HVBCC Logic Gates 120

Reset All
Part RoHS Manufacturer Logic IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Schmitt Trigger Surface Mount No. of Functions Technology Screening Level No. of Inputs No. of Bits Translation Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Load Capacitance (CL) Package Style (Meter) Package Equivalence Code Propagation Delay (tpd) Maximum I (ol) Sub-Category Terminal Pitch Maximum Operating Temperature Output Characteristics Minimum Operating Temperature Terminal Finish Terminal Position Control Type Minimum fmax JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Output Polarity Minimum Supply Voltage (Vsup) Maximum Power Supply Current (ICC) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Family

935307076147

Nexperia

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

9.5 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1 mm

LVC/LCX/Z

935307082125

Nexperia

BUFFER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

10.8 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B6

5.5 V

.35 mm

.8 mm

1.65 V

1 mm

LVC/LCX/Z

935307098147

Nexperia

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1 mm

AUP/ULP/V

935307096147

Nexperia

BUFFER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.7 ns

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1 mm

AUP/ULP/V

935307129125

Nexperia

MAJORITY LOGIC GATE

INDUSTRIAL

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

152 ns

85 Cel

-40 Cel

BOTTOM

R-PBCC-B6

2.75 V

.35 mm

.8 mm

.7 V

1 mm

AXP

935307077147

Nexperia

BUFFER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

8.4 ns

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1 mm

LVC/LCX/Z

935307079147

Nexperia

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

8.2 ns

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1 mm

LVC/LCX/Z

935307072147

Nexperia

BUFFER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.8 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1 mm

AUP/ULP/V

935307081125

Nexperia

AND GATE

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

21.5 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B6

5.5 V

.35 mm

.8 mm

1.65 V

1 mm

LVC/LCX/Z

935308434115

Nexperia

MAJORITY LOGIC GATE

INDUSTRIAL

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

225 ns

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

2.75 V

.35 mm

.8 mm

.7 V

e4

30

260

1.35 mm

AXP

935307075147

Nexperia

OR GATE

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

21.5 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1 mm

LVC/LCX/Z

935307097147

Nexperia

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.9 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1 mm

AUP/ULP/V

935307077125

Nexperia

BUFFER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

8.4 ns

125 Cel

OPEN-DRAIN

-40 Cel

BOTTOM

R-PBCC-B6

5.5 V

.35 mm

.8 mm

1.65 V

1 mm

LVC/LCX/Z

935307133147

Nexperia

INVERTER

INDUSTRIAL

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

126 ns

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

2.75 V

.35 mm

.8 mm

.7 V

e4

30

260

1 mm

AXP

935307097125

Nexperia

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.9 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B6

3.6 V

.35 mm

.8 mm

.8 V

1 mm

AUP/ULP/V

935339799115

Nexperia

NAND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

TR, 7 INCH

2.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

10.8 ns

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1.35 mm

LVC/LCX/Z

935308433115

Nexperia

AND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

24 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1.35 mm

AUP/ULP/V

935307038125

Nexperia

BUFFER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

82 ns

85 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-PBCC-B5

1

2.75 V

.35 mm

.8 mm

.7 V

e4

30

260

.8 mm

AXP

935307132125

Nexperia

BUFFER

INDUSTRIAL

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

82 ns

85 Cel

OPEN-DRAIN

-40 Cel

BOTTOM

R-PBCC-B6

2.75 V

.35 mm

.8 mm

.7 V

1 mm

AXP

935308975147

Nexperia

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

222 ns

85 Cel

3-STATE

-40 Cel

BOTTOM

S-PBCC-B5

2.75 V

.35 mm

.8 mm

.7 V

.8 mm

AXP

935339794115

Nexperia

INVERTER

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

1

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.8 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1.35 mm

