Maxim Integrated Other Function Interface ICs 545

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	No. of Digits/Characters	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS1861B	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	BALL	16	LBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1							GRID ARRAY, LOW PROFILE					2.85 V	1 mm	70 Cel		0 Cel		BOTTOM	S-PBGA-B16	1	1.5 mm	4 mm	Not Qualified					4 mm
MAX8521EBX	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					3 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B36	1	.67 mm	3.06 mm	Not Qualified		e0			3.06 mm
MAX9969BDCCQ-T	Maxim Integrated		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY		YES			BIPOLAR					-5.25,9.75	FLATPACK	TQFP100,.63SQ			Other Interface ICs		.5 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100				Not Qualified		e0
MAX8520ETP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BICMOS			5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified		e0			5 mm
MAX8521ETP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BICMOS			5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified		e0			5 mm
MAX8520ETP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BICMOS			5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified		e0			5 mm
MAX9483CTE	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V		5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25			Display Drivers	4.5 V	.65 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	4 mm	Not Qualified		e0			4 mm
DS1861B+	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	BALL	16	LBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1							GRID ARRAY, LOW PROFILE					2.85 V	1 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	3	1.5 mm	4 mm	Not Qualified		e1			4 mm
MAX8685CETA+	Maxim Integrated	INTERFACE CIRCUIT																											MATTE TIN			1					e3	30	260
MAX8685FETD+	Maxim Integrated	INTERFACE CIRCUIT																											MATTE TIN			1					e3	30	260
MAX7360EWX+T	Maxim Integrated	INTERFACE CIRCUIT		BALL	36	VFBGA	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6x6,16				1.62 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-XBGA-B36		.69 mm	2.57 mm						2.57 mm
MAX3869EHJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V		3.3/5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ			Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX7300AGL-T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	CMOS						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					2.5 V	.5 mm	125 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N40		.85 mm	6 mm	Not Qualified		e0			6 mm
MAX3005EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS				5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3004EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS				5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX13038ATX+T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED		YES	26 V	1	BICMOS			14 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					6 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N36	1	.8 mm	6 mm			e3	30	260	6 mm
MAX14591EWA+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			1.2 V	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			1.65 V		.9 V	.4 mm	85 Cel	3 V	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B8	1	.69 mm	.837 mm			e2	30	260	1.627 mm
MAX3378EEBC	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	12	VFLGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS			1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					1.2 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B12	1	.69 mm	1.54 mm			e1	30	260	2.02 mm
MAX3001EEUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS				5.5 V	1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		1.65 V	Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3375EEBL-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY		YES	5.5 V	2	BICMOS			3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA9,3X3,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B9	1	.67 mm	1.52 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			1.52 mm
MAX13002EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	6	BICMOS			1.65 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20			Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0			2.02 mm
MAX3340EEUD+T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				5 V	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			1.8 V		4 V	.65 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e3			5 mm
MAX13032EEBE+	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.2 V	1	BICMOS			1.8 V	3.6 V	2.5/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		2.2 V	Other Interface ICs	1.62 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e1	30	260	2.02 mm
MAX3010EBP	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	UNSPECIFIED		YES	5.5 V	8	BICMOS					1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20			Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B20	1	.67 mm		Not Qualified		e0
MAX3390EEUD-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS			3.3 V		1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25			Other Interface ICs	1.65 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			5 mm
MAX3975UBA-T	Maxim Integrated	INTERFACE CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.63 V	1	BIPOLAR			3.3 V		3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,20			Display Drivers	2.97 V	.5 mm	85 Cel		0 Cel	TIN LEAD	BOTTOM	S-PBGA-B25	1	.67 mm	2.54 mm	Not Qualified		e0			2.54 mm
MAX3372EEBL	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	FBGA	SQUARE	PLASTIC/EPOXY		YES			BICMOS					1.8/5	GRID ARRAY, FINE PITCH	BGA8,3X3,20			Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1			Not Qualified		e0
MAX3296CGI-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20			Display Drivers	3 V	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified		e0			5 mm
MAX3795ETG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1	BIPOLAR			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20			Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX3867ECM	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20			Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e0			7 mm
MAX7302AEE+T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V			SMALL OUTLINE, SHRINK PITCH					1.62 V	.635 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16		1.75 mm	3.9 mm			e3			4.89 mm
MAX3803UBP-T	Maxim Integrated	INTERFACE CIRCUIT	OTHER	BALL	14	VFBGA	RECTANGULAR	UNSPECIFIED		YES	3.6 V	1				3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH					3 V	.5 mm	85 Cel		0 Cel	TIN LEAD	BOTTOM	R-XBGA-B14	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX7307AUB+T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1	BICMOS			3.3 V		1.8/3.3	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20			Display Drivers	1.62 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
MAX3340EEUD	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1				5 V	3.6 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		1.8 V	Other Interface ICs	4 V	.65 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e0			5 mm
MAX6956ATL/V+T	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	SEGMENT	YES	5.5 V	1	CMOS	AEC-Q100	7-DIGIT	3.3 V		3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	7		Display Drivers	2.5 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified	COMMON-ANODE	e3	30	260	6 mm
MAX3986UTU+	Maxim Integrated	INTERFACE CIRCUIT	OTHER	NO LEAD	38	HVQCCN	RECTANGULAR	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.5 mm	85 Cel		0 Cel	MATTE TIN	QUAD	R-XQCC-N38	1	.8 mm	5 mm			e3	30	260	7 mm
MAX3600CTL+T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY		YES						3.3 V		3.3	CHIP CARRIER	LCC40,.2SQ,16			Display Drivers		.4 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQCC-N40	1			Not Qualified		e3	30	260
MAX6956ATL+TGH7	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1	CMOS			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					2.5 V	.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm	6 mm			e3	30	260	6 mm
MAX3023EBC+	Maxim Integrated	INTERFACE CIRCUIT																											TIN SILVER COPPER			1					e1	30	260
MAX3786UTJ-T	Maxim Integrated	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1	BICMOS			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					3 V	.5 mm	85 Cel		0 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e0			5 mm
MAX3023EBC+TG47	Maxim Integrated	INTERFACE CIRCUIT																											TIN SILVER COPPER			1					e1	30	260
MAX3286CHJ-T	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	28	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1	BIPOLAR			3.3 V		3.3/5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ			Display Drivers	3 V	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G28	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3601CWO+	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.9 V	1				1.8 V		1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,20			Display Drivers	1.7 V	.5 mm	70 Cel		0 Cel		BOTTOM	R-PBGA-B42		.69 mm	3.395 mm	Not Qualified	IT ALSO REQUIRES 3.3V				3.515 mm
MAX3006EBP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	1	BICMOS				5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA20,4X5,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B20	1	.67 mm	2.03 mm	Not Qualified		e0			2.54 mm
MAX3932E/W	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	37	DIE	RECTANGULAR	UNSPECIFIED		YES	5.5 V	1	BIPOLAR			5 V		5	UNCASED CHIP	WAFER			Display Drivers	4.75 V		85 Cel		-40 Cel	TIN LEAD	UPPER	R-XUUC-N37				Not Qualified		e0
MAX3261ECJ-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V	1				5 V			FLATPACK, THIN PROFILE, FINE PITCH					4.75 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX3010EUP-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	8	BICMOS					1.8/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25			Other Interface ICs	1.2 V	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0			6.5 mm
MAX3393EEBC-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	4	BICMOS			3.3 V	5.5 V	1.8/5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20		1.65 V	Other Interface ICs	1.2 V	.5 mm	85 Cel	3.3 V	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION	e0			2.02 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.