HVBCC Logic Gates 120

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74LVC2G00GXX	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74AUP2G07GXZ	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.7 ns			125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1 mm	AUP/ULP/V
74AXP1T57GXX	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		225 ns			85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1.35 mm	AXP
74AUP2G32GX	Nexperia	OR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		23.7 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
74LVC2G32GX	Nexperia	OR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		2.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		11 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74AXP1T14GX	Nexperia	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		222 ns			85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	.8 mm	AXP
74LVC1G11GXZ	Nexperia	AND GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3	TR, 7 INCH	1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		21.5 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74AXP1T34GXH	Nexperia	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		210 ns			85 Cel	3-STATE	-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e3	30	260	.8 mm	AXP
74AXP1T14GXZ	Nexperia	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		222 ns			85 Cel	3-STATE	-40 Cel		BOTTOM	S-PBCC-B5		2.75 V	.35 mm	.8 mm	.7 V			NOT SPECIFIED	NOT SPECIFIED	.8 mm	AXP
74AUP2G08GXX	Nexperia	AND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
74AUP2G00GXX	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24.9 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V	.0014 mA	e4	30	260	1.35 mm	AUP/ULP/V
74AUP1G14GX4	Nexperia	INVERTER		BUTT	4	HVBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1		1.1	30 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC4,.03,32	20 ns	4 Amp	.4 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B4	1	3.6 V	.35 mm	.6 mm	.8 V	.0014 mA	e4	30	260	.6 mm	AUP/ULP/V
74LVC2G38GX	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		2.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.8 ns			125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74LVC2G08GXX	Nexperia	AND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	2.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		11.3 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74AXP1G09GXH	Nexperia	AND GATE	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		88 ns			85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	.8 mm	AXP
74AUP2G132GX	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		27.9 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
74AXP2G14GXZ	Nexperia	INVERTER	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		126 ns			85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
74AUP2G14GXZ	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1 mm	AUP/ULP/V
74AUP1G3208GXZ	Nexperia	OR-AND GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.1 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1 mm	AUP/ULP/V
74AXP1G97GXZ	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		148 ns			85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
74AUP2G34GXZ	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1 mm	AUP/ULP/V
74LVC2G32GXX	Nexperia	OR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	2.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		11 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74AXP2G07GXZ	Nexperia	BUFFER	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		82 ns			85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
74LV1T87GX	Nexperia	XNOR GATE	AUTOMOTIVE	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	2		5	30 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC4,.03,32	15.8 ns	8 Amp		125 Cel		-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	5.5 V	.35 mm	.8 mm	1.6 V	.01 mA	e3	30	260	.8 mm	LV/LV-A/LVX/H

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.