Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
40 |
ZIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
120 mA |
262144 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
IN-LINE |
ZIP40,.1 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T40 |
Not Qualified |
4194304 bit |
e0 |
.0001 Amp |
70 ns |
|||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1000 mA |
1048576 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
0 Cel |
SINGLE |
R-PSMA-N72 |
25.4 mm |
Not Qualified |
37748736 bit |
.012 Amp |
80 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
115 mA |
16777216 words |
1,2,4,8,16 |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.0005 Amp |
1,2,4,8,16 |
6 ns |
|||||||||||||||||||||||
Renesas Electronics |
EDO DRAM |
COMMERCIAL |
28 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
100 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G28 |
Not Qualified |
16777216 bit |
e0 |
.00015 Amp |
60 ns |
|||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
28 |
QFP |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
120 mA |
16777216 words |
YES |
SEPARATE |
5 |
5 |
1 |
FLATPACK |
QFP28,.56SQ,50 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX1 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G28 |
Not Qualified |
16777216 bit |
e0 |
.0002 Amp |
70 ns |
|||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
90 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
9 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX9 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G32 |
Not Qualified |
18874368 bit |
e0 |
.0001 Amp |
80 ns |
|||||||||||||||||||||||||
Renesas Electronics |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
4800 mA |
33554432 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
R-PDMA-N168 |
100 MHz |
Not Qualified |
2415919104 bit |
.019 Amp |
6 ns |
|||||||||||||||||||||||||||
|
Renesas Electronics |
DDR1 DRAM |
144 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
COMMON |
1.8 |
1.8,2.5 |
9 |
GRID ARRAY |
BGA144,12X18,40/32 |
DRAMs |
.8 mm |
3-STATE |
32MX9 |
32M |
BOTTOM |
1 |
R-PBGA-B144 |
1.9 V |
1.17 mm |
533 MHz |
11 mm |
Not Qualified |
301989888 bit |
1.7 V |
AUTO REFRESH; IT ALSO REQUIRES AT 2.5V |
2,4,8 |
18.5 mm |
||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1020 mA |
8388608 words |
NO |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
SINGLE |
R-PSMA-N72 |
31.75 mm |
Not Qualified |
301989888 bit |
.024 Amp |
100 ns |
||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
5 |
70 Cel |
0 Cel |
5.5 V |
4.5 V |
70 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
5 |
70 Cel |
0 Cel |
5.5 V |
4.5 V |
80 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
40 |
ZIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
160 mA |
262144 words |
YES |
COMMON |
5 |
5 |
16 |
IN-LINE |
ZIP40,.1 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T40 |
Not Qualified |
4194304 bit |
e0 |
.0002 Amp |
70 ns |
|||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1060 mA |
2097152 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
0 Cel |
SINGLE |
R-PSMA-N72 |
31.75 mm |
Not Qualified |
75497472 bit |
.024 Amp |
80 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
110 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
9 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
YES |
3-STATE |
2MX9 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G32 |
Not Qualified |
18874368 bit |
e0 |
.0001 Amp |
60 ns |
||||||||||||||||||||||||
Renesas Electronics |
PAGE MODE DRAM |
COMMERCIAL |
72 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
808 mA |
262144 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX36 |
256K |
0 Cel |
SINGLE |
R-PSMA-N72 |
25.4 mm |
Not Qualified |
9437184 bit |
.008 Amp |
85 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
20 |
ZIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
60 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
ZIP20,.1 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T20 |
Not Qualified |
1048576 bit |
e0 |
.001 Amp |
100 ns |
||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
90 mA |
262144 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
YES |
3-STATE |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G40 |
Not Qualified |
4194304 bit |
e0 |
.0005 Amp |
70 ns |
||||||||||||||||||||||||
Renesas Electronics |
DDR1 DRAM |
144 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
33554432 words |
COMMON |
1.8,2.5 |
9 |
GRID ARRAY |
BGA144,12X18,40/32 |
DRAMs |
.8 mm |
3-STATE |
32MX9 |
32M |
BOTTOM |
R-PBGA-B144 |
533 MHz |
Not Qualified |
301989888 bit |
2,4,8 |
||||||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
34 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP34,.56 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G34 |
Not Qualified |
67108864 bit |
e0 |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
SYNCHRONOUS DRAM |
COMMERCIAL |
44 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
160 mA |
2097152 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
125 MHz |
Not Qualified |
16777216 bit |
e0 |
.002 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
400 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
21.6154 mm |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
120 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
44 |
TSOP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
170 mA |
1048576 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
Not Qualified |
16777216 bit |
e0 |
.00025 Amp |
50 ns |
|||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
90 mA |
524288 words |
NO |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
4194304 bit |
e0 |
.0003 Amp |
70 ns |
|||||||||||||||||||||||||
Renesas Electronics |
EDO DRAM |
COMMERCIAL |
24 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
100 mA |
4194304 words |
YES |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
16777216 bit |
e0 |
.00025 Amp |
70 ns |
|||||||||||||||||||||||||
