TFBGA DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4T51163QI-HPE60

Samsung

DDR2 DRAM

84

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

32MX16

32M

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

7.5 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

12.5 mm

.45 ns

K4H560838J-HLCC0

Samsung

DDR1 DRAM

COMMERCIAL

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

290 mA

33554432 words

2,4,8

YES

COMMON

2.6

2.6

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

200 MHz

8 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.004 Amp

2,4,8

14 mm

.65 ns

K4B2G0846C-HYF8

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

8

GRID ARRAY

.8 mm

85 Cel

256MX8

256M

0 Cel

BOTTOM

1

R-PBGA-B78

3

1.45 V

1.2 mm

7.5 mm

Not Qualified

2147483648 bit

1.2825 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

260

11 mm

K4T51043QI-HCLE6

Samsung

DDR2 DRAM

OTHER

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.8

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

95 Cel

128MX4

128M

0 Cel

BOTTOM

1

R-PBGA-B60

1.9 V

1.2 mm

7.5 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

9.5 mm

.45 ns

K4M511633E-PL750

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.7 V

AUTO/SELF REFRESH

11.5 mm

5.4 ns

K4T51163QC-ZCCC0

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

300 mA

33554432 words

4,8

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B84

3

1.9 V

1.2 mm

200 MHz

11 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

.008 Amp

4,8

13 mm

.6 ns

K4T1G084QA-ZCE60

Samsung

DDR2 DRAM

OTHER

68

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

4,8

YES

COMMON

1.8

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA68,9X19,32

DRAMs

.8 mm

85 Cel

3-STATE

128MX8

128M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B68

3

1.9 V

1.2 mm

333 MHz

11 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

e1

260

4,8

18 mm

.45 ns

K4S56163LF-ZL1L0

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

-25 Cel

BOTTOM

1

R-PBGA-B54

3

2.7 V

1.2 mm

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

11 mm

7 ns

K4T2G084QA-HCF7

Samsung

DDR2 DRAM

OTHER

68

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

350 mA

268435456 words

4,8

YES

COMMON

1.8

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA68,9X19,32

DRAMs

.8 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B68

3

1.9 V

1.2 mm

400 MHz

11 mm

Not Qualified

2147483648 bit

1.7 V

AUTO/SELF REFRESH

e1

260

.015 Amp

4,8

18 mm

.4 ns

K4S51163LF-YL750

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

2.7 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

30

240

11.5 mm

5.4 ns

K4R571669A-FCK7

Samsung

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA92,10X18,32

DRAMs

.8 mm

3-STATE

16MX16

16M

TIN LEAD

BOTTOM

1

R-PBGA-B92

2.63 V

1.08 mm

711 MHz

9.3 mm

Not Qualified

268435456 bit

2.37 V

SELF CONTAINED REFRESH

e0

15.1 mm

45 ns

K4N51163QC-ZC360

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

320 mA

33554432 words

4,8

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B84

3

1.9 V

1.2 mm

275 MHz

11 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

260

.01 Amp

4,8

13 mm

.5 ns

K4B2G0846F-BMK00

Samsung

DDR3L DRAM

INDUSTRIAL

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.35

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

-40 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

2147483648 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4B4G0446D-BYH90

Samsung

DDR3L DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.35

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

1GX4

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY

11 mm

K4N56163QF-GC300

Samsung

DDR2 DRAM

84

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

16MX16

16M

TIN LEAD

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

11 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e0

13 mm

.45 ns

K4B4G1646D-BIH90

Samsung

DDR3 DRAM

INDUSTRIAL

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

1.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX16

256M

-40 Cel

BOTTOM

1

R-PBGA-B96

1.575 V

1.2 mm

7.5 mm

4294967296 bit

1.425 V

PROGRAMMABLE CAS LATENCY

NOT SPECIFIED

NOT SPECIFIED

13.3 mm

.255 ns

K4M511533E-PC1H0

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.7 V

AUTO/SELF REFRESH

11.5 mm

7 ns

K4B4G0446A-HCK00

Samsung

DDR3 DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.5

