BUTT Logic Gates 163

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Part RoHS Manufacturer Logic IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Schmitt Trigger Surface Mount No. of Functions Technology Screening Level No. of Inputs No. of Bits Translation Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Load Capacitance (CL) Package Style (Meter) Package Equivalence Code Propagation Delay (tpd) Maximum I (ol) Sub-Category Terminal Pitch Maximum Operating Temperature Output Characteristics Minimum Operating Temperature Terminal Finish Terminal Position Control Type Minimum fmax JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Output Polarity Minimum Supply Voltage (Vsup) Maximum Power Supply Current (ICC) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Family

SN74LVC1G14DPWR

Texas Instruments

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

1

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

11 ns

32 Amp

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B5

1

5.5 V

.4 mm

.8 mm

1.65 V

.01 mA

e4

NOT SPECIFIED

260

.8 mm

LVC/LCX/Z

SN74LVC1G38DPWR

Texas Instruments

NAND GATE

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

10 ns

32 Amp

85 Cel

OPEN-DRAIN

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B5

1

5.5 V

.4 mm

.8 mm

1.65 V

e4

30

260

.8 mm

LVC/LCX/Z

SN74LVC1GU04DPWR

Texas Instruments

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 ns

32 Amp

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B5

1

5.5 V

.4 mm

.8 mm

1.65 V

.01 mA

e4

NOT SPECIFIED

NOT SPECIFIED

.8 mm

LVC/LCX/Z

SN74LVC1G06DPWR

Texas Instruments

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

6.5 ns

32 Amp

85 Cel

OPEN-DRAIN

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B5

1

5.5 V

.4 mm

.8 mm

1.65 V

.01 mA

e4

30

260

.8 mm

LVC/LCX/Z

74LVC2G04GXZ

Nexperia

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

9.5 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1 mm

LVC/LCX/Z

SN74AUP1G06DPWR

Texas Instruments

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

19.3 ns

4 Amp

85 Cel

OPEN-DRAIN

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B5

1

3.6 V

.4 mm

.8 mm

.8 V

.01 mA

e4

NOT SPECIFIED

260

.8 mm

AUP/ULP/V

74AXP1G57GXZ

Nexperia

MAJORITY LOGIC GATE

INDUSTRIAL

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

125 ns

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

2.75 V

.35 mm

.8 mm

.7 V

e4

30

260

1 mm

AXP

74LVC2G00GM,125

NXP Semiconductors

NAND GATE

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

NO

YES

2

CMOS

2

TR

2.3

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

10.8 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B8

1

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

1.6 mm

LVC/LCX/Z

74LVC2G07GXZ

Nexperia

BUFFER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

TR, 7 INCH

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

8.4 ns

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

5.5 V

.35 mm

.8 mm

1.65 V

e4

30

260

1 mm

LVC/LCX/Z

74LVC3G14GM,125

NXP Semiconductors

INVERTER

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

YES

YES

3

CMOS

1

TR

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

12 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B8

1

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

1.6 mm

LVC/LCX/Z

74AUP2G132GXX

Nexperia

NAND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

27.9 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1.35 mm

AUP/ULP/V

74AUP3G34GXX

Nexperia

INVERTER

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

3

CMOS

1

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.8 ns

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B8

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1.35 mm

AUP/ULP/V

PSN74AUP1G06DPWR

Texas Instruments

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

19.3 ns

85 Cel

OPEN-DRAIN

-40 Cel

BOTTOM

S-PBCC-B5

3.6 V

.4 mm

.8 mm

.8 V

.8 mm

AUP/ULP/V

PSN74LVC1GU04DPWR

Texas Instruments

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 ns

85 Cel

-40 Cel

BOTTOM

S-PBCC-B5

5.5 V

.4 mm

.8 mm

1.65 V

.8 mm

LVC/LCX/Z

PSN74LVC1G06DPWR

Texas Instruments

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

6.5 ns

85 Cel

OPEN-DRAIN

-40 Cel

BOTTOM

S-PBCC-B5

5.5 V

.4 mm

.8 mm

1.65 V

.8 mm

LVC/LCX/Z

SN74AUP1G14DPWR

Texas Instruments

INVERTER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.5 ns

4 Amp

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B5

1

3.6 V

.4 mm

.8 mm

.8 V

.0009 mA

e4

30

260

.8 mm

AUP/ULP/V

SN74AUP1G17DPWR

Texas Instruments

BUFFER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

19.8 ns

4 Amp

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B5

1

3.6 V

.4 mm

.8 mm

.8 V

.0009 mA

e4

NOT SPECIFIED

NOT SPECIFIED

.8 mm

AUP/ULP/V

2N7001TDPWR

Texas Instruments

BUFFER

AUTOMOTIVE

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

1

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20 ns

12 Amp

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

BOTTOM

S-PBCC-B5

1

3.6 V

.4 mm

.8 mm

1.65 V

.0036 mA

e4

30

260

.8 mm

7001

SN74LVC1G11DRY

Texas Instruments

AND GATE

AUTOMOTIVE

BUTT

6

VBCC

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

3

1.8

CHIP CARRIER, VERY THIN PROFILE

20 ns

.5 mm

125 Cel

-40 Cel

BOTTOM

R-XBCC-B6

5.5 V

.6 mm

1 mm

1.65 V

1.45 mm

LVC/LCX/Z

NL37WZ16MQ1TCG

Onsemi

BUFFER

MILITARY

BUTT

8

UBCC

SQUARE

PLASTIC/EPOXY

NO

YES

3

CMOS

1

TR

2.3

50 pF

CHIP CARRIER, ULTRA THIN PROFILE

LCC8,.06SQ,20

8.8 ns

24 Amp

.5 mm

125 Cel

-55 Cel

QUAD

S-PBCC-B8

1

5.5 V

.6 mm

1.6 mm

1.65 V

.01 mA

10

260

1.6 mm

LVC/LCX/Z

74LVC3G07GM,125

NXP Semiconductors

BUFFER

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

NO

YES

3

CMOS

1

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

8.4 ns

24 Amp

Gates

.5 mm

125 Cel

OPEN-DRAIN

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B8

1

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

1.6 mm

LVC/LCX/Z

74AUP1G3208GX

NXP Semiconductors

OR-AND GATE

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.1 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B6

