60 DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

TC59LM905AMG-55

Toshiba

DDR1 DRAM

COMMERCIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

182 MHz

Not Qualified

536870912 bit

2,4

.75 ns

TC59LM805AMG-60

Toshiba

DDR1 DRAM

COMMERCIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

166 MHz

Not Qualified

536870912 bit

2,4

.85 ns

TC59SM804CMB-70

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

3.3

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

64MX4

64M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

5.4 ns

TC59SM808CMBL-80

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX8

32M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

6 ns

TC59LM818DMGI-40

Toshiba

DDR1 DRAM

INDUSTRIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

16777216 words

2,4

COMMON

1.8,2.5

18

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

16MX18

16M

-40 Cel

BOTTOM

R-PBGA-B60

200 MHz

Not Qualified

301989888 bit

2,4

.6 ns

TC59LM818DMB-30

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

18

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX18

16M

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

e0

16.5 mm

.5 ns

TC59SM816CMBL-80

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

6 ns

TC59LM818DMGI-37

Toshiba

DDR1 DRAM

INDUSTRIAL

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

420 mA

16777216 words

2,4

COMMON

2.5

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

16MX18

16M

-40 Cel

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

266 MHz

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

16.5 mm

.65 ns

TH5D164000A

Toshiba

DRAM CARD

60

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

4194304 words

16

MICROELECTRONIC ASSEMBLY

4MX16

4M

UNSPECIFIED

1

X-XXMA-X60

Not Qualified

67108864 bit

80 ns

TC59LM818DMG-33

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

2,4

YES

COMMON

2.5

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

16MX18

16M

0 Cel

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

222 MHz

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

16.5 mm

.5 ns

TC59LM914AMB-45

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

33554432 words

2,4

YES

COMMON

2.5

1.5/1.8,2.5

16

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

222 MHz

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e0

2,4

16.5 mm

22 ns

TC59SM804CMBL-75

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

3.3

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

64MX4

64M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

5.4 ns

TC59LM805AMG-50

Toshiba

DDR1 DRAM

COMMERCIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

200 MHz

Not Qualified

536870912 bit

2,4

.65 ns

TC59SM808CMB-75

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX8

32M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

5.4 ns

TC59SM808CMBL-75

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX8

32M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

5.4 ns

TC59LM818DMBI-40

Toshiba

DDR1 DRAM

INDUSTRIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

16777216 words

2,4

COMMON

1.8,2.5

18

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

16MX18

16M

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B60

200 MHz

Not Qualified

301989888 bit

e0

2,4

.6 ns

TC59LM818DMG-40

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

2,4

YES

COMMON

2.5

1.8,2.5

18

GRID ARRAY, THIN PROFILE

BGA60,6X15,40

DRAMs

1 mm

85 Cel

3-STATE

16MX18

16M

0 Cel

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

200 MHz

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

2,4

16.5 mm

.65 ns

TC59LM818DMBI-37

Toshiba

DDR1 DRAM

INDUSTRIAL

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

16777216 words

2.5

18

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

16MX18

16M

-40 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

9 mm

Not Qualified

301989888 bit

2.375 V

AUTO REFRESH

e0

16.5 mm

.65 ns

TH5D182000A

Toshiba

DRAM CARD

60

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

2097152 words

18

MICROELECTRONIC ASSEMBLY

2MX18

2M

UNSPECIFIED

1

X-XXMA-X60

Not Qualified

37748736 bit

80 ns

TC59LM913AMG-55

Toshiba

DDR1 DRAM

COMMERCIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

33554432 words

2,4

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B60

182 MHz

Not Qualified

536870912 bit

2,4

.75 ns

TC59SM804CMB-80

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

3.3

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

64MX4

64M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

6 ns

TC59LM813AMG-50

Toshiba

DDR1 DRAM

COMMERCIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

33554432 words

2,4

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B60

200 MHz

Not Qualified

536870912 bit

2,4

.65 ns

TC59LM906AMB-37

Toshiba

DDR1 DRAM

OTHER

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

MOS

BALL

SYNCHRONOUS

67108864 words

YES

2.5

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

64MX8

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.625 V

1.2 mm

12.7 mm

Not Qualified

536870912 bit

2.375 V

AUTO/SELF REFRESH

e0

16.5 mm

22 ns

TC59SM816CMBL-70

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

5.4 ns

TC59LM805AMG-55

Toshiba

DDR1 DRAM

COMMERCIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

182 MHz

Not Qualified

536870912 bit

2,4

.75 ns

TC59SM808CMBL-70

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX8

32M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

5.4 ns

TC59LM905AMG-60

Toshiba

DDR1 DRAM

COMMERCIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

2,4

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

166 MHz