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

1GX4

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.575 V

1.2 mm

10 mm

4294967296 bit

1.425 V

AUTO/SELF REFRESH

12.5 mm

K4R571669A-FCK80

Samsung

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

16MX16

16M

BOTTOM

1

R-PBGA-B92

2.63 V

1.08 mm

9.3 mm

Not Qualified

268435456 bit

2.37 V

SELF CONTAINED REFRESH

15.1 mm

K4T1G084QE-HLE70

Samsung

DDR2 DRAM

OTHER

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

170 mA

134217728 words

4,8

YES

COMMON

1.8

1.8

8

GRID ARRAY

BGA60,9X11,32

DRAMs

.8 mm

85 Cel

3-STATE

128MX8

128M

0 Cel

BOTTOM

1

R-PBGA-B60

1.9 V

1.2 mm

400 MHz

7.5 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

4,8

9.5 mm

.4 ns

K4T51163QI-HCLF7

Samsung

DDR2 DRAM

OTHER

84

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

95 Cel

32MX16

32M

0 Cel

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

7.5 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

12.5 mm

.4 ns

K4H641638N-FCB30

Samsung

DDR1 DRAM

COMMERCIAL

60

TFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

200 mA

4194304 words

2,4,8

YES

COMMON

2.5

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

166 MHz

8 mm

Not Qualified

67108864 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.004 Amp

2,4,8

12 mm

.7 ns

K4B4G1646D-BHMA

Samsung

DDR3 DRAM

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

256MX16

256M

BOTTOM

1

R-PBGA-B96

1.575 V

1.2 mm

7.5 mm

4294967296 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

13.3 mm

K4T51163QE-ZLD50

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

240 mA

33554432 words

4,8

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B84

2

1.9 V

1.2 mm

266 MHz

9 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

.0045 Amp

4,8

13 mm

.5 ns

K4A8G085WC-BCRC0

Samsung

DDR4 DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

1073741824 words

YES

1.2

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

1GX8

1G

0 Cel

BOTTOM

1

R-PBGA-B78

1.26 V

1.2 mm

7.5 mm

8589934592 bit

1.14 V

AUTO/SELF REFRESH

11 mm

K4S511633F-YF1H0

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.7 V

AUTO/SELF REFRESH

30

240

11.5 mm

7 ns

K4B4G0846E-BCK00

Samsung

DDR3 DRAM

OTHER

78

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

536870912 words

YES

1.5

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

512MX8

512M

0 Cel

BOTTOM

1

R-PBGA-B78

1.575 V

1.2 mm

7.5 mm

4294967296 bit

1.425 V

AUTO/SELF REFRESH

11 mm

KM418RD4C-M80

Samsung

RAMBUS DRAM

74

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

YES

2.5

18

GRID ARRAY, THIN PROFILE, FINE PITCH

.75 mm

4MX18

4M

BOTTOM

1

R-PBGA-B74

2.63 V

1.2 mm

7.6 mm

Not Qualified

75497472 bit

2.37 V

SELF REFRESH

12.6 mm

40 ns

K4T1G313QI-MCE60

Samsung

DDR2 DRAM

OTHER

128

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

95 Cel

32MX32

32M

0 Cel

BOTTOM

1

R-PBGA-B128

1.9 V

1.2 mm

10.5 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

13.5 mm

.45 ns

K4T56043QF-GLD50

Samsung

DDR2 DRAM

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

1.8

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

64MX4

64M

BOTTOM

1

R-PBGA-B60

1.9 V

1.2 mm

11 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

13 mm

.5 ns

K4N56163QF-ZC2A0

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

410 mA

16777216 words

4,8

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

16MX16

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B84

2

1.9 V

1.2 mm

350 MHz

11 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e1

4,8

13 mm

.45 ns

K4S56163LF-XE1H0

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

1

R-PBGA-B54

2.7 V

1.2 mm

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

30

240

11 mm

7 ns

K4S56323LF-HN1L0

Samsung

SYNCHRONOUS DRAM

OTHER

90

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX32

8M

-25 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3

2.7 V

1.2 mm

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e1

13 mm

7 ns

K4S56323LF-FL600

Samsung

SYNCHRONOUS DRAM

OTHER

90

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

32

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

8MX32

8M

-25 Cel

BOTTOM

1

R-PBGA-B90

2.7 V

1.2 mm

8 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

30

240

13 mm

5.4 ns

K4R571669D-FCM80

Samsung

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

