NXP Semiconductors Other Function Interface ICs 918

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

PCA9701HF,118

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.5 V

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

1

.8 mm

4 mm

e4

30

260

4 mm

GTL2002D,112

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.6 V

SMALL OUTLINE

SOP8,.25

3 V

0 V

1.27 mm

85 Cel

3.3 V

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

GTL2002D,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.6 V

SMALL OUTLINE

SOP8,.25

3 V

0 V

1.27 mm

85 Cel

3.3 V

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9507D,112

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

5 mA

3.6 V

3/5

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.7 V

1.27 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9514AD,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

6 mA

3.3 V

3/5

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.7 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

TJA1080ATS/2

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

5 V

SMALL OUTLINE, SHRINK PITCH

4.75 V

.65 mm

DUAL

R-PDSO-G20

2 mm

5.3 mm

Not Qualified

7.2 mm

UJA1169TK/3

NXP Semiconductors

INTERFACE CIRCUIT

UJA1169TK/F/3

NXP Semiconductors

INTERFACE CIRCUIT

UJA1169TK/FZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

20

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.8 V

.5 mm

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-N20

1

1 mm

3.5 mm

e4

30

260

5.5 mm

NTA53321G0FHKZ

NXP Semiconductors

NICKEL PALLADIUM GOLD SILVER

1

e4

30

260

NTB0102DP-Q100H

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

AEC-Q100

1.2/3.6,1.8/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.16

Other Interface ICs

.635 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

1

Not Qualified

260

NTP53121G0JTTZ

NXP Semiconductors

1

260

PCA9512AD,118

NXP Semiconductors

BUS BUFFERS

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

3.6 mA

3.3 V

3/5

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.7 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9518PW,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

3 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

PCA9518PW/G,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

3 V

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.1 mm

4.4 mm

6.5 mm

PR5331C3HN/C370Y

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2.5 V

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

2

1 mm

6 mm

260

6 mm

TDA8024TT/C1/S1J

NXP Semiconductors

INTERFACE CIRCUIT

1

260

TJA1145TK

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

14

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

AEC-Q100

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12X.18,25

4.5 V

.65 mm

DUAL

R-PDSO-N14

1 mm

3 mm

4.5 mm

GTL2002DC

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

5.5 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TSSOP8,.12,20

0 V

0 V

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G8

1

1 mm

2 mm

Not Qualified

Also required VDREF 0 to 5.5V

e4

30

260

2.3 mm

GTL2002DC-G

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

MOS

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.12,20

0 V

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1 mm

2 mm

2.3 mm

GTL2010PW,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

2.64 V

10

2.5 V

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

2.36 V

.65 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

7.8 mm

GTL2014PW

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

14

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP14,.25

Other Interface ICs

3 V

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G14

1

1.1 mm

4.4 mm

Not Qualified

e4

30

260

5 mm

NTP53321G0JTZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

1.8 V

SMALL OUTLINE

SOP8,.25

1.62 V

1.27 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Operating temp for EEPROM Write operation is -40 to 85 deg cel

260

4.9 mm

NVT2001GM,115

NXP Semiconductors

INTERFACE CIRCUIT

Tin (Sn)

1

e3

30

260

P3A9606JKZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1.98 V

1

1.2 V

SMALL OUTLINE, VERY THIN PROFILE

SOLCC8,.04,14

.72 V

.35 mm

125 Cel

-40 Cel

DUAL

R-PDSO-N8

1

.33 mm

1 mm

260

1.35 mm

PCA9306DP-T

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

5.5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.3 V

Other Interface ICs

1.1 V

.65 mm

85 Cel

3.3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

3 mm

MC33978AESR2

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

3

.9 mm

5 mm

e3

40

260

5 mm

PCA9605D,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

.001 mA

5.5 V

5.5

SMALL OUTLINE

SOP8,.25

Other Interface ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1

Not Qualified

30

260

PCA9605DP,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

.001 mA

5.5 V

5.5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Interface ICs

.635 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1

Not Qualified

30

260

NTB0102GF,115

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

1.2/3.6,1.8/5

Other Interface ICs

TIN

1

Not Qualified

e3

30

260

MC33972ATEW

NXP Semiconductors

INTERFACE CIRCUIT

MATTE TIN

3

e3

40

260

PCA8536AT/Q900/1Y

NXP Semiconductors

INTERFACE CIRCUIT

AEC-Q100

3

260

PCA9508DP

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

2.7 V

5.5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.7 V

Line Driver or Receivers

.9 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

PCA9508DP,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

3.3 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Line Driver or Receivers

2.7 V

.65 mm

85 Cel

-40 Cel

TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

PCA9601DPZ

NXP Semiconductors

BUS BUFFERS

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

15 V

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

2.5 V

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

260

3 mm

PCF8536BT/1,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

SEGMENT

YES

CMOS

.13 mA

40-CHARACTER

2/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.3,20

44

8-BP

Other Interface ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G56

1

Not Qualified

260

GTL2002GM

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

8

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC8,.06SQ,20

0 V

0 V

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N8

1

.5 mm

1.6 mm

Not Qualified

Also required VDREF 0 to 5.5V

e4

30

260

1.6 mm

MC34978AES

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

3

.9 mm

5 mm

e3

40

260

5 mm

NTP53321G0JTTZ

NXP Semiconductors

1

260

PCA9306D

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

SMALL OUTLINE

SOP8,.25

Other Interface ICs

1 V

1.27 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PCA9514ADP,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

6 mA

3.3 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Interface ICs

2.7 V

.65 mm

85 Cel

-40 Cel

TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

PCA9846PWJ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.2 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.8 V

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

e4

30

260

5 mm

PR5331C3HN/C360,518

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

40

HQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

2.5 V

85 Cel

-30 Cel

QUAD

S-PQCC-N40

TDA8024T

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6.5 V

1

3.3 V

6.5 V

SMALL OUTLINE

3 V

2.7 V

1.27 mm

85 Cel

5 V

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

260

17.9 mm

MC33978AEK

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

GULL WING

32

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

3 V

.65 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G32

3

2.45 mm

7.5 mm

e3

40

260

11 mm

MC33CD1020AESR2

NXP Semiconductors

INTERFACE CIRCUIT

TIN

3

e3

40

260

MC33CD1030AE

NXP Semiconductors

INTERFACE CIRCUIT

GULL WING

48

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

36 V

1

SMARTMOS

16 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

4.5 V

.5 mm

125 Cel

-40 Cel

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

40

260

7 mm

PCA9510AD,118

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

6 mA

3.3 V

3/5

SMALL OUTLINE

SOP8,.25

Other Interface ICs

2.7 V

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.