NXP Semiconductors Other Function Interface ICs 918

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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	Technology	Screening Level	Interface Standard	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCA9571GUX	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS				2.2 V			CHIP CARRIER, VERY THIN PROFILE				1.1 V	.4 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N12	1	.5 mm	1.7 mm			e4		260	2 mm
NTS0308EPWJ	NXP Semiconductors	INTERFACE CIRCUIT																													1							260
PTN5110NHQZ	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,16			2.7 V	.4 mm	85 Cel		-40 Cel	TIN	QUAD	S-PQCC-N16	1	.4 mm	2.6 mm			e3	30	260	2.6 mm
NTS0102GD-Q100H	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				AEC-Q100					1.8/3.3,2.5/5	SMALL OUTLINE	SOLCC8,.11,20		Other Interface ICs		.5 mm	125 Cel		-40 Cel		DUAL	R-PDSO-N8	1			Not Qualified				260
PCA9509GM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS				5 V		1/4.5,3.3/5	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20		Line Driver or Receivers	3 V	.55 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N8	1	.5 mm	1.6 mm	Not Qualified		e4	30	260	1.6 mm
GTL2005PW,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4					3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs	3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	5 mm
PCA9600D,118	NXP Semiconductors	BUS BUFFERS	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	15 V	1				7.3 mA	5 V		2.5/15	SMALL OUTLINE	SOP8,.25		Other Interface ICs	2.5 V	1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified			30	260	4.9 mm
TJA1080ATS/2/T,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	1		AEC-Q100			5 V			SMALL OUTLINE, SHRINK PITCH				4.75 V	.65 mm					DUAL	R-PDSO-G20	1	2 mm	5.3 mm				30	260	7.2 mm
PCA9701PW,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.5 V	.65 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G24	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
PCA9509DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS				5 V		1/4.5,3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Line Driver or Receivers	3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9513ADP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
NTP53321G0JHKZ	NXP Semiconductors																														1							260
UJA1169TK/3Z	NXP Semiconductors	INTERFACE CIRCUIT																										NICKEL PALLADIUM GOLD SILVER			1					e4	30	260
PCA9509ADP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2 V	1					1.1 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.8 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm				30	260	3 mm
PCA9306DC,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1					1.8 V	5.5 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	2.3 V	Other Interface ICs	1.1 V	.5 mm	85 Cel	3.3 V	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	1 mm	2 mm	Not Qualified		e4	30	260	2.3 mm
UJA1169TK/F/3Z	NXP Semiconductors	INTERFACE CIRCUIT																										NICKEL PALLADIUM GOLD SILVER			1					e4	30	260
GTL2003PW,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1					3.3 V	2.64 V	2.5,3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	2.36 V	Other Interface ICs	3 V	.65 mm	85 Cel	2.5 V	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
GTL2005PW,112	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4					3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs	3 V	.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	5 mm
PCA9306DP1	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES		2								SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16		Other Interface ICs	1 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9511ADP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				6 mA	3.3 V		3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9701PW	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.5 V	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
GTL2002DP/Q900,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		AEC-Q100				5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	0 V		0 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm		Also required VDREF 0 to 5.5V			260	3 mm
GTL2002DP/G,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					1 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	0 V		0 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm						3 mm
PCA9548APW-T	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	8			GENERAL PURPOSE		2.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25			2.3 V	.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G24		1.1 mm	4.4 mm		ALSO OPERATES AT SUPPLY 4.5V TO 5.5V	e4			7.8 mm
GTL2002DC,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1						3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20	3 V		0 V	.5 mm	85 Cel	3.3 V	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	1 mm	2 mm	Not Qualified		e4	30	260	2.3 mm
GTL2005PW/DG,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e4			5 mm
MC33CD1030AER2	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	36 V	1	SMARTMOS				16 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH				4.5 V	.5 mm	125 Cel		-40 Cel		QUAD	S-PQFP-G48	3	1.6 mm	7 mm				40	260	7 mm
PCA9517AD,112	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1	CMOS				1.2 V	5.5 V	3/5	SMALL OUTLINE	SOP8,.25	2.7 V	Line Driver or Receivers	.9 V	1.27 mm	85 Cel	3.3 V	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
PCA9570GMH	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS				2.2 V			CHIP CARRIER				1.1 V		85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQCC-N8	1	.5 mm	1.2 mm			e4	30	260	1.4 mm
GTL2005PW/G,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	4					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				3 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G14		1.1 mm	4.4 mm						5 mm
TJA1145T/FD	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		AEC-Q100			5 V			SMALL OUTLINE	SOP14,.24			4.5 V	1.27 mm					DUAL	R-PDSO-G14		1.75 mm	3.9 mm						8.65 mm
PCA9509D,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS				5 V		1/4.5,3.3/5	SMALL OUTLINE	SOP8,.25		Line Driver or Receivers	3 V	1.27 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
GTL2014PWZ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1					3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25			3 V	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm					260	5 mm
UJA1169TK/XZ	NXP Semiconductors	INTERFACE CIRCUIT																										NICKEL PALLADIUM GOLD SILVER			1					e4	30	260
NVT2002GD,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.4 V	1						5.5 V		SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.12,20	0 V		0 V	.5 mm	85 Cel		-40 Cel		DUAL	R-PDSO-N8	1	.5 mm	2 mm		SEATED HGT-NOM		30	260	3 mm
PCA9574BS,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	CMOS				2.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.1 V	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	1	1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9306GM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	8	VQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2					1.8 V	5.5 V		CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	1.8 V	Other Interface ICs	1 V	.55 mm	85 Cel	2.5 V	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N8	1	.5 mm	1.6 mm	Not Qualified		e4	30	260	1.6 mm
PCA9509ADP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2 V	1					1.1 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.8 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e4			3 mm
PCA9509DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1	CMOS				5 V		3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Line Driver or Receivers	3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9559PW,112	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1	CMOS				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25			3 V	.65 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm				30	260	6.5 mm
PCA9509PDP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1.5 V	1	CMOS				1.1 V	5.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.3 V		.8 V	.65 mm	85 Cel	3.3 V	-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm				30	260	3 mm
MC33972ATEWR2	NXP Semiconductors	INTERFACE CIRCUIT																										TIN			3					e3	40	260
PCA9306DP	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES		2								SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		Other Interface ICs	1 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA8536BT/Q900/1Y	NXP Semiconductors	INTERFACE CIRCUIT																													3							260
PCA9306DP1-G	NXP Semiconductors		INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES										SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.16		Other Interface ICs		.635 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G8				Not Qualified
GTL2014PW,112	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	1					3.3 V		3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25		Other Interface ICs	3 V	.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G14	1	1.1 mm	4.4 mm	Not Qualified		e4	30	260	5 mm
TJA1145T/FD,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		AEC-Q100			5 V			SMALL OUTLINE				4.5 V	1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm						8.65 mm
TJA1145TK/FD	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	1		AEC-Q100			5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12X.18,25			4.5 V	.65 mm					DUAL	R-PDSO-N14		1 mm	3 mm						4.5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.