Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
3 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
125 ns |
4 Amp |
FF/Latches |
1.27 mm |
125 Cel |
LOW LEVEL |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
2 V |
e3 |
30 |
260 |
9.9 mm |
HC/UH |
||||||||||||
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
3.3/5 |
50 pF |
SMALL OUTLINE |
SOP20,.3 |
12 Amp |
FF/Latches |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
3 V |
e0 |
||||||||||||||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
4 |
3 |
5 |
-4.5 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
700 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
103 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
100E |
||||||||||||
|
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
9 |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
FF/Latches |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN |
QUAD |
700 MHz |
S-PQCC-J28 |
5.5 V |
4.57 mm |
11.505 mm |
Not Qualified |
TRUE |
4.2 V |
132 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.5V |
e3 |
260 |
11.505 mm |
10E |
|||||||||||||
Onsemi |
D LATCH |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
ECL |
4 |
IN-LINE |
6.2 ns |
2.54 mm |
85 Cel |
OPEN-EMITTER |
HIGH LEVEL |
-30 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
TRUE |
e0 |
19.495 mm |
10K |
||||||||||||||||||||||||
|
Onsemi |
D LATCH |
MILITARY |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
2/6 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
6 Amp |
FF/Latches |
.635 mm |
125 Cel |
3-STATE |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e4 |
||||||||||||||||||||||||
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE |
SOP20,.3 |
24 Amp |
FF/Latches |
1.27 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
||||||||||||||||||||||||
|
Onsemi |
D LATCH |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
1 |
RAIL |
5 |
5 |
50 pF |
IN-LINE |
DIP16,.3 |
12.5 ns |
24 Amp |
FF/Latches |
2.54 mm |
85 Cel |
LOW LEVEL |
-40 Cel |
TIN |
DUAL |
R-PDIP-T16 |
5.5 V |
4.44 mm |
7.62 mm |
Not Qualified |
TRUE |
4.5 V |
1:8 DMUX FOLLOWED BY LATCH |
e3 |
260 |
19.175 mm |
ACT |
|||||||||||||
Onsemi |
D LATCH |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
ECL |
4 |
3 |
5 |
-5.2 |
CHIP CARRIER |
LDCC28,.5SQ |
.8 ns |
Multiplexer/Demultiplexers |
1.27 mm |
85 Cel |
OPEN-EMITTER |
LOW LEVEL |
0 Cel |
TIN LEAD |
QUAD |
700 MHz |
S-PQCC-J28 |
1 |
5.7 V |
4.57 mm |
11.505 mm |
Not Qualified |
COMPLEMENTARY |
4.2 V |
90 mA |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V |
e0 |
235 |
11.505 mm |
10E |
||||||||||||
Onsemi |
D LATCH |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
24 Amp |
FF/Latches |
.635 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
||||||||||||||||||||||||
|
STMicroelectronics |
D LATCH |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
4 |
TUBE |
5 |
5/15 |
50 pF |
IN-LINE |
DIP16,.3 |
500 ns |
FF/Latches |
2.54 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
20 V |
5.1 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
3 V |
PROGRAMMABLE TRIGGER TYPE |
e4 |
4000/14000/40000 |
||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
1 |
5 |
3/18 |
50 pF |
IN-LINE |
DIP16,.3 |
400 ns |
FF/Latches |
2.54 mm |
125 Cel |
LOW LEVEL |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
18 V |
5.08 mm |
7.62 mm |
Not Qualified |
TRUE |
3 V |
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH |
e0 |
4000/14000/40000 |
||||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
TR |
4.5 |
SMALL OUTLINE |
160 ns |
1.27 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
9.9 mm |
HC/UH |
|||||||||||||||||||||||
|
STMicroelectronics |
D LATCH |
FLAT |
16 |
DFP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
4 |
FLATPACK |
FL16,.3 |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-CDFP-F16 |
20 V |
2.38 mm |
6.91 mm |
3 V |
9.94 mm |
4000/14000/40000 |
|||||||||||||||||||||||||||
|
STMicroelectronics |
D LATCH |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
TR |
4.5 |
SMALL OUTLINE |
140 ns |
1.27 mm |
125 Cel |
LOW LEVEL |
-40 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
TRUE |
2 V |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
HC/UH |
||||||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
FLAT |
48 |
DFP |
RECTANGULAR |
300k Rad(Si) |
CERAMIC |
YES |
2 |
CMOS |
38535V;38534K;883S |
8 |
TR |
2.5/3.3 |
30 pF |
FLATPACK |
FL48,.4,25 |
8 Amp |
FF/Latches |
.635 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-XDFP-F48 |
Not Qualified |
|||||||||||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
5 |
2/6 |
50 pF |
CHIP CARRIER |
LDCC20,.4SQ |
36 ns |
4 Amp |
FF/Latches |
1.27 mm |
85 Cel |
HIGH LEVEL |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
