BALL Latches & Flip-Flops 274

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Trigger Type	Terminal Finish	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
SSTUB32864EC/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	14		1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	1.5 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	2 V	1.5 mm	5.5 mm	Not Qualified	COMPLEMENTARY	1.7 V						13.5 mm	32864
SSTUB32865ET/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.5 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V						13 mm	32865
SSTUA32S865ET	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.8 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B160		2 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V			e0			13 mm	SSTU
SSTU32864EC/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		2 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	450 MHz	R-PBGA-B96	2	1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE				13.5 mm	SSTU
SSTV16857EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			14		2.5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.8 ns			.65 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B56		2.7 V	1 mm	4.5 mm	Not Qualified	TRUE	2.3 V						7 mm
SSTVF16859EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5	2.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2.5 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	210 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V						13.5 mm	SSTV
SSTV16857EV	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			14		2.5	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,6X10,25	2.8 ns		Other Logic ICs	.65 mm	70 Cel		POSITIVE EDGE	Tin/Lead (Sn63Pb37)	BOTTOM	200 MHz	R-PBGA-B56		2.7 V	1 mm	4.5 mm	Not Qualified	TRUE	2.3 V			e0			7 mm	SSTV
SSTV16859EC,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V				NOT SPECIFIED	NOT SPECIFIED	13.5 mm	SSTV
SSTV16859EC	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	13		2.5	2.5,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2.8 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	Tin/Lead (Sn63Pb37)	BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V			e0			13.5 mm	SSTV
SSTV16859EC/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm		TRUE	2.3 V						13.5 mm	SSTV
SSTVF16859EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	210 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm		TRUE	2.3 V						13.5 mm	SSTV
SSTV16859EC,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	13		2.5	2.5,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2.8 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V			e0			13.5 mm	SSTV
SSTV16859EC-T	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V						13.5 mm	SSTV
SSTV16859EC/GE	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm		TRUE	2.3 V						13.5 mm	SSTV
SSTVF16857EV,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			14		2.5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 ns			.65 mm	70 Cel		POSITIVE EDGE		BOTTOM	210 MHz	R-PBGA-B56		2.7 V	.97 mm	4.5 mm	Not Qualified	TRUE	2.3 V						7 mm	SSTV
SSTV16857EV,157	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			14		2.5	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,6X10,25	2.8 ns		Other Logic ICs	.65 mm	70 Cel		POSITIVE EDGE	Tin/Lead (Sn63Pb37)	BOTTOM	200 MHz	R-PBGA-B56		2.7 V	1 mm	4.5 mm	Not Qualified	TRUE	2.3 V			e0			7 mm	SSTV
SSTV16859EC/G,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm		TRUE	2.3 V						13.5 mm	SSTV
SSTVF16859EC,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	210 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm		TRUE	2.3 V						13.5 mm	SSTV
SSTVF16857EV	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			14		2.5	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,6X10,25	2.6 ns		Other Logic ICs	.65 mm	70 Cel		POSITIVE EDGE	Tin/Lead (Sn63Pb37)	BOTTOM	210 MHz	R-PBGA-B56		2.7 V	.97 mm	4.5 mm	Not Qualified	TRUE	2.3 V			e0			7 mm	SSTV
SSTV16859EC,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V				NOT SPECIFIED	NOT SPECIFIED	13.5 mm	SSTV
SSTV16859EC-S	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.8 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V						13.5 mm	SSTV
SSTVF16859EC,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			13		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	210 MHz	R-PBGA-B96		2.7 V	1.5 mm	5.5 mm		TRUE	2.3 V						13.5 mm	SSTV
PI74SSTUA32864NB	Diodes Incorporated	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	2 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	350 MHz	R-PBGA-B96	3	1.9 V	1.48 mm	5.5 mm	Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0			13.5 mm	SSTU
74SSTU32864DBF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8	GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
74SSTU32866BBFG	Renesas Electronics	D FLIP-FLOP		BALL	96		RECTANGULAR	PLASTIC/EPOXY	YES	1	270000000 Hz	TTL	25		1.8				2.15 ns				70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	270 MHz	R-PBGA-B96	3	1.9 V				TRUE	1.7 V	40 mA	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e1		260		SSTU
IDT74SSTUBF32866BBFG8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8	GRID ARRAY, FINE PITCH	BGA96,6X16,32	1.5 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V	1.81 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e1			13.5 mm	SSTU
HD74SSTV32852LBEL	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		TTL	24		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		3.1 ns			.8 mm	70 Cel		POSITIVE EDGE		BOTTOM	200 MHz	R-PBGA-B114		2.7 V	1.4 mm	5.5 mm	Not Qualified	TRUE	2.3 V						16 mm	SSTV
