Infineon Technologies DRAM 2,400+

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

HYS72V16200GU-8

Infineon Technologies

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

240 mA

16777216 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

16MX72

16M

0 Cel

DUAL

R-PDMA-N168

100 MHz

Not Qualified

1207959552 bit

.002 Amp

6 ns

HYB5116100AJ-70

Infineon Technologies

FAST PAGE DRAM

COMMERCIAL

24

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

80 mA

16777216 words

NO

SEPARATE

5

5

1

SMALL OUTLINE

SOJ24/26,.34

DRAMs

1.27 mm

70 Cel

3-STATE

16MX1

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J24

5.5 V

3.75 mm

7.75 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE

e0

.001 Amp

17.27 mm

70 ns

HYB511000AL-60

Infineon Technologies

FAST PAGE DRAM

COMMERCIAL

18

DIP

512

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

90 mA

1048576 words

SEPARATE

5

5

1

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

1048576 bit

e0

.0003 Amp

60 ns

HYS64V16220GDL-7-C2

Infineon Technologies

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

16777216 words

YES

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

5.4 ns

HYS72V16301GR-7.5-A

Infineon Technologies

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

16777216 words

YES

3.3

72

MICROELECTRONIC ASSEMBLY

70 Cel

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

Not Qualified

1207959552 bit

3 V

AUTO/SELF REFRESH

5.4 ns

HYS72D64301HBR-5-B

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

184

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

2.6

72

MICROELECTRONIC ASSEMBLY

70 Cel

64MX72

64M

0 Cel

MATTE TIN

DUAL

1

R-XDMA-N184

2.7 V

Not Qualified

4831838208 bit

2.5 V

AUTO/SELF REFRESH

e3

.5 ns

HYM641005GS-60

Infineon Technologies

EDO DRAM MODULE

COMMERCIAL

168

DIMM

1024

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

770 mA

1048576 words

COMMON

5

5

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

1MX64

1M

0 Cel

DUAL

R-PDMA-N168

25.4 mm

Not Qualified

67108864 bit

.03 Amp

60 ns

HYB39S128800CT-7

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

250 mA

16777216 words

1,2,4,8

YES

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX8

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

143 MHz

10.16 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

.0015 Amp

1,2,4,8

22.22 mm

5.4 ns

HYM91000SL-60

Infineon Technologies

FAST PAGE DRAM MODULE

COMMERCIAL

30

SIMM

512

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

810 mA

1048576 words

COMMON

5

5

9

MICROELECTRONIC ASSEMBLY

SIM30

DRAMs

2.54 mm

70 Cel

3-STATE

1MX9

1M

0 Cel

SINGLE

1

R-XSMA-N30

5.5 V

20.447 mm

Not Qualified

9437184 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

.0018 Amp

60 ns

HYS64D64320HU-5-C

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2360 mA

67108864 words

YES

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

MATTE TIN

DUAL

1

R-XDMA-N184

2.7 V

200 MHz

Not Qualified

4294967296 bit

2.5 V

AUTO/SELF REFRESH

e3

.6 ns

HYB18T512160BF-3.7

Infineon Technologies

DDR2 DRAM

84

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

32MX16

32M

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

12.5 mm

.5 ns

HYS64D32020HU-8-A

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

184

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

33554432 words

YES

2.5

64

MICROELECTRONIC ASSEMBLY

70 Cel

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

Not Qualified

2147483648 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.8 ns

HYB514256BJL-70

Infineon Technologies

FAST PAGE DRAM

COMMERCIAL

20

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

70 mA

262144 words

COMMON

5

5

4

SMALL OUTLINE

SOJ20/26,.34

DRAMs

1.27 mm

70 Cel

3-STATE

256KX4

256K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-J20

Not Qualified

1048576 bit

e0

.0002 Amp

70 ns

HYB5116165BSJ-50

Infineon Technologies

EDO DRAM

COMMERCIAL

42

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

100 mA

1048576 words

YES

COMMON

5

5

16

SMALL OUTLINE

SOJ42,.44

DRAMs

1.27 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-J42

Not Qualified

16777216 bit

e0

.001 Amp

50 ns

HYB39S256400T-10

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

195 mA

67108864 words

1,2,4,8

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G54

100 MHz

Not Qualified

268435456 bit

e0

