Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
5 |
5/15 |
50 pF |
SMALL OUTLINE |
SOP16,.3 |
400 ns |
FF/Latches |
1.27 mm |
125 Cel |
LOW LEVEL |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
18 V |
2.05 mm |
5.275 mm |
Not Qualified |
TRUE |
3 V |
1:8 DMUX FOLLOWED BY LATCH |
e4 |
260 |
10.2 mm |
4000/14000/40000 |
|||||||||||||
|
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
5 |
RAIL |
CHIP CARRIER |
LDCC20,.4SQ |
2 ns |
FF/Latches |
1.27 mm |
75 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
S-PQCC-J20 |
4.57 mm |
8.965 mm |
Not Qualified |
TRUE |
107 mA |
e3 |
260 |
8.965 mm |
10H |
||||||||||||||||||
Onsemi |
D LATCH |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
1 |
RAIL |
5 |
5 |
50 pF |
IN-LINE |
DIP16,.3 |
12.5 ns |
24 Amp |
FF/Latches |
2.54 mm |
85 Cel |
LOW LEVEL |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
5.5 V |
4.44 mm |
7.62 mm |
Not Qualified |
TRUE |
4.5 V |
1:8 DMUX FOLLOWED BY LATCH |
e0 |
235 |
19.175 mm |
ACT |
||||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
ECL |
2 |
CHIP CARRIER |
6 ns |
1.27 mm |
85 Cel |
OPEN-EMITTER |
HIGH LEVEL |
-30 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
4.57 mm |
8.9662 mm |
Not Qualified |
TRUE |
e0 |
8.9662 mm |
10K |
||||||||||||||||||||||||
Onsemi |
D LATCH |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
4 |
RAIL |
5 |
5/15 |
50 pF |
IN-LINE |
DIP16,.3 |
440 ns |
FF/Latches |
2.54 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
18 V |
4.44 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e0 |
235 |
19.175 mm |
4000/14000/40000 |
||||||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
2 |
5 |
TR |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
700 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
91 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
10E |
|||||||||||
|
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
5 |
TR |
CHIP CARRIER |
LDCC20,.4SQ |
2 ns |
FF/Latches |
1.27 mm |
75 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
S-PQCC-J20 |
4.57 mm |
8.965 mm |
Not Qualified |
TRUE |
107 mA |
e3 |
260 |
8.965 mm |
10H |
||||||||||||||||||
|
Onsemi |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
TR |
5 |
5/15 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
440 ns |
FF/Latches |
1.27 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
18 V |
1.75 mm |
3.9 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e3 |
30 |
260 |
9.9 mm |
4000/14000/40000 |
|||||||||||||
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
5 |
TR |
CHIP CARRIER |
LDCC20,.4SQ |
2 ns |
FF/Latches |
1.27 mm |
75 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
4.57 mm |
8.965 mm |
Not Qualified |
TRUE |
107 mA |
e0 |
235 |
8.965 mm |
10H |
|||||||||||||||||||
|
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
12.5 ns |
24 Amp |
FF/Latches |
1.27 mm |
85 Cel |
LOW LEVEL |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.5 V |
1:8 DMUX FOLLOWED BY LATCH |
e3 |
30 |
260 |
9.9 mm |
ACT |
|||||||||||
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
3.3 |
3.3 |
50 pF |
SMALL OUTLINE |
SOP20,.3 |
FF/Latches |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
|||||||||||||||||||||||||
|
Onsemi |
D LATCH |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
1 |
RAIL |
5 |
3.3/5 |
50 pF |
IN-LINE |
DIP16,.3 |
17 ns |
12 Amp |
FF/Latches |
2.54 mm |
85 Cel |
LOW LEVEL |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDIP-T16 |
6 V |
4.44 mm |
7.62 mm |
Not Qualified |
TRUE |
2 V |
1:8 DMUX FOLLOWED BY LATCH |
e3 |
260 |
19.175 mm |
AC |
|||||||||||||
Onsemi |
D LATCH |
MILITARY |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
2/6 |
50 pF |
SMALL OUTLINE |
SOP20,.3 |
6 Amp |
FF/Latches |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
|||||||||||||||||||||||||
|
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
ECL |
5 |
RAIL |
IN-LINE |
DIP16,.3 |
2 ns |
FF/Latches |
2.54 mm |
75 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
DUAL |
R-PDIP-T16 |
4.44 mm |
7.62 mm |
Not Qualified |
TRUE |
107 mA |
e3 |
260 |
19.175 mm |
10H |
||||||||||||||||||
|
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
9 |
TR |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
700 MHz |
S-PQCC-J28 |
3 |
5.5 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
132 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.5V |
e3 |
260 |
11.505 mm |
10E |
|||||||||||
Onsemi |
D LATCH |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
ECL |
2 |
IN-LINE |
6 ns |
2.54 mm |
85 Cel |
OPEN-EMITTER |
HIGH LEVEL |
-30 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
4.44 mm |
7.62 mm |
Not Qualified |
TRUE |
e0 |
19.175 mm |
10K |