74SSTUBF32865ABKG8	Renesas Electronics	D FLIP-FLOP		BALL	160		RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	8	TR	1.8	1.8			3 ns	8 Amp	Other Logic ICs		70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B160	3	1.9 V			Not Qualified	TRUE	1.7 V	100 mA		e1	30	260		SSTU
IDT74SSTUBF32865ABKG8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	160	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.5 ns			.65 mm	70 Cel		POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B160	3	1.9 V	1.3 mm	9 mm	Not Qualified	TRUE	1.7 V			e1			13 mm	SSTU
ICSSSTUB32871AHT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			27		1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		3 ns			.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	410 MHz	R-PBGA-B96		1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	32871
ICSSSTV32852YFT-LF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			24		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		5 ns			.8 mm	70 Cel		POSITIVE EDGE	MATTE TIN	BOTTOM	200 MHz	R-PBGA-B114		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V			e3			16 mm	SSTV
ICSSSTVA32852YHLF-T	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			24		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		1.8 ns			.8 mm	70 Cel		POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	220 MHz	R-PBGA-B114		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V			e1			16 mm	SSTV
ICSSSTUAH32865AHLFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	160	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.9 ns			.65 mm	70 Cel		POSITIVE EDGE	MATTE TIN	BOTTOM	410 MHz	R-PBGA-B160		1.9 V	1.3 mm	9 mm	Not Qualified	TRUE	1.7 V			e3			13 mm	32865
ICSSSTUB32872AHT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA96,6X16,32	3 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	410 MHz	R-PBGA-B96		1.9 V	1.4 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e0			13.5 mm	32872
74SSTU32864GBF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	25		1.8	1.8	GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
74SSTUBF32869ABKG8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	150	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	14	TR	1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA150,11X19,25	3 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	340 MHz	R-PBGA-B150	3	1.9 V	1.2 mm	8 mm	Not Qualified	TRUE	1.7 V			e1		260	13 mm	32869
74SSTU32864DBF8	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8	GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
SSTUAF32866BHLFT	Renesas Electronics	D FLIP-FLOP		BALL	96		RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	25	TR	1.8				3 ns	6 Amp			70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V				TRUE	1.7 V	20 mA		e1		260		SSTU
ICSSSTUF32864YHLFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		2 ns			.8 mm	70 Cel		POSITIVE EDGE	MATTE TIN	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e3			13.5 mm	SSTU
74SSTUBF32866BBFG8	Renesas Electronics	D FLIP-FLOP		BALL	96		RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	25	TR	1.8	1.8			1.5 ns	8 Amp	Other Logic ICs		70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V	100 mA		e1		260		SSTU
SSTUAF32868BHLFT	Renesas Electronics	D FLIP-FLOP		BALL	176	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	28	TR	1.8		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA176,8X22,25	1.9 ns	6 Amp		.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B176	3	1.9 V	1.55 mm	6 mm		TRUE	1.7 V	10 mA		e1		260	15 mm	SSTU
ICSSSTV32852YFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	114	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			24		2.5		GRID ARRAY, LOW PROFILE, FINE PITCH		5 ns			.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	200 MHz	R-PBGA-B114		2.7 V	1.5 mm	5.5 mm	Not Qualified	TRUE	2.3 V			e0			16 mm	SSTV
ICSSSTU3286AHLF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.85 ns			.8 mm	70 Cel		POSITIVE EDGE	MATTE TIN	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e3			13.5 mm	SSTU
74SSTUBF32869ABKG	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	150	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	14	TRAY	1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA150,11X19,25	1.5 ns		Other Logic ICs	.65 mm	70 Cel		POSITIVE EDGE	TIN SILVER COPPER	BOTTOM	340 MHz	R-PBGA-B150	3	1.9 V	1.2 mm	8 mm	Not Qualified	TRUE	1.7 V			e1	30	260	13 mm	SSTU
74SSTU32864ABF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8	GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
ICSSSTUAH32868AHLFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	176	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.9 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	MATTE TIN	BOTTOM	410 MHz	R-PBGA-B176		1.9 V	1.55 mm	6 mm	Not Qualified	TRUE	1.7 V			e3			15 mm	32868
74SSTU32864CBF	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8	1.8	GRID ARRAY	BGA96,6X16,32	2.35 ns		Other Logic ICs	.8 mm	70 Cel		POSITIVE EDGE	TIN LEAD	BOTTOM	340 MHz	R-PBGA-B96	3	1.9 V			Not Qualified	TRUE	1.7 V		14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	e0	30	225		SSTU
ICSSSTU3286AHLFT	Renesas Electronics	D FLIP-FLOP	COMMERCIAL	BALL	96	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			25		1.8		GRID ARRAY, LOW PROFILE, FINE PITCH		1.85 ns			.8 mm	70 Cel		POSITIVE EDGE	MATTE TIN	BOTTOM	270 MHz	R-PBGA-B96		1.9 V	1.5 mm	5.5 mm	Not Qualified	TRUE	1.7 V			e3			13.5 mm	SSTU

Latches & Flip-Flops

Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.

A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.

Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.

Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.

Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.