3.6 V

.35 mm

.8 mm

.8 V

1 mm

AUP/ULP/V

74LVC2G02GM,125

NXP Semiconductors

NOR GATE

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

NO

YES

2

CMOS

2

TR

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

11.2 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B8

1

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

1.6 mm

LVC/LCX/Z

74AXP1G17GX,125

NXP Semiconductors

BUFFER

INDUSTRIAL

BUTT

5

VBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, VERY THIN PROFILE

136 ns

85 Cel

-40 Cel

BOTTOM

S-PBCC-B5

2.75 V

.35 mm

.8 mm

.7 V

.8 mm

AXP

74AXP1T57GX

NXP Semiconductors

MAJORITY LOGIC GATE

INDUSTRIAL

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

225 ns

85 Cel

-40 Cel

BOTTOM

R-PBCC-B8

2.75 V

.35 mm

.8 mm

.7 V

1.35 mm

AXP

74AUP2G38GM

NXP Semiconductors

NAND GATE

AUTOMOTIVE

BUTT

8

BCC

SQUARE

PLASTIC/EPOXY

NO

YES

2

CMOS

2

TR

1.1

1.2/3.3

30 pF

CHIP CARRIER

LCC8,.06SQ,20

24 ns

1.7 Amp

Gates

.55 mm

125 Cel

OPEN-DRAIN

-40 Cel

BOTTOM

S-PBCC-B8

1

3.6 V

.5 mm

1.6 mm

Not Qualified

.8 V

30

260

1.6 mm

AUP/ULP/V

74AUP2G08GX

NXP Semiconductors

AND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

24 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B8

3.6 V

.35 mm

.8 mm

.8 V

1.35 mm

AUP/ULP/V

74AXP1T34GX

NXP Semiconductors

BUFFER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

210 ns

85 Cel

-40 Cel

BOTTOM

S-PBCC-B5

2.75 V

.35 mm

.8 mm

.7 V

.8 mm

AXP

74LVC3G34GM,125

NXP Semiconductors

BUFFER

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

NO

YES

3

CMOS

1

TR

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

10.8 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B8

1

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

1.6 mm

LVC/LCX/Z

74AXP1T32GX

NXP Semiconductors

OR GATE

INDUSTRIAL

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

222 ns

85 Cel

-40 Cel

BOTTOM

R-PBCC-B6

2.75 V

.35 mm

.8 mm

.7 V

1 mm

AXP

74LVC2G00GX

NXP Semiconductors

NAND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

2.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

10.8 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B8

5.5 V

.35 mm

.8 mm

1.65 V

1.35 mm

LVC/LCX/Z

74LVC2G08GX

NXP Semiconductors

AND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

2.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

11.3 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B8

5.5 V

.35 mm

.8 mm

1.65 V

1.35 mm

LVC/LCX/Z

74LVC2G86GM,125

NXP Semiconductors

XOR GATE

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

NO

YES

2

CMOS

2

TR

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

12.4 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B8

1

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

1.6 mm

LVC/LCX/Z

74LVC3G04GM,125

NXP Semiconductors

INVERTER

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

NO

YES

3

CMOS

1

TR

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

9.5 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

S-PBCC-B8

1

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

1.6 mm

LVC/LCX/Z

74LVC2G08GM,115

NXP Semiconductors

AND GATE

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

NO

YES

2

CMOS

2

TR

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

11.3 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

BOTTOM

S-PBCC-B8

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

1.6 mm

LVC/LCX/Z

74LVC2G34GX