Not Qualified

536870912 bit

2,4

.85 ns

TC59LM813AMG-55

Toshiba

DDR1 DRAM

COMMERCIAL

60

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

33554432 words

2,4

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,6X15,40

DRAMs

1 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B60

182 MHz

Not Qualified

536870912 bit

2,4

.75 ns

TC59SM808CMB-70

Toshiba

SYNCHRONOUS DRAM

COMMERCIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX8

32M

0 Cel

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

7.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

15.72 mm

5.4 ns

K4H510838B-GCB0

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

340 mA

67108864 words

2,4,8

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

133 MHz

Not Qualified

536870912 bit

.005 Amp

2,4,8

.75 ns

K4T1G044QC-ZCLD5

Samsung

DDR2 DRAM

OTHER

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.8

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

95 Cel

256MX4

256M

0 Cel

BOTTOM

1

R-PBGA-B60

1.9 V

1.2 mm

11 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

11.5 mm

.5 ns

K4H560438E-GCB3

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

260 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

3

2.7 V

1.2 mm

166 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

240

.003 Amp

2,4,8

14 mm

.7 ns

K4H561638H-ZLCCT

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

350 mA

16777216 words

2,4,8

COMMON

2.6

2.6

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

200 MHz

Not Qualified

268435456 bit

e3

.004 Amp

2,4,8

.65 ns

K4T51083QG-HCCCT

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

175 mA

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

200 MHz

Not Qualified

536870912 bit

.0045 Amp

4,8

.6 ns

K4H510838B-GLCC

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

430 mA

67108864 words

2,4,8

COMMON

2.6

2.6

8

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

200 MHz

Not Qualified

536870912 bit

.005 Amp

2,4,8

.65 ns

K4T51043QC-ZCE7

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

250 mA

134217728 words

4,8

COMMON

1.8

1.8

4

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

128MX4

128M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

400 MHz

Not Qualified

536870912 bit

e3

.008 Amp

4,8

.4 ns

K4T1G084QD-ZCF7T

Samsung

DDR2 DRAM

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

260 mA

134217728 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

3-STATE

128MX8

128M

BOTTOM

R-PBGA-B60

3

400 MHz

Not Qualified

1073741824 bit

260

4,8

.4 ns

K4X56163PI-FEC6T

Samsung

DDR1 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

110 mA

16777216 words

2,4,8,16

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA60,9X10,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B60

3

166 MHz

Not Qualified

268435456 bit

e1

260

.00001 Amp

2,4,8,16

5.5 ns

K4H560438E-GLB3T

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

260 mA

67108864 words

2,4,8

COMMON

2.5

2.5

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

BOTTOM

R-PBGA-B60

3

166 MHz

Not Qualified

268435456 bit

240

.003 Amp

2,4,8

.7 ns

K4X1G163PC-FEC3T

Samsung

DDR1 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

135 mA

67108864 words

2,4,8,16

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA60,9X10,32

DRAMs

.8 mm

85 Cel

3-STATE

64MX16

64M

-25 Cel

BOTTOM

R-PBGA-B60

133 MHz

Not Qualified

1073741824 bit

.000025 Amp

2,4,8,16

6 ns

K4H510838C-ZPB0T

Samsung

CACHE DRAM MODULE

INDUSTRIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

325 mA

67108864 words

2,4,8

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

133 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.75 ns

K4H560438E-GLA2

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

240 mA

67108864 words

2,4,8

YES

COMMON

2.5

2.5

4

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

1 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

133 MHz

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.003 Amp

2,4,8

14 mm

.75 ns

K4T1G044QE-HLF7T

Samsung

DDR2 DRAM

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

165 mA

268435456 words

4,8

COMMON

1.8

1.8

4

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

3-STATE

256MX4

256M

BOTTOM

R-PBGA-B60

400 MHz

Not Qualified

1073741824 bit

4,8

.4 ns

K4H511638J-BCCCT

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

220 mA

33554432 words

2,4,8

COMMON

2.5

2.5

16

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

200 MHz

Not Qualified

536870912 bit

e3

260

.005 Amp

2,4,8

.65 ns

K4X51163PE-FGC3T

Samsung

DDR1 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

115 mA

33554432 words

2,4,8,16

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA60,9X10,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B60

3

133 MHz

Not Qualified

536870912 bit

e1

260

.000015 Amp

2,4,8,16

6 ns

K4T51083QE-ZLE70

Samsung

DDR2 DRAM

OTHER

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

215 mA

67108864 words

4,8

YES

COMMON

1.8

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

1

R-PBGA-B60

3

1.9 V

1.2 mm

400 MHz

9 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

.005 Amp

4,8

11 mm

.4 ns

K4H560438J-HCCCT

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

270 mA

67108864 words

2,4,8

COMMON

2.6

2.6

4

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

200 MHz

Not Qualified

268435456 bit

e3

.003 Amp

2,4,8

.65 ns

K4H510838B-GCCC0

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

2.6

8

GRID ARRAY, THIN PROFILE

1 mm

70 Cel

64MX8

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.5 V

AUTO/SELF REFRESH

e0

12 mm

.65 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.