6 V |
4.57 mm |
8.9662 mm |
Not Qualified |
TRUE |
2 V |
e0 |
8.9662 mm |
HC/UH |
|||||||||||||||||
|
STMicroelectronics |
D LATCH |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
5 |
2/6 |
50 pF |
CHIP CARRIER |
LDCC20,.4SQ |
31 ns |
4 Amp |
FF/Latches |
1.27 mm |
85 Cel |
HIGH LEVEL |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
6 V |
4.57 mm |
8.965 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e3 |
8.965 mm |
HC/UH |
||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
55 ns |
80 Amp |
FF/Latches |
.65 mm |
125 Cel |
OPEN-DRAIN |
LOW LEVEL |
-55 Cel |
DUAL |
R-PDSO-G16 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
INVERTED |
4.5 V |
1:8 DMUX FOLLOWED BY LATCH |
5 mm |
HCT |
||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
100k Rad(Si) |
CERAMIC |
NO |
2 |
CMOS |
ESCC9000 |
4 |
5/15 |
IN-LINE |
DIP24,.6 |
FF/Latches |
2.54 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
||||||||||||||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
2 |
CMOS |
2 |
5 |
2/6 |
50 pF |
IN-LINE |
DIP16,.3 |
32 ns |
4 Amp |
FF/Latches |
2.54 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
6 V |
5.08 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e0 |
HC/UH |
||||||||||||||||||
|
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
3.3 |
2/5.5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
13 ns |
4 Amp |
FF/Latches |
.65 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
TRUE |
2 V |
e3 |
30 |
260 |
2 mm |
74V |
|||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC |
NO |
1 |
CMOS |
8 |
5 |
5 |
50 pF |
IN-LINE |
DIP20,.3 |
6 Amp |
FF/Latches |
2.54 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
||||||||||||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
1 |
CMOS |
8 |
3/15 |
50 pF |
IN-LINE |
DIP16,.3 |
FF/Latches |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDIP-T16 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||
|
STMicroelectronics |
D LATCH |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
5 |
2/6 |
50 pF |
CHIP CARRIER |
LDCC20,.4SQ |
38 ns |
4 Amp |
FF/Latches |
1.27 mm |
85 Cel |
LOW LEVEL |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
6 V |
4.57 mm |
8.9662 mm |
Not Qualified |
TRUE |
2 V |
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH |
e3 |
8.9662 mm |
HC/UH |
|||||||||||||||
STMicroelectronics |
D LATCH |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TTL |
1 |
5 |
15 pF |
CHIP CARRIER |
24 ns |
1.27 mm |
70 Cel |
LOW LEVEL |
0 Cel |
QUAD |
S-PQCC-J20 |
5.25 V |
4.57 mm |
8.9662 mm |
Not Qualified |
TRUE |
4.75 V |
36 mA |
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH |
8.9662 mm |
LS |
|||||||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
1 |
3/15 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
FF/Latches |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G16 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||
STMicroelectronics |
D LATCH |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
2 |
TTL |
2 |
5 |
5 |
15 pF |
IN-LINE |
DIP16,.3 |
27 ns |
8 Amp |
FF/Latches |
2.54 mm |
70 Cel |
HIGH LEVEL |
0 Cel |
DUAL |
R-GDIP-T16 |
5.25 V |
5.08 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
4.75 V |
12 mA |
LS |
|||||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
TR |
4.5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
160 ns |
.65 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
DUAL |
R-PDSO-G16 |
6 V |
1.2 mm |
4.4 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
5 mm |
HC/UH |
|||||||||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
TR |
4.5 |
2/6 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
150 ns |
4 Amp |
FF/Latches |
.65 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
6 V |
1.2 mm |
4.4 mm |
Not Qualified |
TRUE |
2 V |
e0 |
5 mm |
HC/UH |
||||||||||||||||
STMicroelectronics |
D LATCH |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
8 |
IN-LINE |
DIP16,.3 |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T16 |
6 V |
3.83 mm |
7.62 mm |
2 V |
20.32 mm |
HC |
||||||||||||||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
2 |
CMOS |
1 |
5 |
2/6 |
50 pF |
IN-LINE |
DIP16,.3 |
36 ns |
4 Amp |
FF/Latches |
2.54 mm |
85 Cel |
HIGH LEVEL |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
6 V |
5 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e0 |
HC/UH |
||||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
50k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
NO |
2 |
CMOS |
2 |
4.5 |
2/6 |
50 pF |
IN-LINE |
DIP16,.3 |
190 ns |
4 Amp |
FF/Latches |
2.54 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T16 |
6 V |
3.83 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e0 |
20.32 mm |
HC/UH |
||||||||||||||||
|
