HVBCC Logic Gates 120

Reset All

Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Package Style (Meter)	Propagation Delay (tpd)	Maximum I (ol)	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
SN74LVC1G14DPWR	Texas Instruments	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	11 ns	32 Amp	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B5	1	5.5 V	.4 mm	.8 mm	1.65 V	.01 mA	e4	NOT SPECIFIED	260	.8 mm	LVC/LCX/Z
SN74LVC1G38DPWR	Texas Instruments	NAND GATE	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	10 ns	32 Amp	85 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B5	1	5.5 V	.4 mm	.8 mm	1.65 V		e4	30	260	.8 mm	LVC/LCX/Z
SN74LVC1GU04DPWR	Texas Instruments	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	5 ns	32 Amp	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B5	1	5.5 V	.4 mm	.8 mm	1.65 V	.01 mA	e4	NOT SPECIFIED	NOT SPECIFIED	.8 mm	LVC/LCX/Z
SN74LVC1G06DPWR	Texas Instruments	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	6.5 ns	32 Amp	85 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B5	1	5.5 V	.4 mm	.8 mm	1.65 V	.01 mA	e4	30	260	.8 mm	LVC/LCX/Z
74LVC2G04GXZ	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	9.5 ns		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74LVC2G34GXZ	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	10.8 ns		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-N6	1	5.5 V	.35 mm	.8 mm	1.65 V	.004 mA	e4	30	260	1 mm	LVC/LCX/Z
SN74AUP1G06DPWR	Texas Instruments	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	19.3 ns	4 Amp	85 Cel	OPEN-DRAIN	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B5	1	3.6 V	.4 mm	.8 mm	.8 V	.01 mA	e4	NOT SPECIFIED	260	.8 mm	AUP/ULP/V
74AXP1G57GXZ	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	125 ns		85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
74LVC2G07GXZ	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	8.4 ns		125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74AUP2G132GXX	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	27.9 ns		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
74AUP3G34GXX	Nexperia	INVERTER	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	1	TR, 7 INCH	1.1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	20.8 ns		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
PSN74AUP1G06DPWR	Texas Instruments	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	19.3 ns		85 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	S-PBCC-B5		3.6 V	.4 mm	.8 mm	.8 V					.8 mm	AUP/ULP/V
PSN74LVC1GU04DPWR	Texas Instruments	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	5 ns		85 Cel		-40 Cel		BOTTOM	S-PBCC-B5		5.5 V	.4 mm	.8 mm	1.65 V					.8 mm	LVC/LCX/Z
PSN74LVC1G06DPWR	Texas Instruments	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	6.5 ns		85 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	S-PBCC-B5		5.5 V	.4 mm	.8 mm	1.65 V					.8 mm	LVC/LCX/Z
2N7001TDPWR	Texas Instruments	BUFFER	AUTOMOTIVE	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1		1		1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	20 ns	12 Amp	125 Cel	3-STATE	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	BOTTOM	S-PBCC-B5	1	3.6 V	.4 mm	.8 mm	1.65 V	.0036 mA	e4	30	260	.8 mm	7001
SN74AUP1G14DPWR	Texas Instruments	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	20.5 ns	4 Amp	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B5	1	3.6 V	.4 mm	.8 mm	.8 V	.0009 mA	e4	30	260	.8 mm	AUP/ULP/V
SN74AUP1G17DPWR	Texas Instruments	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	19.8 ns	4 Amp	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B5	1	3.6 V	.4 mm	.8 mm	.8 V	.0009 mA	e4	NOT SPECIFIED	NOT SPECIFIED	.8 mm	AUP/ULP/V
74AUP2G00GX	NXP Semiconductors	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	24.9 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B8		3.6 V	.35 mm	.8 mm	.8 V					1.35 mm	AUP/ULP/V
74AXP1G17GX	NXP Semiconductors	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	136 ns		85 Cel		-40 Cel		BOTTOM	S-PBCC-B5		2.75 V	.35 mm	.8 mm	.7 V					.8 mm	AXP
74LVC1G16GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	11 ns		125 Cel		-40 Cel		BOTTOM	S-PBCC-B5		5.5 V	.35 mm	.8 mm	1.65 V					.8 mm	LVC/LCX/Z
74AXP2G07GX	NXP Semiconductors	BUFFER	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	82 ns		85 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm	.7 V					1 mm	AXP
74AUP1G3208GX	NXP Semiconductors	OR-AND GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	20.1 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm	.8 V					1 mm	AUP/ULP/V
74AXP1T57GX	NXP Semiconductors	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	225 ns		85 Cel		-40 Cel		BOTTOM	R-PBCC-B8		2.75 V	.35 mm	.8 mm	.7 V					1.35 mm	AXP
74AUP2G08GX	NXP Semiconductors	AND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	24 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B8		3.6 V	.35 mm	.8 mm	.8 V					1.35 mm	AUP/ULP/V
74AXP1T34GX	NXP Semiconductors	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	210 ns		85 Cel		-40 Cel		BOTTOM	S-PBCC-B5		2.75 V	.35 mm	.8 mm	.7 V					.8 mm	AXP
74AXP1T32GX	NXP Semiconductors	OR GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	222 ns		85 Cel		-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm	.7 V					1 mm	AXP
74LVC2G00GX	NXP Semiconductors	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		2.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	10.8 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B8		5.5 V	.35 mm	.8 mm	1.65 V					1.35 mm	LVC/LCX/Z
74LVC2G08GX	NXP Semiconductors	AND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		2.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	11.3 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B8		5.5 V	.35 mm	.8 mm	1.65 V					1.35 mm	LVC/LCX/Z
74LVC2G34GX	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	10.8 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm	1.65 V					1 mm	LVC/LCX/Z
74LVC1G332GX	NXP Semiconductors	OR GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	21.5 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm	1.65 V					1 mm	LVC/LCX/Z
74AUP2G16GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	20.8 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm	.8 V					1 mm	AUP/ULP/V
74AUP1G16GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	20.8 ns		125 Cel		-40 Cel		BOTTOM	S-PBCC-B5		3.6 V	.35 mm	.8 mm	.8 V					.8 mm	AUP/ULP/V
935307129147	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	152 ns		85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
935306257125	Nexperia	AND GATE	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	88 ns		85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	.8 mm	AXP
935308435115	Nexperia	AND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	2.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	11.3 ns		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
935307131125	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	148 ns		85 Cel		-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm	.7 V					1 mm	AXP
935304105125	Nexperia	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	136 ns		85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	.8 mm	AXP
935307076125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	9.5 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm	1.65 V					1 mm	LVC/LCX/Z
935307075125	Nexperia	OR GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	21.5 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm	1.65 V					1 mm	LVC/LCX/Z
935307131147	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	148 ns		85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
935307082147	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	10.8 ns		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
935308977147	Nexperia	OR GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	222 ns		125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
935308975125	Nexperia	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	222 ns		85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	.8 mm	AXP
935307133125	Nexperia	INVERTER	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	126 ns		85 Cel		-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm	.7 V					1 mm	AXP
935339797115	Nexperia	OR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	23.7 ns		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
935307098125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.1	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	20 ns		125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm	.8 V					1 mm	AUP/ULP/V
935307074147	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	125 ns		85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
935339801115	Nexperia	XOR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	12.4 ns		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.