.002 Amp

1,2,4,8

7 ns

HYB39S16400BT-10

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

44

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

DUAL BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

100 mA

4194304 words

1,2,4,8,FP

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G44

3.6 V

1.2 mm

100 MHz

10.16 mm

Not Qualified

16777216 bit

3 V

e0

.002 Amp

1,2,4,8

18.41 mm

7 ns

HYS72V32300GU-8B

Infineon Technologies

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

210 mA

33554432 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

32MX72

32M

0 Cel

DUAL

R-PDMA-N168

100 MHz

Not Qualified

2415919104 bit

.002 Amp

6 ns

HYB18T256800AC-5

Infineon Technologies

DDR2 DRAM

OTHER

60

FBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

1.8

8

GRID ARRAY, FINE PITCH

.8 mm

95 Cel

32MX8

32M

0 Cel

BOTTOM

1

R-PBGA-B60

1.9 V

10 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

10.5 mm

.6 ns

HYS72T64000HR-3.7-A

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1590 mA

67108864 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

55 Cel

3-STATE

64MX72

64M

0 Cel

MATTE TIN

DUAL

1

R-XDMA-N240

1.9 V

267 MHz

Not Qualified

4831838208 bit

1.7 V

AUTO/SELF REFRESH

e3

.37 Amp

.5 ns

HYB39S256160DFL-8

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

8 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

12 mm

6 ns

HYB18T1G400AC-3S

Infineon Technologies

DDR2 DRAM

68

FBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.8

4

GRID ARRAY, FINE PITCH

.8 mm

256MX4

256M

BOTTOM

1

R-PBGA-B68

1.9 V

10 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

20 mm

.45 ns

HYB18T256160AF-25F

Infineon Technologies

DDR2 DRAM

84

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

16MX16

16M

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B84

1.9 V

1.2 mm

10 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e1

12.5 mm

.4 ns

HYB39M93200L125

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

J BEND

195 mA

294912 words

COMMON

3.3

3.3

32

CHIP CARRIER

LDCC68,1.0SQ

DRAMs

1.27 mm

70 Cel

3-STATE

288KX32

288K

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J68

125 MHz

Not Qualified

9437184 bit

e0

.001 Amp

HYB39S256160FF-6

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

8 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

12 mm

5.4 ns

HYB3116165BST-70

Infineon Technologies

EDO DRAM

COMMERCIAL

44

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

80 mA

1048576 words

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44/50,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G44

Not Qualified

16777216 bit

e0

.001 Amp

70 ns

HYB514175BJ-60

Infineon Technologies

EDO DRAM

COMMERCIAL

40

SOJ

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

170 mA

262144 words

NO

COMMON

5

5

16

SMALL OUTLINE

SOJ40,.44

DRAMs

1.27 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J40

5.5 V

3.68 mm

10.3 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

26.16 mm

60 ns

HYS72D64320GBR-5-C

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3660 mA

67108864 words

YES

COMMON

2.6

2.6

72

MICROELECTRONIC ASSEMBLY

DIMM184

DRAMs

1.27 mm

70 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

200 MHz

Not Qualified

4831838208 bit

2.5 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.5 ns

HYB39V64402T-10

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

16777216 words

1,2,4,8,16

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G54

100 MHz

Not Qualified

67108864 bit

e0

1,2,4,8,16

6 ns

HYM72V1610GS-60

Infineon Technologies

FAST PAGE DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1800 mA

16777216 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

38.1 mm

Not Qualified

1207959552 bit

3 V

RAS ONLY/CAS BEFORE RAS REFRESH

.05 Amp

60 ns

HYB39V64802T-7

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

900 mA

8388608 words

1,2,4,8,16

YES

COMMON

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

.8 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

143 MHz

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH; LG-MAX

e0

.0005 Amp

1,2,4,8,16

22.62 mm

5.5 ns

HYB5118165BST-60

Infineon Technologies

EDO DRAM

COMMERCIAL

44

TSOP2

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

115 mA

1048576 words

NO

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP44/50,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G44

