Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
800 mA |
4194304 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
4MX8 |
4M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.2946 mm |
Not Qualified |
33554432 bit |
.008 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
720 mA |
4194304 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
4MX8 |
4M |
0 Cel |
SINGLE |
R-PSMA-N30 |
24.0284 mm |
Not Qualified |
33554432 bit |
.008 Amp |
100 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
900 mA |
4194304 words |
COMMON |
5 |
5 |
9 |
SIP30 |
DRAMs |
70 Cel |
3-STATE |
4MX9 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
26.289 mm |
Not Qualified |
37748736 bit |
e0 |
.009 Amp |
70 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
800 mA |
4194304 words |
COMMON |
5 |
5 |
8 |
SIP30 |
DRAMs |
70 Cel |
3-STATE |
4MX8 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
20.2946 mm |
Not Qualified |
33554432 bit |
e0 |
.008 Amp |
70 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
720 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
19.9898 mm |
Not Qualified |
8388608 bit |
.008 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
720 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
21.6154 mm |
Not Qualified |
9437184 bit |
e0 |
.003 Amp |
70 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
120 mA |
262144 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.7894 mm |
Not Qualified |
2097152 bit |
.002 Amp |
100 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
720 mA |
4194304 words |
COMMON |
5 |
5 |
9 |
SIP30 |
DRAMs |
70 Cel |
3-STATE |
4MX9 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
26.289 mm |
Not Qualified |
37748736 bit |
e0 |
.009 Amp |
60 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
330 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
18.2626 mm |
Not Qualified |
9437184 bit |
e0 |
.003 Amp |
60 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
630 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
19.9898 mm |
Not Qualified |
9437184 bit |
.003 Amp |
80 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
810 mA |
4194304 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
4MX9 |
4M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.2946 mm |
Not Qualified |
37748736 bit |
.009 Amp |
80 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
280 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.6624 mm |
Not Qualified |
9437184 bit |
.003 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
PAGE MODE DRAM |
COMMERCIAL |
30 |
SIMM |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
NO LEAD |
262144 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.7894 mm |
Not Qualified |
2097152 bit |
150 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
PAGE MODE DRAM |
COMMERCIAL |
30 |
SIMM |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
210 mA |
262144 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX9 |
256K |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.7894 mm |
Not Qualified |
2359296 bit |
.003 Amp |
80 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
450 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
24.0284 mm |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
120 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
NIBBLE MODE DRAM |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
450 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
Not Qualified |
9437184 bit |
e0 |
.009 Amp |
120 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
240 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.6624 mm |
Not Qualified |
8388608 bit |
.002 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
160 mA |
262144 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.7894 mm |
Not Qualified |
2097152 bit |
.002 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
810 mA |
4194304 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
4MX9 |
4M |
0 Cel |
SINGLE |
R-PSMA-N30 |
24.0284 mm |
Not Qualified |
37748736 bit |
.009 Amp |
80 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
160 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.51 mm |
Not Qualified |
8388608 bit |
.002 Amp |
100 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
200 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.6624 mm |
Not Qualified |
8388608 bit |
.002 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
160 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
17.78 mm |
Not Qualified |
8388608 bit |
e0 |
.002 Amp |
100 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
PAGE MODE DRAM |
COMMERCIAL |
30 |
SIMM |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
NO LEAD |
262144 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX9 |
256K |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.7894 mm |
Not Qualified |
2359296 bit |
120 ns |
|||||||||||||||||||||||||||||
Renesas Electronics |
NIBBLE MODE DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
630 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
9437184 bit |
.009 Amp |
80 ns |
||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
220 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
18.2626 mm |
Not Qualified |
9437184 bit |
e0 |
.003 Amp |
100 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
480 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
21.6154 mm |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
100 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
1080 mA |
4194304 words |
COMMON |
5 |
5 |
9 |
SIP30 |
DRAMs |
70 Cel |
3-STATE |
4MX9 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
26.289 mm |
Not Qualified |
37748736 bit |
e0 |
.009 Amp |
60 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
200 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.6624 mm |
Not Qualified |
8388608 bit |
.002 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
200 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.6624 mm |
Not Qualified |
8388608 bit |
.002 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
640 mA |
4194304 words |
COMMON |
5 |
5 |
8 |
SIP30 |
DRAMs |
70 Cel |
3-STATE |
4MX8 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
20.2946 mm |
Not Qualified |
33554432 bit |
e0 |
.008 Amp |
100 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
160 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.51 mm |
Not Qualified |
8388608 bit |
.002 Amp |
100 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
720 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
19.9898 mm |
Not Qualified |
9437184 bit |
.003 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
NIBBLE MODE DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
450 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
9437184 bit |
.009 Amp |
120 ns |
||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
810 mA |
4194304 words |
COMMON |
5 |
5 |
9 |
SIP30 |
DRAMs |
70 Cel |
3-STATE |
4MX9 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
26.289 mm |
Not Qualified |
37748736 bit |
e0 |
.009 Amp |
80 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
640 mA |
4194304 words |
COMMON |
5 |
5 |
8 |
SIP30 |
DRAMs |
70 Cel |
3-STATE |
4MX8 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
24.0284 mm |
Not Qualified |
33554432 bit |
e0 |
.008 Amp |
100 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
280 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
18.2626 mm |
Not Qualified |
9437184 bit |
e0 |
.003 Amp |
70 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
900 mA |
4194304 words |
COMMON |
5 |
5 |
9 |
SIP30 |
DRAMs |
70 Cel |
3-STATE |
4MX9 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
26.289 mm |
Not Qualified |
37748736 bit |
e0 |
.009 Amp |
70 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
630 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
21.6154 mm |
Not Qualified |
9437184 bit |
e0 |
.003 Amp |
80 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
NIBBLE MODE DRAM |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
480 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
Not Qualified |
8388608 bit |
.008 Amp |
100 ns |
||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
180 mA |
262144 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.7894 mm |
Not Qualified |
2097152 bit |
.002 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
540 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
19.9898 mm |
Not Qualified |
9437184 bit |
.003 Amp |
100 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
960 mA |
4194304 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
4MX8 |
4M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.2946 mm |
Not Qualified |
33554432 bit |
.008 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
1024 |
PLASTIC/EPOXY |
NO |
CMOS |
720 mA |
4194304 words |
COMMON |
5 |
5 |
9 |
SIP30 |
DRAMs |
70 Cel |
3-STATE |
4MX9 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
26.289 mm |
Not Qualified |
37748736 bit |
e0 |
.009 Amp |
100 ns |
|||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
240 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.6624 mm |
Not Qualified |
8388608 bit |
.002 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
810 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
19.9898 mm |
Not Qualified |
9437184 bit |
.003 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
400 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
19.9898 mm |
Not Qualified |
8388608 bit |
.008 Amp |
120 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
240 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.6624 mm |
Not Qualified |
8388608 bit |
.002 Amp |
60 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
PAGE MODE DRAM |
COMMERCIAL |
30 |
SIMM |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
NO LEAD |
262144 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX9 |
256K |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.7894 mm |
Not Qualified |
2359296 bit |
150 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.