Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Maximum Supply Current | Output Latch/Register | Input Characteristics | Nominal Supply Voltage | Maximum Supply Voltage-1 | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage-1 | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
AEC-Q100 |
4 |
.005 mA |
1.8 V |
97 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
1.65 V |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
2 |
1.2 mm |
4.4 mm |
ALSO REQUIRED VCCB = 2.3V TO 5.5V SUPPLY |
e4 |
30 |
260 |
5 mm |
|||||||||||||
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
AUTOMOTIVE |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
AEC-Q100 |
8 |
.008 mA |
LATCH |
1.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
1.4 V |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
ALSO REQUIRED VCCB SUPPLY VOLTAGE 1.65 TO 5.5V |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||
|
Texas Instruments |
TTL/CMOS TO CMOS TRANSLATOR |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
6 |
CMOS |
6 |
.018 mA |
NONE |
STANDARD |
10 V |
5/15 |
550 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Level Translators |
5 V |
.65 mm |
125 Cel |
PUSH-PULL |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
5 mm |
||||||||
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
AEC-Q100 |
4 |
.04 mA |
1.5 V |
1.2/3.6,1.8/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
Other Interface ICs |
1.2 V |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
|||||||||||||
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
.005 mA |
LATCH |
1.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
1.2 V |
.65 mm |
85 Cel |
PUSH-PULL |
-40 Cel |
DUAL |
R-PDSO-G16 |
1.2 mm |
4.4 mm |
5 mm |
|||||||||||||||||||||
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
AUTOMOTIVE |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
1 |
AEC-Q100 |
8 |
LATCH |
1 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
0 V |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
e3 |
30 |
260 |
6.5 mm |
|||||||||||||||
|
Texas Instruments |
TTL/CMOS TO CMOS TRANSLATOR |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
1 |
CMOS |
6 |
.018 mA |
NONE |
STANDARD |
10 V |
5/15 |
550 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Level Translators |
5 V |
.65 mm |
125 Cel |
PUSH-PULL |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
5 mm |
||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
5 mm |
||||||||
|
Onsemi |
TTL/CMOS TO CMOS TRANSLATOR |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
6 |
CMOS |
AEC-Q100 |
1 |
6 mA |
NONE |
STANDARD |
5 V |
550 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
3 V |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
5 mm |
||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
6 |
NONE |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.8 V |
1 V |
.65 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
5 mm |
||||||||||||||||
|
Onsemi |
TTL/CMOS TO CMOS TRANSLATOR |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
6 |
CMOS |
1 |
6 mA |
NONE |
STANDARD |
5 V |
550 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
3 V |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
5 mm |
|||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
3 |
NONE |
5.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
1.8 V |
1 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
TRUE |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
3 mm |
||||||||||||||||
|
Onsemi |
TTL/CMOS TO CMOS TRANSLATOR |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
6 |
CMOS |
1 |
6 mA |
NONE |
STANDARD |
5 V |
550 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
3 V |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
5 mm |
|||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
1.8 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
NXP Semiconductors |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
CMOS |
1 |
5 mA |
NONE |
3.3 V |
3/3.3 |
250 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Line Driver or Receivers |
2.7 V |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
3 mm |
|||||||||
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
0 V |
0 V |
.65 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G24 |
1 |
1.1 mm |
4.4 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
e4 |
30 |
260 |
7.8 mm |
||||||||||||
|
Microchip Technology |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
2 |
1 |
25 mA |
NONE |
3.3 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
3.135 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
CAN ALSO OPERATE WITH 5V SUPPLY |
e4 |
40 |
260 |
3 mm |
||||||||||||
|
Texas Instruments |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
13 |
BICMOS |
1 |
12 mA |
NONE |
STANDARD |
3.3 V |
3.3 |
10 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
9.7 mm |
||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
5 mm |
||||||||
|
Microchip Technology |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
20 mA |
NONE |
3.3 V |
2.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e4 |
40 |
260 |
3 mm |
||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
2.5 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Texas Instruments |
VOLTAGE LEVEL TRANSLATOR |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
AEC-Q100 |
6 |
.009 mA |
1.5 V |
35.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
1.2 V |
.65 mm |
85 Cel |
PUSH-PULL |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
30 |
260 |
5 mm |
||||||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
40 mA |
NONE |
DIFFERENTIAL |
3.3 V |
3.3 |
2.2 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
5 mm |
||||||||
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
2 |
ECL |
1 |
NONE |
3.3 V |
-4.5 |
-4.5 V |
.6 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Microchip Technology |
