BUTT Logic Gates 163

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74LVC1G16GX	NXP Semiconductors	INVERTER	AUTOMOTIVE	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		11 ns				125 Cel		-40 Cel		BOTTOM	S-PBCC-B5		5.5 V	.35 mm	.8 mm		1.65 V				.8 mm	LVC/LCX/Z
74AXP2G07GX	NXP Semiconductors	BUFFER	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		82 ns				85 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm		.7 V				1 mm	AXP
74LVC3G16GM	NXP Semiconductors	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.8			CHIP CARRIER, VERY THIN PROFILE		10.8 ns				125 Cel		-40 Cel		BOTTOM	S-PBCC-B8		5.5 V	.5 mm	1.6 mm		1.65 V				1.6 mm	LVC/LCX/Z
74LVC2G08GM	NXP Semiconductors	AND GATE	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	2	CMOS	2	TR	1.8	3.3	50 pF	CHIP CARRIER, VERY THIN PROFILE	LCC8,.06SQ,20	11.3 ns	24 Amp	Gates	.5 mm	125 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	Not Qualified	1.65 V	e4	30	260	1.6 mm	LVC/LCX/Z
SLF4002L7	Infineon Technologies	NOR GATE	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	2		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7	1	3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V				1.6 mm
SLF4004L7	Infineon Technologies	INVERTER	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	1		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7		3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V				1.6 mm
SLF4007L7	Infineon Technologies	BUFFER	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	1		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7	1	3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V				1.6 mm
SLF4000L7	Infineon Technologies	NAND GATE	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	2		1.2	1.2/3.3	15 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7		3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V				1.6 mm
SLF4032L7	Infineon Technologies	OR GATE	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	2		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7		3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V				1.6 mm
SLF4008L7	Infineon Technologies	AND GATE	INDUSTRIAL	BUTT	7	VBCC	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	2		1.2	1.2/3.3		CHIP CARRIER, VERY THIN PROFILE	SOLCC6,.06,16		2 Amp	Gate	.4 mm	85 Cel		-40 Cel		BOTTOM	R-XBCC-B7	1	3.6 V	.41 mm	1.1 mm	Not Qualified	.9 V				1.6 mm
935307129147	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		152 ns				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	1 mm	AXP
935306257125	Nexperia	AND GATE	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		88 ns				85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	.8 mm	AXP
935308435115	Nexperia	AND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	2.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		11.3 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	1.35 mm	LVC/LCX/Z
935307131125	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		148 ns				85 Cel		-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm		.7 V				1 mm	AXP
935281443125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V	e4	30	260	1.6 mm	AUP/ULP/V
935304105125	Nexperia	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		136 ns				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	.8 mm	AXP
935307076125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9.5 ns				125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm		1.65 V				1 mm	LVC/LCX/Z
935307075125	Nexperia	OR GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		21.5 ns				125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm		1.65 V				1 mm	LVC/LCX/Z
935307131147	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		148 ns				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	1 mm	AXP
935307082147	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.8 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	1 mm	LVC/LCX/Z
935308977147	Nexperia	OR GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		222 ns				125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	1 mm	AXP
935308975125	Nexperia	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		222 ns				85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	.8 mm	AXP
935307133125	Nexperia	INVERTER	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		126 ns				85 Cel		-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm		.7 V				1 mm	AXP
935339797115	Nexperia	OR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		23.7 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm		.8 V	e4	30	260	1.35 mm	AUP/ULP/V
935307098125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20 ns				125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm		.8 V				1 mm	AUP/ULP/V
935307074147	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		125 ns				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	1 mm	AXP
935339801115	Nexperia	XOR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		12.4 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	1.35 mm	LVC/LCX/Z
935307076147	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		9.5 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	1 mm	LVC/LCX/Z
935307082125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.8 ns				125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm		1.65 V				1 mm	LVC/LCX/Z
935307098147	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V	e4	30	260	1 mm	AUP/ULP/V
935307096147	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.7 ns				125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V	e4	30	260	1 mm	AUP/ULP/V
935307553125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1			CHIP CARRIER, VERY THIN PROFILE		20.8 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm		.8 V	e4	30	260	1.6 mm	AUP/ULP/V
935307129125	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		152 ns				85 Cel		-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm		.7 V				1 mm	AXP
935307077147	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8.4 ns				125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	1 mm	LVC/LCX/Z
74AVC1T8128GS	Nexperia	NOR GATE	AUTOMOTIVE	BUTT	8	BCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2			CHIP CARRIER		14.3 ns			.35 mm	125 Cel	3-STATE	-40 Cel	TIN	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	1 mm		.8 V	e3	30	260	1.35 mm	AVC
935307079147	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8.2 ns				125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	1 mm	LVC/LCX/Z
935307072147	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.8 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V	e4	30	260	1 mm	AUP/ULP/V
935307081125	Nexperia	AND GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		21.5 ns				125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm		1.65 V				1 mm	LVC/LCX/Z
935308434115	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		225 ns				85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	1.35 mm	AXP
935307075147	Nexperia	OR GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3	TR, 7 INCH	1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		21.5 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	1 mm	LVC/LCX/Z
935307097147	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1	TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.9 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm		.8 V	e4	30	260	1 mm	AUP/ULP/V
935307077125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8.4 ns				125 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm		1.65 V				1 mm	LVC/LCX/Z
935307133147	Nexperia	INVERTER	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		126 ns				85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	1 mm	AXP
935307097125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.9 ns				125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm		.8 V				1 mm	AUP/ULP/V
935339799115	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	2.3			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.8 ns				125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm		1.65 V	e4	30	260	1.35 mm	LVC/LCX/Z
935308433115	Nexperia	AND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.1			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24 ns				125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm		.8 V	e4	30	260	1.35 mm	AUP/ULP/V
935307038125	Nexperia	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		82 ns				85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm		.7 V	e4	30	260	.8 mm	AXP
935307132125	Nexperia	BUFFER	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.2			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		82 ns				85 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm		.7 V				1 mm	AXP

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.