Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
SYNCHRONOUS GRAPHICS RAM |
170 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
134217728 words |
YES |
1.35 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
16 |
.8 mm |
128MX32 |
128M |
BOTTOM |
1 |
R-PBGA-B170 |
1.3905 V |
1.2 mm |
12 mm |
4294967296 bit |
1.3095 V |
AUTO/SELF REFRESH, ALSO OPERATES AT 1.6V, 1.55V, 1.5V NOMINAL SUPPLY |
14 mm |
||||||||||||||||||||||||||||
|
Micron Technology |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
180 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
YES |
1.25 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
95 Cel |
256MX32 |
256M |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1 |
R-PBGA-B180 |
1.2875 V |
1.2 mm |
12 mm |
8589934592 bit |
1.2125 V |
AUTO/SELF REFRESH |
e1 |
30 |
260 |
14 mm |
||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
QFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
260 mA |
1048576 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK |
QFP100,.7X.9 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
3 mm |
166 MHz |
14 mm |
Not Qualified |
33554432 bit |
3.135 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
4,8 |
20 mm |
5.5 ns |
||||||||||||
|
Micron Technology |
SYNCHRONOUS GRAPHICS RAM |
190 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
YES |
1.35 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
256MX32 |
256M |
BOTTOM |
1 |
R-PBGA-B190 |
1.3905 V |
1.2 mm |
10 mm |
8589934592 bit |
1.3095 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
|||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
QFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
290 mA |
1048576 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK |
QFP100,.7X.9 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
3 mm |
200 MHz |
14 mm |
Not Qualified |
33554432 bit |
3.135 V |
e0 |
.002 Amp |
4,8 |
20 mm |
4.5 ns |
||||||||||||||
Micron Technology |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
180 mA |
262144 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
84 MHz |
14 mm |
Not Qualified |
8388608 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
20 mm |
12.5 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B136 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.9 V |
AUTO/SELF REFRESH |
14 mm |
.25 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.25 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.9 V |
AUTO/SELF REFRESH |
11 mm |
.45 ns |
|||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B136 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.9 V |
AUTO/SELF REFRESH |
14 mm |
.25 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.25 ns |
||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.35 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B136 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.9 V |
AUTO/SELF REFRESH |
14 mm |
.22 ns |
|||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B136 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.9 V |
AUTO/SELF REFRESH |
14 mm |
.22 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.35 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
200 mA |
524288 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX32 |
512K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
143 MHz |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
20 mm |
5.5 ns |
||||||||||||
|
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.28 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.9 V |
AUTO/SELF REFRESH |
11 mm |
.4 ns |
|||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
190 mA |
524288 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX32 |
512K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
125 MHz |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
20 mm |
6 ns |
||||||||||||
|
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.9 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.28 ns |
||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
1.8 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
1.9 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.7 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.28 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
200 mA |
524288 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX32 |
512K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
20 mm |
5.5 ns |
||||||||||||
|
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX32 |
16M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
536870912 bit |
1.9 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.35 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.9 V |
AUTO/SELF REFRESH |
11 mm |
.4 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
136 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
8MX32 |
8M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B136 |
2.1 V |
1.2 mm |
11 mm |
Not Qualified |
268435456 bit |
1.9 V |
AUTO/SELF REFRESH |
e1 |
14 mm |
.28 ns |
||||||||||||||||||||||
Toshiba |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
524288 words |
YES |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
512KX32 |
512K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.27 mm |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
20 mm |
7.5 ns |
|||||||||||||||||||||||
Toshiba |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
524288 words |
YES |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
512KX32 |
512K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.27 mm |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
20 mm |
8 ns |
|||||||||||||||||||||||
Toshiba |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
524288 words |
YES |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
512KX32 |
512K |
0 Cel |
QUAD |
1 |
R-PQFP-G100 |
1 |
3.6 V |
1.27 mm |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
20 mm |
7.5 ns |
||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
524288 words |
YES |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
512KX32 |
512K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.27 mm |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
20 mm |
8 ns |
|||||||||||||||||||||||
Toshiba |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
524288 words |
YES |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
512KX32 |
