Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
83 mA |
4194304 words |
NO |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ20/26,.4 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J20 |
Not Qualified |
4194304 bit |
e0 |
.0011 Amp |
80 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
55 Cel |
64MX72 |
64M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
e3 |
.45 ns |
||||||||||||||||||||||||||
Infineon Technologies |
EDO DRAM |
COMMERCIAL |
42 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
100 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ42,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J42 |
Not Qualified |
16777216 bit |
e0 |
.001 Amp |
50 ns |
|||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1000 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
R-PDMA-N168 |
31.75 mm |
83 MHz |
Not Qualified |
268435456 bit |
.032 Amp |
9 ns |
||||||||||||||||||||||||||
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
7200 mA |
268435456 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
125 MHz |
Not Qualified |
19327352832 bit |
2.3 V |
AUTO/SELF REFRESH |
.432 Amp |
.8 ns |
|||||||||||||||||||
Infineon Technologies |
EDO DRAM |
COMMERCIAL |
44 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
115 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
20.95 mm |
60 ns |
|||||||||||||||
Infineon Technologies |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
3.3 |
32 |
MICROELECTRONIC ASSEMBLY |
16 |
70 Cel |
8MX32 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N72 |
3.6 V |
Not Qualified |
268435456 bit |
3 V |
RAS ONLY/CAS BEFORE RAS REFRESH |
60 ns |
||||||||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
240 mA |
33554432 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
100 MHz |
Not Qualified |
2147483648 bit |
3 V |
.002 Amp |
6 ns |
|||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
175 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
7 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
65 Cel |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
8589934592 bit |
1.7 V |
AUTO/SELF REFRESH |
.4 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
120 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ24/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J24 |
Not Qualified |
16777216 bit |
e0 |
.001 Amp |
50 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
55 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
1073741824 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.6 ns |
|||||||||||||||||||||||||||
Infineon Technologies |
EDO DRAM |
COMMERCIAL |
42 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
115 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ42,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J42 |
3.6 V |
3.75 mm |
10.3 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
27.43 mm |
60 ns |
|||||||||||||||
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
6820 mA |
134217728 words |
YES |
COMMON |
2.6 |
2.6 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
200 MHz |
Not Qualified |
9663676416 bit |
2.5 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.8 Amp |
.5 ns |
|||||||||||||||||
Infineon Technologies |
EDO DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX64 |
1M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.6 V |
25.4 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/SELF REFRESH |
60 ns |
|||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
900 mA |
4194304 words |
1,2,4,8,16 |
YES |
COMMON |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
66 MHz |
10.16 mm |
67108864 bit |
3 V |
AUTO/SELF REFRESH; LG-MAX |
.0005 Amp |
1,2,4,8,16 |
22.62 mm |
12 ns |
||||||||||||||||||
Infineon Technologies |
DDR2 DRAM |
60 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
64MX8 |
64M |
BOTTOM |
1 |
R-PBGA-B60 |
1.9 V |
1.2 mm |
10 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
10.5 mm |
.5 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
960 mA |
2097152 words |
NO |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX64 |
2M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
25.4 mm |
Not Qualified |
134217728 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
.008 Amp |
50 ns |
|||||||||||||||||||
Infineon Technologies |
FAST PAGE DRAM |
COMMERCIAL |
42 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
90 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ42,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J42 |
Not Qualified |
16777216 bit |
e0 |
.001 Amp |
60 ns |
|||||||||||||||||||||||||
Infineon Technologies |
EDO DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
400 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
20.32 mm |
Not Qualified |
33554432 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.002 Amp |
50 ns |
|||||||||||||||||||
Infineon Technologies |
DDR2 DRAM |
84 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
32MX16 |
32M |
BOTTOM |
1 |
R-PBGA-B84 |
1.9 V |
1.2 mm |
10 mm |
Not Qualified |
536870912 bit |
1.7 V |
AUTO/SELF REFRESH |
12.5 mm |
.4 ns |
||||||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
4194304 words |
YES |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