16MX16

16M

BOTTOM

1

R-PBGA-B92

2.63 V

1.08 mm

9.3 mm

Not Qualified

268435456 bit

2.37 V

SELF CONTAINED REFRESH

15.1 mm

K4N56163QF-GC330

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

370 mA

16777216 words

4,8

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

16MX16

16M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

300 MHz

11 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e0

4,8

13 mm

.47 ns

K4R571669M-NCG6

Samsung

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

COMMON

2.5

1.8/2.5,2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA92,10X18,32

DRAMs

.8 mm

3-STATE

16MX16

16M

TIN LEAD

BOTTOM

1

R-PBGA-B92

2.63 V

1.08 mm

600 MHz

10.5 mm

Not Qualified

268435456 bit

2.37 V

SELF CONTAINED REFRESH

e0

18 mm

53.3 ns

K4S56163PF-BF750

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

-25 Cel

BOTTOM

1

R-PBGA-B54

3

1.95 V

1.2 mm

8 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

11 mm

6 ns

K4T1G164QE-HIF70

Samsung

DDR2 DRAM

INDUSTRIAL

84

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

95 Cel

64MX16

64M

-40 Cel

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

7.5 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

12.5 mm

.4 ns

K4T51043QG-HLE60

Samsung

DDR2 DRAM

OTHER

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

175 mA

134217728 words

4,8

YES

COMMON

1.8

1.8

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

128MX4

128M

0 Cel

BOTTOM

1

R-PBGA-B60

1.9 V

1.2 mm

333 MHz

7.5 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.005 Amp

4,8

9.5 mm

.45 ns

K4B8G1646Q-MCMA0

Samsung

DDR3 DRAM

OTHER

96

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

280 mA

536870912 words

8

YES

COMMON

1.5

1.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA96,9X16,32

DRAMs

.8 mm

85 Cel

3-STATE

512MX16

512M

0 Cel

BOTTOM

1

R-PBGA-B96

1.575 V

1.2 mm

933 MHz

11 mm

Not Qualified

8589934592 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.03 Amp

8

13.3 mm

.195 ns

K4T1G044QQ-HLE70

Samsung

DDR2 DRAM

OTHER

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

245 mA

268435456 words

4,8

YES

COMMON

1.8

1.8

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

256MX4

256M

0 Cel

BOTTOM

1

R-PBGA-B60

1.9 V

1.2 mm

400 MHz

9 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

4,8

11 mm

.4 ns

K4T51043QB-GLCC0

Samsung

DDR2 DRAM

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

134217728 words

YES

1.8

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

128MX4

128M

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

2

1.9 V

1.2 mm

11 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

.6 ns

K4T51083QC-ZCCC0

Samsung

DDR2 DRAM

OTHER

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

4,8

YES

COMMON

1.8

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

85 Cel

3-STATE

64MX8

64M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

3

1.9 V

1.2 mm

200 MHz

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

260

.22 Amp

4,8

11 mm

.6 ns

K4N56163QG-GC200

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

4,8

YES

COMMON

2

2

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B84

2.1 V

1.2 mm

500 MHz

11 mm

Not Qualified

268435456 bit

1.9 V

AUTO/SELF REFRESH

e0

4,8

13 mm

.35 ns

K4B4G1646D-BYH90

Samsung

DDR3L DRAM

OTHER

96

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

1.35

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX16

256M

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B96

1.45 V

1.2 mm

7.5 mm

4294967296 bit

1.283 V

PROGRAMMABLE CAS LATENCY; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

e1

NOT SPECIFIED

NOT SPECIFIED

13.3 mm

K4T1G164QD-ZCE70

Samsung

DDR2 DRAM

OTHER

84

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

280 mA

67108864 words

4,8

YES

COMMON

1.8

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX16

64M

0 Cel

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

400 MHz

9 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

.015 Amp

4,8

13 mm

.4 ns

K4R761869A-FCN9

Samsung

RAMBUS DRAM

92

TFBGA

RECTANGULAR

PLASTIC/EPOXY

BLOCK ORIENTED PROTOCOL

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

2.5

18

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

32MX18

32M

BOTTOM

1

R-PBGA-B92

2.63 V

1.08 mm

13.4 mm

Not Qualified

603979776 bit

2.37 V

SELF CONTAINED REFRESH

15.1 mm

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.