NXP Semiconductors Other Function Interface ICs 918

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

PCA9306GF,115

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1/3.6,1.8/5.5

SMALL OUTLINE, VERY THIN PROFILE

SOLCC8,.04,14

Other Interface ICs

.35 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N8

1

.5 mm

1 mm

Not Qualified

e3

30

260

1.35 mm

NTB0102DP,125

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

1.2/3.6,1.8/5

Other Interface ICs

1

Not Qualified

30

260

PCA9600D

NXP Semiconductors

BUS BUFFERS

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

15 V

1

7.3 mA

5 V

2.5/15

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.5 V

1.27 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

UJA1169TK/X/F

NXP Semiconductors

INTERFACE CIRCUIT

UJA1169TK/X/FZ

NXP Semiconductors

INTERFACE CIRCUIT

NICKEL PALLADIUM GOLD SILVER

1

e4

30

260

GTL2002DP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

0 V

0 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

Also required VDREF 0 to 5.5V

e4

30

260

3 mm

GTL2002DP-T

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

0 V

0 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

Also required VDREF 0 to 5.5V

e4

3 mm

GTL2005PW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

Other Interface ICs

3 V

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G14

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

5 mm

GTL2005PW-T

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

4

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

Other Interface ICs

3 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.1 mm

4.4 mm

Not Qualified

e4

5 mm

GTL2005PWDH

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

0 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.1 mm

4.4 mm

Not Qualified

5 mm

NTP53121G0JTZ

NXP Semiconductors

1

260

PCA9511AD,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

6 mA

3.3 V

3/5

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.7 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

MC33797BPEWR2

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP32,.4

Other Interface ICs

.635 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

Not Qualified

e3

40

260

MC33978AEKR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

2.45 mm

7.5 mm

e3

40

260

11 mm

NTS0302JKZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.2 V

SMALL OUTLINE, VERY THIN PROFILE

SOLCC8,.04,14

.95 V

.35 mm

125 Cel

-40 Cel

DUAL

R-PDSO-N8

1

.33 mm

1 mm

260

1.4 mm

PCA9509AGM

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

YES

2 V

1

1.1 V

CHIP CARRIER, VERY THIN PROFILE

.8 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-PBCC-B8

1

.5 mm

1.6 mm

e4

1.6 mm

PCA9509AGM,125

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

YES

2 V

1

1.1 V

CHIP CARRIER, VERY THIN PROFILE

.8 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBCC-B8

1

.5 mm

1.6 mm

30

260

1.6 mm

PCA9509D

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

5 V

3/3.3

SMALL OUTLINE

SOP8,.25

Line Driver or Receivers

3 V

1.27 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9509D,112

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

5 V

3/3.3

SMALL OUTLINE

SOP8,.25

Line Driver or Receivers

3 V

1.27 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

S-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9509GM

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

VQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

5 V

3/3.3

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

Line Driver or Receivers

3 V

.55 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N8

1

.5 mm

1.6 mm

Not Qualified

e4

30

260

1.6 mm

PCA9509PGM

NXP Semiconductors

INTERFACE CIRCUIT

PCA9509PGM,125

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

YES

1.5 V

1

CMOS

1.1 V

5.5 V

CHIP CARRIER, VERY THIN PROFILE

2.3 V

.8 V

.55 mm

85 Cel

3.3 V

-40 Cel

BOTTOM

S-PBCC-B8

1

.5 mm

1.6 mm

30

260

1.6 mm

PCA9518APW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

2

1.1 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

PCA9518APW,518

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

2

1.1 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

PCA9306DC1

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TSSOP8,.12,20

Other Interface ICs

1 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1 mm

2 mm

Not Qualified

e4

30

260

2.3 mm

PCA9306DC1-G

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

5.5 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TSSOP8,.12,20

2.3 V

Other Interface ICs

1.1 V

.5 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1 mm

2 mm

Not Qualified

e4

2.3 mm

PCA9512AD,112

NXP Semiconductors

BUS BUFFERS

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.6 mA

3.3 V

5.5 V

3/5

SMALL OUTLINE

SOP8,.25

2.7 V

Other Interface ICs

2.7 V

1.27 mm

85 Cel

3.3 V

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9507DP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 mA

3.6 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Interface ICs

2.7 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

PCA9507DP-T

NXP Semiconductors

INDUSTRIAL

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 mA

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Interface ICs

.635 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

Not Qualified

PCA9601DP,118

NXP Semiconductors

BUS BUFFERS

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

15 V

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.5 V

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

30

260

3 mm

PCA9513AD,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

6 mA

3.3 V

3/5

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.7 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9702PW,118

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.5 V

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

5 mm

GTL2002GM,125

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

2.64 V

1

2.5 V

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC8,.06SQ,20

3 V

2.36 V

.5 mm

85 Cel

3.3 V

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N8

1

.5 mm

1.6 mm

Not Qualified

ALSO OPERARTES AT 3.3V SUPPLY

e4

30

260

1.6 mm

IP4855CX25/P,135

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

4 V

3/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

Level Translators

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

Not Qualified

2.04 mm

NVT4857UKAZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.9 V

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B20

.53 mm

1.7 mm

e2

30

260

2.1 mm

PCA9614DPZ

NXP Semiconductors

INTERFACE CIRCUIT

1

260

GTL2012DP,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Interface ICs

3 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

MC33972ATEKR2

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

NTS0104UK-Q100Z

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

AEC-Q100

1.8/3.3,2.5/5

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

PCA9601D,118

NXP Semiconductors

BUS BUFFERS

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

15 V

1

5 V

SMALL OUTLINE

SOP8,.25

2.5 V

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

30

260

4.9 mm

PCA9616PW,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

.8 V

.65 mm

85 Cel

5 V

-40 Cel

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

30

260

5 mm

PCAL6534EVJ

NXP Semiconductors

INTERFACE CIRCUIT

BALL

42

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA42,6X7,16

.8 V

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B42

1

1 mm

2.6 mm

e1

30

260

3 mm

GTL2003PW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

2.64 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.36 V

3 V

.65 mm

85 Cel

2.5 V

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

GTL2003PW,112

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3.3 V

2.64 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

2.36 V

Other Interface ICs

3 V

.65 mm

85 Cel

2.5 V

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

MC33797BPEW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP32,.4

Other Interface ICs

.635 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

Not Qualified

e3

40

260

NVT4857UKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.9 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

.53 mm

1.7 mm

2.1 mm

PCA9512ADP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.6 mA

3.3 V

5.5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.7 V

Other Interface ICs

2.7 V

.65 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

PCA9574PW,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

2.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.1 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

5 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.