NXP Semiconductors

BUFFER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

10.8 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B6

5.5 V

.35 mm

.8 mm

1.65 V

1 mm

LVC/LCX/Z

74AUP3G17GM

NXP Semiconductors

BUFFER

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

YES

3

CMOS

1

1.1

CHIP CARRIER, VERY THIN PROFILE

20.1 ns

125 Cel

-40 Cel

BOTTOM

S-PBCC-B8

3.6 V

.5 mm

1.6 mm

.8 V

1.6 mm

AUP/ULP/V

74LVC3G17GM,125

NXP Semiconductors

BUFFER

AUTOMOTIVE

BUTT

8

VBCC

RECTANGULAR

PLASTIC/EPOXY

YES

YES

3

CMOS

1

TR

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

13.1 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

R-PBCC-B8

1

5.5 V

.5 mm

.95 mm

Not Qualified

1.65 V

e4

30

260

1.95 mm

LVC/LCX/Z

74LVC3G34GM,115

NXP Semiconductors

BUFFER

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

NO

YES

3

CMOS

1

TR

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

10.8 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

BOTTOM

S-PBCC-B8

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

1.6 mm

LVC/LCX/Z

74AUP3G16GM

NXP Semiconductors

BUFFER

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

YES

3

CMOS

1

1.1

CHIP CARRIER, VERY THIN PROFILE

20.8 ns

125 Cel

-40 Cel

BOTTOM

S-PBCC-B8

3.6 V

.5 mm

1.6 mm

.8 V

1.6 mm

AUP/ULP/V

74LVC1G332GX

NXP Semiconductors

OR GATE

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.8

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

21.5 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B6

5.5 V

.35 mm

.8 mm

1.65 V

1 mm

LVC/LCX/Z

74AUP2G16GX

NXP Semiconductors

INVERTER

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.8 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B6

3.6 V

.35 mm

.8 mm

.8 V

1 mm

AUP/ULP/V

74LVC1G99GM,125

NXP Semiconductors

MAJORITY LOGIC GATE

AUTOMOTIVE

BUTT

8

VBCC

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

4

TR

2.3

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

LCC8,.06SQ,20

38.5 ns

24 Amp

Gates

.5 mm

125 Cel

3-STATE

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

BOTTOM

R-PBCC-B8

1

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

1.6 mm

LVC/LCX/Z

74AUP1G16GX

NXP Semiconductors

INVERTER

AUTOMOTIVE

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

20.8 ns

125 Cel

-40 Cel

BOTTOM

S-PBCC-B5

3.6 V

.35 mm

.8 mm

.8 V

.8 mm

AUP/ULP/V

74AUP2G00GX

NXP Semiconductors

NAND GATE

AUTOMOTIVE

BUTT

8

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

2

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

24.9 ns

125 Cel

-40 Cel

BOTTOM

R-PBCC-B8

3.6 V

.35 mm

.8 mm

.8 V

1.35 mm

AUP/ULP/V

74AXP1G17GX

NXP Semiconductors

BUFFER

INDUSTRIAL

BUTT

5

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

136 ns

85 Cel

-40 Cel

BOTTOM

S-PBCC-B5

2.75 V

.35 mm

.8 mm

.7 V

.8 mm

AXP

74AUP3G14GM

NXP Semiconductors

INVERTER

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

YES

3

CMOS

1

1.1

CHIP CARRIER, VERY THIN PROFILE

20 ns

125 Cel

-40 Cel

BOTTOM

S-PBCC-B8

3.6 V

.5 mm

1.6 mm

.8 V

1.6 mm

AUP/ULP/V

74LVC3G34GM

NXP Semiconductors

BUFFER

AUTOMOTIVE

BUTT

8

VBCC

SQUARE

PLASTIC/EPOXY

NO

YES

3

CMOS

1

TR

1.8

3.3

50 pF

CHIP CARRIER, VERY THIN PROFILE

SOLCC8,.04,20

10.8 ns

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

BOTTOM

S-PBCC-B8

1

5.5 V

.5 mm

1.6 mm

Not Qualified

1.65 V

30

260

1.6 mm

LVC/LCX/Z

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.