||||||||||||||||||||||||
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
ECL |
2 |
IN-LINE |
DIP16,.3 |
1.7 ns |
FF/Latches |
2.54 mm |
75 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
19.49 mm |
10H |
||||||||||||||||||||||
Onsemi |
D LATCH |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
ECL |
4 |
IN-LINE |
6.2 ns |
2.54 mm |
85 Cel |
OPEN-EMITTER |
HIGH LEVEL |
-30 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
4.44 mm |
7.62 mm |
Not Qualified |
TRUE |
e0 |
19.175 mm |
10K |
||||||||||||||||||||||||
Onsemi |
D LATCH |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
2 |
ECL |
2 |
IN-LINE |
6 ns |
2.54 mm |
85 Cel |
OPEN-EMITTER |
HIGH LEVEL |
-30 Cel |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
TRUE |
19.495 mm |
10K |
||||||||||||||||||||||||||
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
2 |
4 |
TR |
CHIP CARRIER |
LDCC20,.4SQ |
3.7 ns |
Multiplexer/Demultiplexers |
1.27 mm |
75 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
Tin/Lead (Sn80Pb20) |
QUAD |
S-PQCC-J20 |
1 |
4.57 mm |
8.965 mm |
Not Qualified |
TRUE |
73 mA |
FOUR 2:1 MUX FOLLOWED BY LATCH |
e0 |
8.965 mm |
10H |
|||||||||||||||||
|
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
9 |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
700 MHz |
S-PQCC-J28 |
5.5 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
152 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.5V |
e3 |
260 |
11.505 mm |
100E |
|||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
4 |
3 |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
Tin/Lead (Sn80Pb20) |
QUAD |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
96 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
11.505 mm |
100E |
||||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
2 |
6 |
TR |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.75 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
700 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
102 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
10E |
|||||||||||
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
3.3 |
3.3 |
50 pF |
SMALL OUTLINE |
SOP20,.3 |
FF/Latches |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
|||||||||||||||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
9 |
TR |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
700 MHz |
S-PQCC-J28 |
1 |
5.5 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
132 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.5V |
e0 |
235 |
11.505 mm |
10E |
||||||||||||
Onsemi |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
TR |
5 |
5/15 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
440 ns |
FF/Latches |
1.27 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
18 V |
1.75 mm |
3.9 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e0 |
235 |
9.9 mm |
4000/14000/40000 |
|||||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
ECL |
2 |
CHIP CARRIER |
LDCC20,.4SQ |
5.6 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
-30 Cel |
Tin/Lead (Sn80Pb20) |
QUAD |
S-PQCC-J20 |
1 |
4.57 mm |
8.965 mm |
Not Qualified |
TRUE |
83 mA |
e0 |
8.965 mm |
10K |
||||||||||||||||||||
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
ECL |
2 |
IN-LINE |
DIP16,.3 |
1.7 ns |
FF/Latches |
2.54 mm |
75 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
4.44 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
235 |
19.175 mm |
10H |
|||||||||||||||||||||
|
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
ECL |
5 |
RAIL |
SMALL OUTLINE |
SOP16,.3 |
2 ns |
FF/Latches |
1.27 mm |
75 Cel |
LOW LEVEL |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
2.05 mm |
5.275 mm |
Not Qualified |
TRUE |
107 mA |
e4 |
260 |
10.2 mm |
10H |
||||||||||||||||||
|
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
2 |
5 |
TR |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
700 MHz |
S-PQCC-J28 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
91 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e3 |
260 |
11.505 mm |
10E |
|||||||||||
|
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
ECL |
2 |
IN-LINE |
DIP16,.3 |
1.7 ns |
FF/Latches |
2.54 mm |
75 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
DUAL |
R-PDIP-T16 |
4.44 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
260 |
19.175 mm |
10H |
||||||||||||||||||||
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP20,.3 |
24 Amp |
FF/Latches |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
||||||||||||||||||||||||
Onsemi |
D LATCH |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
1 |
RAIL |
5 |
5/15 |
50 pF |
IN-LINE |
DIP16,.3 |
400 ns |
FF/Latches |
2.54 mm |
125 Cel |
LOW LEVEL |
