Samsung DRAM 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

M464S3254HUS-L7A

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

33554432 words

YES

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

32MX64

32M

0 Cel

DUAL

1

R-XDMA-N144

3

3.6 V

Not Qualified

2147483648 bit

3 V

AUTO/SELF REFRESH

260

5.4 ns

M470T2864QZ3-CF7

Samsung

DDR DRAM MODULE

OTHER

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1200 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

85 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N200

3

1.9 V

3.8 mm

400 MHz

30 mm

Not Qualified

8589934592 bit

1.7 V

AUTO/SELF REFRESH

260

.12 Amp

67.6 mm

.4 ns

M471A1K43BB1-CRC

Samsung

DDR DRAM MODULE

OTHER

260

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1073741824 words

YES

1.2

64

MICROELECTRONIC ASSEMBLY

.5 mm

85 Cel

1GX64

1G

0 Cel

DUAL

1

R-XDMA-N260

1.26 V

30.15 mm

3.7 mm

68719476736 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

69.6 mm

M471A4G43MB1-CTD

Samsung

DDR4 DRAM MODULE

M471A5143DB0-CPB

Samsung

DDR DRAM MODULE

OTHER

260

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1180 mA

536870912 words

YES

COMMON

1.2

1.2

64

MICROELECTRONIC ASSEMBLY

DIMM260,20

DRAMs

.5 mm

85 Cel

3-STATE

512MX64

512M

0 Cel

DUAL

1

R-XDMA-N260

1.26 V

30.15 mm

1066 MHz

3.7 mm

Not Qualified

34359738368 bit

1.14 V

AUTO/SELF REFRESH; WD-MAX

.06 Amp

69.6 mm

.18 ns

M471B1G73EB0-YK0

Samsung

DDR DRAM MODULE

OTHER

204

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1060 mA

1073741824 words

YES

COMMON

1.35

1.35

64

MICROELECTRONIC ASSEMBLY

DIMM204,24

DRAMs

.6 mm

85 Cel

3-STATE

1GX64

1G

0 Cel

DUAL

1

R-XDMA-N204

1.45 V

30.15 mm

800 MHz

3.8 mm

Not Qualified

68719476736 bit

1.283 V

AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

NOT SPECIFIED

NOT SPECIFIED

67.6 mm

.225 ns

M471B2873FHS-CF8

Samsung

DDR DRAM MODULE

OTHER

204

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

1.5

64

MICROELECTRONIC ASSEMBLY

95 Cel

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N204

1.575 V

Not Qualified

8589934592 bit

1.425 V

AUTO/SELF REFRESH

.3 ns

M471B5673FH0-CH9

Samsung

DDR DRAM MODULE

OTHER

204

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

268435456 words

YES

1.5

64

MICROELECTRONIC ASSEMBLY

95 Cel

256MX64

256M

0 Cel

DUAL

1

R-XDMA-N204

1.575 V

Not Qualified

17179869184 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.255 ns

M471B5773CHS-CH9

Samsung

DDR DRAM MODULE

OTHER

204

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1680 mA

268435456 words

YES

COMMON

1.5

1.5

8

MICROELECTRONIC ASSEMBLY

DIMM204,24

DRAMs

.6 mm

85 Cel

3-STATE

256MX8

256M

0 Cel

DUAL

1

R-XDMA-N204

1.575 V

3.8 mm

667 MHz

30 mm

Not Qualified

2147483648 bit

1.425 V

AUTO/SELF REFRESH

260

.096 Amp

67.6 mm

.25 ns

K4M51163LC-BF750

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

33554432 words

1,2,4,8,FP

YES

COMMON

2.5

2.5

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

3

2.7 V

1 mm

133 MHz

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

.001 Amp

1,2,4,8

11.5 mm

5.4 ns

K4H510438J-LCIB3

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

134217728 words

YES

2.5

4

SMALL OUTLINE, THIN PROFILE

.65 mm

70 Cel

128MX4

128M

0 Cel

DUAL

1

R-PDSO-G66

2.7 V

1.2 mm

10.16 mm

536870912 bit

2.3 V

AUTO/SELF REFRESH

22.22 mm

M381L3223BT0-CA2

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

33554432 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

Other Memory ICs

1.27 mm

70 Cel

3-STATE

32MX72

32M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

143 MHz

Not Qualified

2415919104 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

K4H510838B-GCB0

Samsung

DDR1 DRAM

COMMERCIAL

60

BGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

340 mA

67108864 words

2,4,8

COMMON

2.5

2.5

8

GRID ARRAY

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

133 MHz

Not Qualified

536870912 bit

.005 Amp

2,4,8

.75 ns

K4M511533E-YC750

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

33554432 words

YES

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

32MX16

32M

-25 Cel

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

10 mm

Not Qualified

536870912 bit

2.7 V