512K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.27 mm |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
20 mm |
9 ns |
|||||||||||||||||||||||
Toshiba |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
524288 words |
YES |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
512KX32 |
512K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.27 mm |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
20 mm |
9 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
QFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
200 mA |
1048576 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK |
QFP100,.7X.9 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
3 mm |
125 MHz |
14 mm |
Not Qualified |
33554432 bit |
3 V |
e0 |
.002 Amp |
4,8 |
20 mm |
6 ns |
||||||||||||||
|
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
66 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
245 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
65 Cel |
3-STATE |
8MX16 |
8M |
0 Cel |
TIN BISMUTH |
DUAL |
1 |
R-PDSO-G66 |
3 |
2.625 V |
1.2 mm |
200 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
e6 |
.045 Amp |
2,4,8 |
22.22 mm |
.7 ns |
||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
TQFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
200 mA |
1048576 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, THIN PROFILE |
TQFP100,.7X.9,25 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.2 mm |
125 MHz |
14 mm |
Not Qualified |
33554432 bit |
3 V |
e0 |
.002 Amp |
4,8 |
20 mm |
6 ns |
||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
66 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
290 mA |
8388608 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
65 Cel |
3-STATE |
8MX16 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.625 V |
1.2 mm |
300 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.375 V |
AUTO/SELF REFRESH |
30 |
240 |
.045 Amp |
2,4,8 |
22.22 mm |
.6 ns |
||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
QFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
270 mA |
1048576 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK |
QFP100,.7X.9 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
3 mm |
183 MHz |
14 mm |
Not Qualified |
33554432 bit |
3.135 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
4,8 |
20 mm |
5 ns |
||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
TQFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
270 mA |
1048576 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, THIN PROFILE |
TQFP100,.7X.9,25 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.2 mm |
183 MHz |
14 mm |
Not Qualified |
33554432 bit |
3.135 V |
e0 |
.002 Amp |
4,8 |
20 mm |
5 ns |
||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
262144 words |
YES |
3.3 |
32 |
FLATPACK |
.65 mm |
70 Cel |
256KX32 |
256K |
0 Cel |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
3 mm |
14 mm |
Not Qualified |
8388608 bit |
3 V |
AUTO/SELF REFRESH |
20 mm |
6 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
96 |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
1.8 |
32 |
GRID ARRAY |
32MX32 |
32M |
BOTTOM |
1 |
X-PBGA-B96 |
1.9 V |
1073741824 bit |
1.7 V |
||||||||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
TQFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
300 mA |
2097152 words |
2,4,8,FP |
YES |
COMMON |
3.3 |
2.5,3.3 |
32 |
FLATPACK, THIN PROFILE |
TQFP100,.7X.9,25 |
DRAMs |
.65 mm |
65 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.2 mm |
100 MHz |
14 mm |
Not Qualified |
67108864 bit |
3.135 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
2,4,8 |
20 mm |
6 ns |
||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
TQFP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
2097152 words |
YES |
3.3 |
32 |
FLATPACK, THIN PROFILE |
.65 mm |
65 Cel |
2MX32 |
2M |
0 Cel |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.2 mm |
14 mm |
Not Qualified |
67108864 bit |
3.135 V |
AUTO/SELF REFRESH |
20 mm |
6 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
262144 words |
YES |
3.3 |
32 |
FLATPACK |
.65 mm |
70 Cel |
256KX32 |
256K |
0 Cel |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
3 mm |
14 mm |
Not Qualified |
8388608 bit |
3 V |
AUTO REFRESH/SELF REFRESH |
20 mm |
6 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
OTHER |
84 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX16 |
64M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B84 |
1.9 V |
1.2 mm |
7.5 mm |
Not Qualified |
1073741824 bit |
1.7 V |
AUTO/SELF REFRESH |
12.5 mm |
.35 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
TQFP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
290 mA |
1048576 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, THIN PROFILE |
TQFP100,.7X.9,25 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.2 mm |
200 MHz |
14 mm |
Not Qualified |
33554432 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
4,8 |
20 mm |
4.5 ns |
||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
TQFP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
2097152 words |
YES |
3.3 |
32 |
FLATPACK, THIN PROFILE |
.65 mm |
65 Cel |
2MX32 |
2M |
0 Cel |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.2 mm |
14 mm |
Not Qualified |
67108864 bit |
3.135 V |
AUTO/SELF REFRESH |
20 mm |
6 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
TQFP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
2097152 words |
YES |
3.3 |
32 |
FLATPACK, THIN PROFILE |
.65 mm |
65 Cel |
2MX32 |
2M |
0 Cel |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.2 mm |
14 mm |
Not Qualified |
67108864 bit |
3.135 V |
AUTO/SELF REFRESH |
20 mm |
5.5 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
524288 words |
YES |
3.3 |
32 |
FLATPACK |
.65 mm |
70 Cel |
512KX32 |
512K |
0 Cel |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
3 mm |
14 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
20 mm |
4.5 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
TQFP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
280 mA |
262144 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, THIN PROFILE |
TQFP100,.7X.9,25 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.2 mm |
125 MHz |
14 mm |
Not Qualified |
8388608 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
4,8 |
20 mm |
6.5 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.