BUTT Logic Gates 163

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
935308975147	Nexperia	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		222 ns			85 Cel	3-STATE	-40 Cel		BOTTOM	S-PBCC-B5		2.75 V	.35 mm	.8 mm	.7 V					.8 mm	AXP
935339794115	Nexperia	INVERTER	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	3	CMOS	1	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
935281444125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1		CHIP CARRIER, VERY THIN PROFILE		20.1 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm	.8 V		e4	30	260	1.6 mm	AUP/ULP/V
935306695125	Nexperia	XOR GATE	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		164 ns			85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	.8 mm	AXP
935307074125	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		125 ns			85 Cel		-40 Cel		BOTTOM	R-PBCC-B6		2.75 V	.35 mm	.8 mm	.7 V					1 mm	AXP
935307132147	Nexperia	BUFFER	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		82 ns			85 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
935308444115	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
935307079125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8.2 ns			125 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	R-PBCC-B6		5.5 V	.35 mm	.8 mm	1.65 V					1 mm	LVC/LCX/Z
935308439115	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		24.9 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
935339796115	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		27.9 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
935307081147	Nexperia	AND GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3	TR, 7 INCH	1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		21.5 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
935307608125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.8		CHIP CARRIER, VERY THIN PROFILE		10.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
935281442125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1		CHIP CARRIER, VERY THIN PROFILE		20.7 ns			125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm	.8 V		e4	30	260	1.6 mm	AUP/ULP/V
74AVC1T8832GS	Nexperia	OR GATE	AUTOMOTIVE	BUTT	8	BCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2		CHIP CARRIER		16 ns		.35 mm	125 Cel	3-STATE	-40 Cel	TIN	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	1 mm	.8 V		e3	30	260	1.35 mm	AVC
935308466147	Nexperia	OR-AND GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.1 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1 mm	AUP/ULP/V
935307096125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.7 ns			125 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm	.8 V					1 mm	AUP/ULP/V
935307072125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.8 ns			125 Cel		-40 Cel		BOTTOM	R-PBCC-B6		3.6 V	.35 mm	.8 mm	.8 V					1 mm	AUP/ULP/V
935306995125	Nexperia	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		210 ns			85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	.8 mm	AXP
74LV1T08GX	Nexperia	AND GATE	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		5		CHIP CARRIER, VERY THIN PROFILE		13.4 ns			125 Cel		-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	5.5 V	.35 mm	.8 mm	1.6 V		e3	30	260	.8 mm	LV/LV-A/LVX/H
74AXP1G17GXH	Nexperia	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		136 ns			85 Cel		-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e3	30	260	.8 mm	AXP
74AXP1T32GXZ	Nexperia	OR GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		222 ns			125 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
74AUP3G14GM,125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1		CHIP CARRIER, VERY THIN PROFILE		20 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm	.8 V		e4	30	260	1.6 mm	AUP/ULP/V
74LVC3G16GMH	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.8		CHIP CARRIER, VERY THIN PROFILE		10.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74AUP2G04GXZ	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.9 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1 mm	AUP/ULP/V
74AXP1T14GXH	Nexperia	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		222 ns			85 Cel	3-STATE	-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e3	30	260	.8 mm	AXP
74LV1T34GX	Nexperia	BUFFER	AUTOMOTIVE	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	1		5	30 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC4,.03,32	12.8 ns	8 Amp		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	5.5 V	.35 mm	.8 mm	1.6 V	.01 mA	e4	30	260	.8 mm	LV/LV-A/LVX/H
74AXP1G86GXH	Nexperia	XOR GATE	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	2		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		164 ns			85 Cel		-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e3	30	260	.8 mm	AXP
74AUP1T02GX	Nexperia	NOR GATE	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	2		3	30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,32	11.9 ns	4 Amp		125 Cel		-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	3.6 V	.35 mm	.8 mm	2.3 V	.0035 mA	e3	30	260	.8 mm	AUP/ULP/V
74LV1T00GX	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY	NO	YES	1	CMOS	2		5	30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,32	14.4 ns	8 Amp		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	5.5 V	.35 mm	.8 mm	1.6 V	.01 mA	e4	30	260	.8 mm	LV/LV-A/LVX/H
74AXP1G07GXH	Nexperia	BUFFER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		82 ns			85 Cel	OPEN-DRAIN	-40 Cel	TIN	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e3	30	260	.8 mm	AXP
74AUP2G32GXX	Nexperia	OR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		23.7 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
74LVC2G86GXX	Nexperia	XOR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		12.4 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74LV1T34GX,125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		5		CHIP CARRIER, VERY THIN PROFILE		12.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	5.5 V	.35 mm	.8 mm	1.6 V		e4	30	260	.8 mm	LV/LV-A/LVX/H
74AXP1G58GXZ	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		152 ns			85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1 mm	AXP
74LVC2G06GXZ	Nexperia	INVERTER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8.2 ns			125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74LVC1G332GXZ	Nexperia	OR GATE	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3	TR, 7 INCH	1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		21.5 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1 mm	LVC/LCX/Z
74LVC2G86GX	Nexperia	XOR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.8		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		12.4 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74AUP3G34GX	Nexperia	INVERTER	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY	YES	YES	3	CMOS	1		1.1	30 pF	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.8 ns		.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V	.0009 mA	e4	30	260	1.35 mm	AUP/ULP/V
74LVC2G38GXX	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	2.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.8 ns			125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74AUP3G16GMH	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1		CHIP CARRIER, VERY THIN PROFILE		20.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm	.8 V		e4	30	260	1.6 mm	AUP/ULP/V
74LVC2G00GXX	Nexperia	NAND GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2	TR, 7 INCH	3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		10.8 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74AUP2G07GXZ	Nexperia	BUFFER	AUTOMOTIVE	BUTT	6	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1	TR, 7 INCH	1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		20.7 ns			125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B6	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1 mm	AUP/ULP/V
74AXP1T57GXX	Nexperia	MAJORITY LOGIC GATE	INDUSTRIAL	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	3		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		225 ns			85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	1.35 mm	AXP
74AUP2G32GX	Nexperia	OR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		1.1		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		23.7 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	3.6 V	.35 mm	.8 mm	.8 V		e4	30	260	1.35 mm	AUP/ULP/V
74LVC2G32GX	Nexperia	OR GATE	AUTOMOTIVE	BUTT	8	HVBCC	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	2		2.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		11 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBCC-B8	1	5.5 V	.35 mm	.8 mm	1.65 V		e4	30	260	1.35 mm	LVC/LCX/Z
74AUP1T86GX	Nexperia	XOR GATE	AUTOMOTIVE	BUTT	5	VBCC	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS	2		3	30 pF	CHIP CARRIER, VERY THIN PROFILE	SOLCC4,.03,20	11.9 ns	4 Amp		125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	3.6 V	.35 mm	.8 mm	2.3 V	.0012 mA	e4	30	260	.8 mm	AUP/ULP/V
74AXP1T14GX	Nexperia	INVERTER	INDUSTRIAL	BUTT	5	HVBCC	SQUARE	PLASTIC/EPOXY		YES	1	CMOS	1		1.2		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		222 ns			85 Cel	3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B5	1	2.75 V	.35 mm	.8 mm	.7 V		e4	30	260	.8 mm	AXP
74AUP3G17GM,125	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	1		1.1		CHIP CARRIER, VERY THIN PROFILE		20.1 ns			125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm	.8 V		e4	30	260	1.6 mm	AUP/ULP/V

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.