-55 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
18 V |
4.44 mm |
7.62 mm |
Not Qualified |
TRUE |
3 V |
1:8 DMUX FOLLOWED BY LATCH |
e0 |
235 |
19.175 mm |
4000/14000/40000 |
|||||||||||||||
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
24 Amp |
FF/Latches |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
||||||||||||||||||||||||
|
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
4 |
3 |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
700 MHz |
S-PQCC-J28 |
3 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
90 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e3 |
260 |
11.505 mm |
10E |
|||||||||||
Onsemi |
D LATCH |
COMMERCIAL EXTENDED |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
2 |
CHIP CARRIER |
LDCC20,.4SQ |
1.7 ns |
FF/Latches |
1.27 mm |
75 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
4.57 mm |
8.965 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
235 |
8.965 mm |
10H |
|||||||||||||||||||||
|
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
6 |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
900 MHz |
S-PQCC-J28 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
62 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e3 |
260 |
11.505 mm |
10E |
|||||||||||||
|
Onsemi |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
RAIL |
3 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
125 ns |
4 Amp |
FF/Latches |
1.27 mm |
125 Cel |
LOW LEVEL |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
2 V |
e3 |
30 |
260 |
9.9 mm |
HC/UH |
||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
2 |
5 |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
700 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
91 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
10E |
||||||||||||
|
Onsemi |
D LATCH |
MILITARY |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
2/6 |
50 pF |
SMALL OUTLINE |
SOP20,.3 |
6 Amp |
FF/Latches |
1.27 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e4 |
||||||||||||||||||||||||
|
Onsemi |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
5 |
5/15 |
50 pF |
SMALL OUTLINE |
SOP16,.3 |
440 ns |
FF/Latches |
1.27 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G16 |
3 |
18 V |
2.05 mm |
5.275 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
e4 |
10.2 mm |
4000/14000/40000 |
||||||||||||||||
Onsemi |
D LATCH |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
ECL |
5 |
-5.2 |
IN-LINE |
DIP16,.3 |
4.3 ns |
FF/Latches |
2.54 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
-30 Cel |
TIN LEAD |
DUAL |
R-CDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
TRUE |
107 mA |
e0 |
19.495 mm |
10K |
||||||||||||||||||||
Onsemi |
D LATCH |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
ECL |
2 |
IN-LINE |
DIP16,.3 |
5.6 ns |
FF/Latches |
2.54 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
-30 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
4.44 mm |
7.62 mm |
Not Qualified |
TRUE |
83 mA |
e0 |
235 |
19.175 mm |
10K |
||||||||||||||||||||
Onsemi |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
RAIL |
5 |
5/15 |
50 pF |
SMALL OUTLINE |
SOP16,.4 |
400 ns |
FF/Latches |
1.27 mm |
125 Cel |
LOW LEVEL |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
18 V |
2.65 mm |
7.5 mm |
Not Qualified |
TRUE |
3 V |
1:8 DMUX FOLLOWED BY LATCH |
e0 |
235 |
10.3 mm |
4000/14000/40000 |
||||||||||||||
|
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
8 Amp |
FF/Latches |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
DUAL |
R-PDSO-G20 |
Not Qualified |
|||||||||||||||||||||||||
|
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
5 |
3.3/5 |
50 pF |
SMALL OUTLINE |
SOP16,.3 |
17 ns |
12 Amp |
FF/Latches |
1.27 mm |
85 Cel |
LOW LEVEL |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
6 V |
2.05 mm |
5.275 mm |
Not Qualified |
TRUE |
2 V |
e4 |
260 |
10.2 mm |
AC |
|||||||||||||
|
Onsemi |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
32 ns |
5.2 Amp |
FF/Latches |
1.27 mm |
125 Cel |
LOW LEVEL |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
4.5 V |
e3 |
30 |
260 |
9.9 mm |
HCT |
||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
2 |
6 |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.75 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
700 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
102 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
10E |
Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.
A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.
Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.
Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.
Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.