Renesas Electronics |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
33554432 words |
1,2,4,8,16 |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX4 |
32M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
133 MHz |
Not Qualified |
134217728 bit |
e0 |
1,2,4,8,16 |
5.4 ns |
|||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
140 mA |
262144 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
YES |
3-STATE |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G40 |
Not Qualified |
4194304 bit |
e0 |
.0003 Amp |
60 ns |
||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
44 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
80 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
YES |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
Not Qualified |
16777216 bit |
e0 |
.0005 Amp |
70 ns |
||||||||||||||||||||||||
Renesas Electronics |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1425 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
R-PDMA-N200 |
83 MHz |
Not Qualified |
1207959552 bit |
.036 Amp |
9.5 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1120 mA |
1048576 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
0 Cel |
SINGLE |
R-PSMA-N72 |
25.4 mm |
Not Qualified |
37748736 bit |
.012 Amp |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
90 mA |
2097152 words |
YES |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G28 |
Not Qualified |
16777216 bit |
e0 |
.00025 Amp |
80 ns |
|||||||||||||||||||||||||
Renesas Electronics |
EDO DRAM |
COMMERCIAL |
44 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
120 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
Not Qualified |
16777216 bit |
e0 |
.001 Amp |
50 ns |
|||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
5 |
70 Cel |
0 Cel |
5.5 V |
4.5 V |
80 ns |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
70 mA |
4194304 words |
YES |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
16777216 bit |
e0 |
.00025 Amp |
80 ns |
|||||||||||||||||||||||||
Renesas Electronics |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
33554432 words |
COMMON |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX16 |
32M |
DUAL |
R-PDMA-N184 |
600 MHz |
Not Qualified |
536870912 bit |
|||||||||||||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
24 |
TSSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
4194304 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24/28,.46,20 |
SRAMs |
.5 mm |
70 Cel |
YES |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
16777216 bit |
e0 |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
44 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
90 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
Not Qualified |
16777216 bit |
e0 |
.001 Amp |
70 ns |
|||||||||||||||||||||||||
Renesas Electronics |
STATIC COLUMN DRAM |
COMMERCIAL |
24 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/28,.46 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
16777216 bit |
e0 |
70 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
20 |
TSSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
90 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20/24,.63,20 |
DRAMs |
.5 mm |
70 Cel |
YES |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
1048576 bit |
e0 |
.001 Amp |
60 ns |
|||||||||||||||||||||||||
Renesas Electronics |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
64 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
THROUGH-HOLE |
4096 words |
SEPARATE |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
4KX1 |
4K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
4096 bit |
e0 |
300 ns |
||||||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
110 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
9 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX9 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G32 |
Not Qualified |
18874368 bit |
e0 |
.0001 Amp |
60 ns |
|||||||||||||||||||||||||
Renesas Electronics |
PAGE MODE DRAM |
COMMERCIAL |
18 |
QCCJ |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
MOS |
J BEND |
65536 words |
COMMON |
5 |
5 |
4 |
CHIP CARRIER |
LDCC18,.33X.53 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX4 |
64K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J18 |
Not Qualified |
262144 bit |
e0 |
150 ns |
||||||||||||||||||||||||||||
Renesas Electronics |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2200 mA |
33554432 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
R-PDMA-N168 |
100 MHz |
Not Qualified |
2147483648 bit |
.008 Amp |
6 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
44 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
100 mA |
1048576 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
Not Qualified |
16777216 bit |
e0 |
.0004 Amp |
80 ns |
|||||||||||||||||||||||||
Renesas Electronics |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
800 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
R-PDMA-N144 |
29.21 mm |
83 MHz |
Not Qualified |
536870912 bit |
.016 Amp |
9 ns |
||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
34 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
16777216 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE |
SOJ34,.54 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J34 |
Not Qualified |
67108864 bit |
e0 |
80 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
8388608 words |
1,2,4,8,16 |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
125 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8,16 |
5.5 ns |
|||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
24 |
ZIP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
IN-LINE |
ZIP24,.1 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T24 |
Not Qualified |
16777216 bit |
e0 |
100 ns |
|||||||||||||||||||||||||||
Renesas Electronics |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
90 mA |
4194304 words |
YES |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
16777216 bit |
e0 |
.0004 Amp |
80 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.