DDR3L DRAM DRAM 768

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4B4G0446A-HYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

1073741824 words

8

YES

COMMON

1.35

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

1GX4

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

667 MHz

10 mm

Not Qualified

4294967296 bit

1.283 V

AUTO/SELF REFRESH

260

.015 Amp

8

12.5 mm

.3 ns

K4B2G1646F-BMMA0

Samsung

DDR3L DRAM

INDUSTRIAL

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX16

128M

-40 Cel

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

NOT SPECIFIED

NOT SPECIFIED

13.3 mm

K4B4G0846D-BMMA0

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

11 mm

K4B2G0846D-HYH9

Samsung

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

120 mA

268435456 words

8

YES

COMMON

1.35

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B78

2

1.45 V

1.2 mm

667 MHz

7.5 mm

Not Qualified

2147483648 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

.01 Amp

8

11 mm

.255 ns

K4B4G0846A-HYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

190 mA

536870912 words

8

YES

COMMON

1.35

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

667 MHz

10 mm

Not Qualified

4294967296 bit

1.283 V

AUTO/SELF REFRESH

260

.015 Amp

8

12.5 mm

.3 ns

K4B2G0846D-HYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

120 mA

268435456 words

8

YES

COMMON

1.35

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

667 MHz

7.5 mm

Not Qualified

2147483648 bit

1.283 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.01 Amp

8

11 mm

.25 ns

K4B2G0846D-HYK0

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

125 mA

268435456 words

8

COMMON

1.35

1.35

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

2147483648 bit

.01 Amp

8

.225 ns

K4B4G0846D-BMH90

Samsung

DDR3L DRAM

INDUSTRIAL

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

-40 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B2G0446E-BYH90

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

536870912 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

R-PBGA-B78

667 MHz

Not Qualified

2147483648 bit

.01 Amp

8

.255 ns

K4B2G0446Q-BYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX4

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

11 mm

K4B2G0846D-HYK0T

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

125 mA

268435456 words

8

COMMON

1.35

1.35

8

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

2147483648 bit

.01 Amp

8

.225 ns

K4B4G0846D-BYK00

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B4G1646D-BMK00

Samsung

DDR3L DRAM

INDUSTRIAL

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX16

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

PROGRAMMABLE CAS LATENCY; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

13.3 mm

K4B2G0446C-HYK0

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX4

512M

0 Cel

BOTTOM

1

R-PBGA-B78

3

1.45 V

1.2 mm

7.5 mm

Not Qualified

2147483648 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

260

11 mm

K4B4G0846A-HYF80

Samsung

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

150 mA

536870912 words

8

YES

COMMON

1.35

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX8

512M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

533 MHz

10 mm

Not Qualified

4294967296 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

260

.015 Amp

8

12.5 mm

.3 ns

K4B4G0846A-HYF8

Samsung

DDR3L DRAM

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

512MX8

512M

BOTTOM

1

R-PBGA-B78

3

1.45 V

1.2 mm

10 mm

Not Qualified

4294967296 bit

1.2825 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

260

12.5 mm

K4B8G1646D-MYK00

Samsung

DDR3L DRAM

OTHER

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX16

512M

0 Cel

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

8589934592 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

13.3 mm

K4B2G0846C-HYK0

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

0 Cel

BOTTOM

1

R-PBGA-B78

3

1.45 V

1.2 mm

7.5 mm

Not Qualified

2147483648 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

260

11 mm

K4B4G0846E-BMK00

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

11 mm

K4B2G1646Q-BHH90

Samsung

DDR3L DRAM

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

128MX16

128M

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH

13.3 mm

K4B4G0846D-BYMA0

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B2G0846C-HYH9

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

0 Cel

BOTTOM

1

R-PBGA-B78

3

1.45 V

1.2 mm

7.5 mm

Not Qualified

2147483648 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

260

11 mm

K4B2G0446D-HYF80

Samsung

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

110 mA

536870912 words

8

YES

COMMON

1.35

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

533 MHz

7.5 mm

Not Qualified

2147483648 bit

1.283 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.01 Amp

8

11 mm

.3 ns

K4B4G0446A-HYH9

Samsung

DDR3L DRAM

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

1GX4

1G

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

10 mm

Not Qualified

4294967296 bit