5.5 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

20.95 mm

60 ns

HYM94000S-10

Infineon Technologies

FAST PAGE DRAM MODULE

COMMERCIAL

30

SIMM

1024

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

720 mA

4194304 words

COMMON

5

5

9

MICROELECTRONIC ASSEMBLY

SIM30

DRAMs

2.54 mm

70 Cel

3-STATE

4MX9

4M

0 Cel

SINGLE

1

R-XSMA-N30

5.5 V

24.257 mm

Not Qualified

37748736 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.009 Amp

100 ns

HYM32V8040GD-60

Infineon Technologies

FAST PAGE DRAM MODULE

COMMERCIAL

72

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

210 mA

8388608 words

NO

COMMON

3.3

3.3

32

MICROELECTRONIC ASSEMBLY

DIMM72

DRAMs

1.27 mm

70 Cel

3-STATE

8MX32

8M

0 Cel

DUAL

R-PDMA-N72

25.4 mm

Not Qualified

268435456 bit

.0036 Amp

60 ns

HYB5117400ASJ-80

Infineon Technologies

FAST PAGE DRAM

COMMERCIAL

24

SOJ

2048

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

90 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE

SOJ24/28,.44

DRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-J24

Not Qualified

16777216 bit

e0

.001 Amp

80 ns

HYB3117805BSJL-60

Infineon Technologies

EDO DRAM

COMMERCIAL

28

SOJ

2048

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

J BEND

110 mA

2097152 words

YES

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ28,.44

DRAMs

1.27 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-J28

Not Qualified

16777216 bit

e0

.0002 Amp

60 ns

HYB39S64400AT-7.5

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

140 mA

16777216 words

1,2,4,8,FP

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX4

16M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G54

133 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

5.4 ns

HYS72D64020GR-7.5-A

Infineon Technologies

HYS72D32020HU-8-A

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

184

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

33554432 words

YES

2.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

32MX72

32M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

Not Qualified

2415919104 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.8 ns

HYR186440G-845

Infineon Technologies

RAMBUS DRAM MODULE

184

DIMM

RECTANGULAR

UNSPECIFIED

BLOCK ORIENTED PROTOCOL

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

COMMON

2.5

1.8/2.5,2.5

18

MICROELECTRONIC ASSEMBLY

DIMM184,40

DRAMs

1 mm

3-STATE

64MX18

64M

DUAL

1

R-XDMA-N184

2.63 V

800 MHz

Not Qualified

1207959552 bit

2.37 V

SELF CONTAINED REFRESH

HYB39S64800T-80

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

175 mA

8388608 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

125 MHz

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e0

.002 Amp

1,2,4,8

22.22 mm

7 ns

HYB39S256400DC-7.5

Infineon Technologies

SYNCHRONOUS DRAM

COMMERCIAL

54

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

190 mA

67108864 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

4

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

64MX4

64M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

133 MHz

8 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

e0

.002 Amp

1,2,4,8

12 mm

5.4 ns

HYS64T64020LM-5-A

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

214

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

856 mA

67108864 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM214,16

DRAMs

.4 mm

65 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

1

R-XDMA-N214

1.9 V

200 MHz

Not Qualified

4294967296 bit

1.7 V

AUTO/SELF REFRESH

.032 Amp

.6 ns

HYS64T64000HU-25F-B

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

240

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

1.8

64

MICROELECTRONIC ASSEMBLY

65 Cel

64MX64

64M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

Not Qualified

4294967296 bit

1.7 V

AUTO/SELF REFRESH

.4 ns

HYS64V128220GU-7.5-A

Infineon Technologies

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

7040 mA

134217728 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

133 MHz

Not Qualified

8589934592 bit

3 V

AUTO/SELF REFRESH

.064 Amp

5.4 ns

HYS72T256000HR-3.7-A

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4190 mA

268435456 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

55 Cel

3-STATE

256MX72

256M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

267 MHz

Not Qualified

19327352832 bit

1.7 V

AUTO/SELF REFRESH

.59 Amp

.5 ns

HYS72V16220GU-7.5-C

Infineon Technologies

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

16777216 words

YES

3.3

72

MICROELECTRONIC ASSEMBLY

70 Cel

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

Not Qualified

1207959552 bit

3 V

AUTO/SELF REFRESH

5.4 ns

HYS64D32020GDL-5-C

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1216 mA

33554432 words

YES

COMMON

2.6

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

2.7 V

200 MHz

Not Qualified

2147483648 bit

2.5 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.04 Amp

.5 ns

HYS72T64000HU-5-A

Infineon Technologies

DDR DRAM MODULE

COMMERCIAL

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1170 mA

67108864 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

65 Cel

3-STATE

64MX72

64M

0 Cel

MATTE TIN

DUAL

1

R-XDMA-N240

1.9 V

200 MHz

Not Qualified

4831838208 bit

1.7 V

AUTO/SELF REFRESH

e3

.036 Amp

.6 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.