4MX72 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
301989888 bit |
3 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
|
Infineon Technologies |
DDR1 DRAM |
OTHER |
60 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
90 mA |
33554432 words |
2,4,8,16 |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA60,9X10,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
BOTTOM |
R-PBGA-B60 |
133 MHz |
Not Qualified |
536870912 bit |
.0005 Amp |
2,4,8,16 |
6.5 ns |
||||||||||||||||||||||||
Infineon Technologies |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
800 mA |
2097152 words |
NO |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
25.4 mm |
Not Qualified |
67108864 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.016 Amp |
70 ns |
||||||||||||||||||
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
55 Cel |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
.5 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
190 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3360 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
100 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.024 Amp |
6 ns |
|||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
YES |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
64MX4 |
64M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
5.4 ns |
||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
8388608 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
8MX8 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
22.22 mm |
6 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B54 |
1.95 V |
8 mm |
Not Qualified |
268435456 bit |
1.65 V |
AUTO/SELF REFRESH |
e1 |
12 mm |
5.4 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2560 mA |
134217728 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
1 |
R-PDMA-N200 |
2.7 V |
166 MHz |
Not Qualified |
8589934592 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.06 Amp |
.7 ns |
||||||||||||||||
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
65 Cel |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
.6 ns |
|||||||||||||||||||||||||||||
Infineon Technologies |
FAST PAGE DRAM |
COMMERCIAL |
50 |
TSOP2 |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
210 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
20.95 mm |
50 ns |
|||||||||||||||
Infineon Technologies |
FAST PAGE DRAM |
COMMERCIAL |
32 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
130 mA |
8388608 words |
NO |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J32 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
21.08 mm |
50 ns |
|||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
16777216 words |
1,2,4,8,16 |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
133 MHz |
Not Qualified |
67108864 bit |
e0 |
1,2,4,8,16 |
5.5 ns |
|||||||||||||||||||||||||
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
65 Cel |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
.45 ns |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
32MX8 |
32M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
6 ns |
||||||||||||||||||||||
|
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2250 mA |
33554432 words |
YES |
COMMON |
2.6 |
2.6 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
200 MHz |
Not Qualified |
2415919104 bit |
2.5 V |
AUTO/SELF REFRESH |
e3 |
.6 ns |
|||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
16MX8 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
6 ns |
||||||||||||||||||||||
Infineon Technologies |
EDO DRAM |
COMMERCIAL |
50 |
TSOP2 |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
240 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
20.95 mm |
40 ns |
|||||||||||||||
|
Infineon Technologies |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
65 Cel |
32MX64 |
32M |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
2147483648 bit |
1.7 V |
AUTO/SELF REFRESH |
e3 |
.45 ns |
||||||||||||||||||||||||||
Infineon Technologies |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
100 mA |
2097152 words |
YES |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
16777216 bit |
e0 |
.002 Amp |
70 ns |
|||||||||||||||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
90 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
7 ns |
||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
5.4 ns |
||||||||||||||||||||||
Infineon Technologies |
EDO DRAM MODULE |
COMMERCIAL |
72 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
280 mA |
8388608 words |
NO |
COMMON |
3.3 |
3.3 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX32 |
8M |
0 Cel |
DUAL |
R-PDMA-N72 |
Not Qualified |
268435456 bit |
.0000036 Amp |
50 ns |
|||||||||||||||||||||||||||
|
Infineon Technologies |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
90 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B54 |
1.95 V |
133 MHz |
8 mm |
Not Qualified |
134217728 bit |
1.65 V |
AUTO/SELF REFRESH |
e1 |
.00035 Amp |
1,2,4,8 |
12 mm |
5.4 ns |
||||||||||||
Infineon Technologies |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
195 mA |
33554432 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
100 MHz |
Not Qualified |
2415919104 bit |
3 V |
.002 Amp |
6 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.