AUP/ULP/V

935306695125

Nexperia

XOR GATE

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

164 ns

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-PBCC-B5

1

2.75 V

.35 mm

.8 mm

.7 V

e4

30

260

.8 mm

AXP

935307074125

Nexperia

MAJORITY LOGIC GATE

INDUSTRIAL

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

125 ns

85 Cel

-40 Cel

BOTTOM

R-PBCC-B6

2.75 V

.35 mm

.8 mm

.7 V

1 mm

AXP

935307132147

Nexperia

BUFFER

INDUSTRIAL

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

82 ns

85 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

2.75 V

.35 mm

.8 mm

.7 V

e4

30

260

1 mm

AXP

935308444115

Nexperia

NAND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

TR, 7 INCH

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

10.8 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1.35 mm

LVC/LCX/Z

935307079125

Nexperia

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

8.2 ns

125 Cel

OPEN-DRAIN

-40 Cel

BOTTOM

R-PBCC-B6

5.5 V

.35 mm

.8 mm

1.65 V

1 mm

LVC/LCX/Z

935308439115

Nexperia

NAND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

24.9 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1.35 mm

AUP/ULP/V

935339796115

Nexperia

NAND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

27.9 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1.35 mm

AUP/ULP/V

935307081147

Nexperia

AND GATE

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

21.5 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1 mm

LVC/LCX/Z

935308466147

Nexperia

OR-AND GATE

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.1 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1 mm

AUP/ULP/V

935307096125

Nexperia

BUFFER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.7 ns

125 Cel

OPEN-DRAIN

-40 Cel

BOTTOM

R-PBCC-B6

3.6 V

.35 mm

.8 mm

.8 V

1 mm

AUP/ULP/V

935307072125

Nexperia

BUFFER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.8 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B6

3.6 V

.35 mm

.8 mm

.8 V

1 mm

AUP/ULP/V

935306995125

Nexperia

BUFFER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

210 ns

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-PBCC-B5

1

2.75 V

.35 mm

.8 mm

.7 V

e4

30

260

.8 mm

AXP

74AXP1G17GXH

Nexperia

BUFFER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

136 ns

85 Cel

-40 Cel

TIN

BOTTOM

S-PBCC-B5

1

2.75 V

.35 mm

.8 mm

.7 V

e3

30

260

.8 mm

AXP

74AXP1T32GXZ

Nexperia

OR GATE

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

222 ns

125 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

2.75 V

.35 mm

.8 mm

.7 V

e4

30

260

1 mm

AXP

74AUP2G04GXZ

Nexperia

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.9 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1 mm

AUP/ULP/V

74AXP1T14GXH

Nexperia

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

222 ns

85 Cel

3-STATE

-40 Cel

TIN

BOTTOM

S-PBCC-B5

1

2.75 V

.35 mm

.8 mm

.7 V

e3

30

260

.8 mm

AXP

74LV1T34GX

Nexperia

BUFFER

AUTOMOTIVE

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

NO

YES

1

CMOS

1

5

30 pF

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC4,.03,32

12.8 ns

8 Amp

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-PBCC-B5

1

5.5 V

.35 mm

.8 mm

1.6 V

.01 mA

e4

30

260

.8 mm

LV/LV-A/LVX/H

74AXP1G86GXH

Nexperia

XOR GATE

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

164 ns

85 Cel

-40 Cel

TIN

BOTTOM

S-PBCC-B5

1

2.75 V

.35 mm

.8 mm

.7 V

e3

30

260

.8 mm

AXP

74AXP1G07GXH

Nexperia

BUFFER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

82 ns

85 Cel

OPEN-DRAIN

-40 Cel

TIN

BOTTOM

S-PBCC-B5

1

2.75 V

.35 mm

.8 mm

.7 V

e3

30

260

.8 mm

AXP

74AUP2G32GXX

Nexperia

OR GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

23.7 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1.35 mm

AUP/ULP/V

74LVC2G86GXX

Nexperia

XOR GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

12.4 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1.35 mm

LVC/LCX/Z

74AXP1G58GXZ

Nexperia

MAJORITY LOGIC GATE

INDUSTRIAL

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

152 ns

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

2.75 V

.35 mm

.8 mm

.7 V

e4

30

260

1 mm

AXP

74LVC2G06GXZ

Nexperia

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

8.2 ns

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1 mm

LVC/LCX/Z

74LVC1G332GXZ

Nexperia

OR GATE

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

21.5 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1 mm

LVC/LCX/Z

74LVC2G86GX

Nexperia

XOR GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

12.4 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1.35 mm

LVC/LCX/Z

74AUP3G34GX

Nexperia

INVERTER

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

YES

3

CMOS

1

1.1

30 pF

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.8 ns

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

3.6 V

.35 mm

.8 mm

.8 V

.0009 mA

e4

30

260

1.35 mm

AUP/ULP/V

74LVC2G38GXX

Nexperia

NAND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

TR, 7 INCH

2.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

10.8 ns

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1.35 mm

LVC/LCX/Z

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.