LVDS TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
1 |
45 mA |
NONE |
3.3 V |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
3 mm |
|||||||||||||||
|
Texas Instruments |
TTL/CMOS TO CMOS TRANSLATOR |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
6 |
CMOS |
1 |
NONE |
10 V |
5/15 |
550 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Level Translators |
5 V |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
40 |
260 |
5 mm |
|||||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
5 mm |
||||||||
|
Analog Devices |
VOLTAGE LEVEL TRANSLATOR |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
BICMOS |
1 |
.3 mA |
LATCH |
1.8 V |
5.5 V |
1600 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
1.65 V |
1.2 V |
.65 mm |
85 Cel |
3.3 V |
OPEN-DRAIN |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
5 mm |
||||||||
|
Texas Instruments |
TTL/CMOS TO CMOS TRANSLATOR |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
6 |
CMOS |
1 |
NONE |
10 V |
5/15 |
550 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Level Translators |
5 V |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
5 mm |
|||||||||||
|
Texas Instruments |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
13 |
12 |
BICMOS |
1 |
12 mA |
NONE |
STANDARD |
3.3 V |
3.3 |
10 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
9.7 mm |
|||||||
|
Texas Instruments |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
13 |
12 |
BICMOS |
1 |
12 mA |
NONE |
STANDARD |
3.3 V |
3.3 |
10 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Other Interface ICs |
3 V |
.65 mm |
85 Cel |
3-STATE |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G28 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
NOT SPECIFIED |
260 |
9.7 mm |
|||||||
|
Texas Instruments |
TTL/CMOS TO CMOS TRANSLATOR |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
18 V |
6 |
CMOS |
6 |
.018 mA |
NONE |
STANDARD |
10 V |
5/15 |
550 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Level Translators |
5 V |
.65 mm |
125 Cel |
PUSH-PULL |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
e4 |
30 |
260 |
5 mm |
||||||||
|
Onsemi |
TTL TO ECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
5,-4.5/-5.2 |
-5 V |
2 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
4.5 V |
.65 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
||||||||||
Maxim Integrated |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
245 |
3 mm |
|||||||||||||
|
Analog Devices |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
Maxim Integrated |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
3 mm |
||||||||||||||
|
Analog Devices |
LVTTL/TTL TO LVPECL/PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
BIPOLAR |
1 |
NONE |
3.3 V |
3.3 |
.4 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Microchip Technology |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.7 V |
2 |
1 |
80 mA |
NONE |
3.3 V |
.7 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
CML-TO-LVDS TRANSLATION ALSO POSSIBLE |
e4 |
40 |
260 |
3 mm |
||||||||||||
Maxim Integrated |
LVDS TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
S-PDSO-G10 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e0 |
3 mm |
|||||||||||||||||
|
Analog Devices |
LVDS TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||||
Maxim Integrated |
LVDS TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e0 |
245 |
3 mm |
|||||||||||||||
|
Analog Devices |
LVDS TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||||
|
Onsemi |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
ECL |
1 |
NONE |
3.3 V |
-4.5 |
-3.3 V |
.34 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
COMPLEMENTARY |
SAFETY CLAMP ON INPUTS, CAN ALSO OPERATE WITH -3V TO -5.5V IN NECL MODE |
e4 |
30 |
260 |
6.5 mm |
|||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
3.25 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
2.25 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Level Translators |
3 V |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
3 |
1.1 mm |
3 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
3 mm |
|||||||||||
|
Maxim Integrated |
CML/LVDS/LVPECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e3 |
30 |
260 |
3 mm |
|||||||||||||
Maxim Integrated |
CML/LVDS/LVPECL TO LVDS TRANSLATOR |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
CMOS |
1 |
40 mA |
NONE |
3.3 V |
3.31 ns |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.20,20 |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
COMPLEMENTARY |
e0 |
3 mm |
Voltage level translators are electronic components used to convert voltage levels between different devices in electronic systems. They are used to ensure that signals are compatible and can be correctly interpreted. Voltage level translators are essential components in electronic systems that require the exchange of data and signals between different components.
Voltage level translators can be classified into several types based on their specific characteristics and applications. The most common types of voltage level translators include unidirectional and bidirectional translators.
Unidirectional voltage level translators convert signals in one direction, typically from a low voltage to a higher voltage. They are commonly used in applications where data is transmitted from a low-power device to a higher-power device. Bidirectional voltage level translators can convert signals in both directions and are commonly used in applications where data is transmitted bidirectionally between two devices.
Voltage level translators are typically characterized by their voltage range, speed, power consumption, and compatibility with different voltage levels. They are commonly used in various electronic systems, such as communications, industrial automation, and automotive electronics.