85 Cel |
3.3 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e0 |
5 mm |
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Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1.8/5 |
GRID ARRAY, FINE PITCH |
BGA12,3X4,20 |
Other Interface ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B12 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
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|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
4 |
BICMOS |
2.5 V |
3.2 V |
1.8/3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,20 |
1.2 V |
Other Interface ICs |
1.65 V |
.5 mm |
85 Cel |
1.8 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
1 |
.67 mm |
1.54 mm |
Not Qualified |
e1 |
30 |
260 |
2.02 mm |
||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
1 |
BIPOLAR |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Display Drivers |
2.97 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
5.25 V |
1 |
5 V |
UNCASED CHIP |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N |
Not Qualified |
e0 |
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|
Maxim Integrated |
INTERFACE CIRCUIT |
1 |
Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.
Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:
1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.
2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.
3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.
Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.