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
4.5 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP14,.25 |
150 ns |
4 Amp |
FF/Latches |
1.27 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
2 V |
e4 |
8.65 mm |
HC/UH |
||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
5 |
2/6 |
50 pF |
CHIP CARRIER |
LDCC20,.4SQ |
40 ns |
4 Amp |
FF/Latches |
1.27 mm |
85 Cel |
HIGH LEVEL |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J20 |
6 V |
4.57 mm |
8.9662 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e0 |
8.9662 mm |
HC/UH |
|||||||||||||||||
|
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
TR |
4.5 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
190 ns |
4 Amp |
FF/Latches |
1.27 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e4 |
9.9 mm |
HC/UH |
||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
1 |
TTL |
8 |
5 |
5 |
15 pF |
IN-LINE |
DIP20,.3 |
12 Amp |
FF/Latches |
2.54 mm |
125 Cel |
3-STATE |
-55 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
40 mA |
||||||||||||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
5 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
41 ns |
4 Amp |
FF/Latches |
1.27 mm |
85 Cel |
LOW LEVEL |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
2 V |
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH |
e0 |
9.9 mm |
HC/UH |
||||||||||||||||
|
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TUBE |
5 |
5/15 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
400 ns |
FF/Latches |
1.27 mm |
125 Cel |
LOW LEVEL |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
20 V |
1.75 mm |
3.9 mm |
Not Qualified |
TRUE |
3 V |
1:8 DMUX FOLLOWED BY LATCH |
e4 |
9.9 mm |
4000/14000/40000 |
|||||||||||||||
|
STMicroelectronics |
D LATCH |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
CMOS |
2 |
4.5 |
2/6 |
50 pF |
IN-LINE |
DIP14,.3 |
150 ns |
4 Amp |
FF/Latches |
2.54 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
MATTE TIN |
DUAL |
R-PDIP-T14 |
6 V |
5.1 mm |
7.62 mm |
Not Qualified |
TRUE |
2 V |
e3 |
HC/UH |
|||||||||||||||||
STMicroelectronics |
D LATCH |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
TTL |
2 |
5 |
5 |
15 pF |
IN-LINE |
DIP16,.3 |
27 ns |
8 Amp |
FF/Latches |
2.54 mm |
70 Cel |
HIGH LEVEL |
0 Cel |
DUAL |
R-PDIP-T16 |
5.25 V |
5.1 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
4.75 V |
12 mA |
LS |
|||||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
4 |
5 |
IN-LINE |
500 ns |
2.54 mm |
85 Cel |
HIGH LEVEL |
-40 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
18 V |
5 mm |
7.62 mm |
COMPLEMENTARY |
3 V |
LG_MAX |
e0 |
20 mm |
4000/14000/40000 |
||||||||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
CMOS |
2 |
5 |
2/6 |
50 pF |
IN-LINE |
DIP16,.3 |
40 ns |
4 Amp |
FF/Latches |
2.54 mm |
85 Cel |
HIGH LEVEL |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
6 V |
5.1 mm |
7.62 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e0 |
HC/UH |
||||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
5 |
2/6 |
50 pF |
SMALL OUTLINE |
SOP16,.25 |
40 ns |
4 Amp |
FF/Latches |
1.27 mm |
85 Cel |
HIGH LEVEL |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
6 V |
1.75 mm |
3.9 mm |
Not Qualified |
COMPLEMENTARY |
2 V |
e0 |
9.9 mm |
HC/UH |
|||||||||||||||||
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
TR |
5 |
5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
50 ns |
4 Amp |
FF/Latches |
.65 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
DUAL |
R-PDSO-G16 |
5.5 V |
1.2 mm |
4.4 mm |
Not Qualified |
COMPLEMENTARY |
4.5 V |
5 mm |
HCT |
||||||||||||||||||
STMicroelectronics |
D LATCH |
INDUSTRIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
CMOS |
4 |
5/15 |
IN-LINE |
DIP24,.6 |
FF/Latches |
2.54 mm |
85 Cel |
3-STATE |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||
|
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
3.3 |
2/5.5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
13 ns |
4 Amp |
FF/Latches |
.95 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1.625 mm |
Not Qualified |
TRUE |
2 V |
e3 |
30 |
260 |
2.9 mm |
74V |
|||||||||||||
|
STMicroelectronics |
D LATCH |
MILITARY |
GULL WING |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR |
5 |
5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
9 ns |
8 Amp |
FF/Latches |
.95 mm |
125 Cel |
HIGH LEVEL |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1.625 mm |
Not Qualified |
TRUE |
4.5 V |
e4 |
30 |
260 |
2.9 mm |
74V |
Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.
A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.
Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.
Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.
Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.