1.2825 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

12.5 mm

K4B4G0446A-HYK0T

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

185 mA

1073741824 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

1GX4

1G

0 Cel

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

4294967296 bit

260

.015 Amp

8

.225 ns

K4B2G0446D-HYK0

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

130 mA

536870912 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

R-PBGA-B78

800 MHz

Not Qualified

2147483648 bit

.01 Amp

8

.225 ns

K4B8G0446D-MYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

2147483648 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

2GX4

2G

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

8589934592 bit

1.283 V

AUTO/SELF REFRESH

11 mm

K4B2G0446D-HYF8

Samsung

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

110 mA

536870912 words

8

YES

COMMON

1.35

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

533 MHz

7.5 mm

Not Qualified

2147483648 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

.01 Amp

8

11 mm

.3 ns

K4B2G0446E-BYH9T

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

536870912 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

R-PBGA-B78

667 MHz

Not Qualified

2147483648 bit

.01 Amp

8

.255 ns

K4B8G0846D-MYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

1GX8

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

8589934592 bit

1.283 V

AUTO/SELF REFRESH

11 mm

K4B8G0846D-MYK00

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

1GX8

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

8589934592 bit

1.283 V

AUTO/SELF REFRESH

11 mm

K4B2G1646E-BYF80

Samsung

DDR3L DRAM

OTHER

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX16

128M

0 Cel

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

13.3 mm

K4B2G0846F-BYMA0

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B4G1646E-BYK00

Samsung

DDR3L DRAM

OTHER

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX16

256M

0 Cel

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

13.3 mm

K4B2G0846Q-BMH90

Samsung

DDR3L DRAM

INDUSTRIAL

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

-40 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B4G0446A-HYF80

Samsung

DDR3L DRAM

OTHER

78

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

145 mA

1073741824 words

8

YES

COMMON

1.35

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

1GX4

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

533 MHz

10 mm

Not Qualified

4294967296 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

260

.015 Amp

8

12.5 mm

.3 ns

K4B2G1646Q-BYK00

Samsung

DDR3L DRAM

OTHER

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX16

128M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

PROGRAMMABLE CAS LATENCY; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

13.3 mm

.225 ns

K4B2G0846F-BMMA0

Samsung

DDR3L DRAM

INDUSTRIAL

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

-40 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B4G0446A-HYF8T

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

145 mA

1073741824 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

1GX4

1G

0 Cel

BOTTOM

R-PBGA-B78

533 MHz

Not Qualified

4294967296 bit

260

.015 Amp

8

.3 ns

K4B2G1646Q-BMH90

Samsung

DDR3L DRAM

INDUSTRIAL

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX16

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

PROGRAMMABLE CAS LATENCY; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

13.3 mm

.255 ns

K4B2G0446D-HYH9T

Samsung

DDR3L DRAM

OTHER

78

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

125 mA

536870912 words

8

COMMON

1.35

1.35

4

GRID ARRAY, FINE PITCH

BGA78,9X13,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX4

512M

0 Cel

BOTTOM

R-PBGA-B78

667 MHz

Not Qualified

2147483648 bit

.01 Amp

8

.255 ns

K4B4G0846E-BMMA0

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

11 mm

K4B2G0846Q-BYMA0

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

11 mm

K4B2G1646Q-BHK00

Samsung

DDR3L DRAM

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

128MX16

128M

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH

13.3 mm

K4B4G0446A-HYF8

Samsung

DDR3L DRAM

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

1GX4

1G

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

10 mm

Not Qualified

4294967296 bit

1.2825 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

12.5 mm

K4B2G0446C-HYH9

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

4

GRID ARRAY

.8 mm

85 Cel

512MX4

512M

0 Cel

BOTTOM

1

R-PBGA-B78

3

1.45 V

1.2 mm

7.5 mm

Not Qualified

2147483648 bit

1.2825 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

260

11 mm

K4B4G0846Q-HYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

10 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B2G1646Q-BYMA0

Samsung

DDR3L DRAM

OTHER

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

128MX16

128M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

PROGRAMMABLE CAS LATENCY; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

13.3 mm

.195 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.