AUTO/SELF REFRESH

11.5 mm

5.4 ns

K4M51323LE-EC1H0

Samsung

SYNCHRONOUS DRAM

OTHER

90

LFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

16MX32

16M

-25 Cel

BOTTOM

1

R-PBGA-B90

2.7 V

1.4 mm

11 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

13 mm

7 ns

M378T6464EHS-CF7

Samsung

DDR DRAM MODULE

COMMERCIAL

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

800 mA

67108864 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

1

R-XDMA-N240

3

1.9 V

400 MHz

Not Qualified

4294967296 bit

1.7 V

AUTO/SELF REFRESH

260

.04 Amp

.4 ns

K4E640412B-JC500

Samsung

EDO DRAM

COMMERCIAL

32

SOJ

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

16777216 words

3.3

4

SMALL OUTLINE

1.27 mm

70 Cel

16MX4

16M

0 Cel

DUAL

1

R-PDSO-J32

3.6 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

20.96 mm

50 ns

M393T5160DZA-CF7

Samsung

DDR2 DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

7110 mA

536870912 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

DRAMs

1 mm

95 Cel

3-STATE

512MX72

512M

0 Cel

DUAL

1

R-XDMA-N240

1.9 V

400 MHz

Not Qualified

38654705664 bit

1.7 V

AUTO/SELF REFRESH

260

.54 Amp

.4 ns

K4T1G044QC-ZCLD5

Samsung

DDR2 DRAM

OTHER

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

268435456 words

YES

1.8

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

95 Cel

256MX4

256M

0 Cel

BOTTOM

1

R-PBGA-B60

1.9 V

1.2 mm

11 mm

Not Qualified

1073741824 bit

1.7 V

AUTO/SELF REFRESH

11.5 mm

.5 ns

KM44V4000ASR-6

Samsung

FAST PAGE DRAM

COMMERCIAL

24

TSOP2-R

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

80 mA

4194304 words

NO

COMMON

3.3

3.3

4

SMALL OUTLINE, THIN PROFILE

TSOP24/26,.36

DRAMs

1.27 mm

70 Cel

YES

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G24

3.6 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.14 mm

60 ns

K4S643233H-HN75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

135 mA

2097152 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

2MX32

2M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

6 ns

KMM5328000BKG-6

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

656 mA

8388608 words

NO

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

16

DRAMs

1.27 mm

70 Cel

3-STATE

8MX32

8M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

25.4 mm

Not Qualified

268435456 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.016 Amp

60 ns

M392B1K70DM0-CF8

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2836 mA

1073741824 words

YES

COMMON

1.5

1.5

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

85 Cel

3-STATE

1GX72

1G

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

18.9 mm

533 MHz

Not Qualified

77309411328 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.972 Amp

133.35 mm

20 ns

KM416C254DT-5

Samsung

EDO DRAM

COMMERCIAL

40

TSOP2

512

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

110 mA

262144 words

NO

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

256KX16

256K

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G40

5.5 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

4.5 V

CAS BEFORE RAS/RAS ONLY/HIDDEN REFRESH

e0

.001 Amp

18.41 mm

50 ns

KM48C2100ALT-8

Samsung

FAST PAGE DRAM

COMMERCIAL

28

TSOP2

2048

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

80 mA

2097152 words

NO

COMMON

5

5

8

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G28

5.5 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0003 Amp

18.41 mm

80 ns

KMM366S1723ATS-GL

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

16777216 words

YES

3.3

64

MICROELECTRONIC ASSEMBLY

70 Cel

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

Not Qualified

1073741824 bit

3 V

AUTO/SELF REFRESH

6 ns

M312L2920MT0-CA0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

7500 mA

134217728 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

Other Memory ICs

1.27 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

100 MHz

Not Qualified

9663676416 bit

2.3 V

AUTO/SELF REFRESH

.408 Amp

.8 ns

K4S641632B-TC80R0

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

145 mA

4194304 words

1,2,4,8,FP

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

TIN LEAD

DUAL

R-PDSO-G54

125 MHz

Not Qualified

67108864 bit

e0

.001 Amp

1,2,4,8

6 ns

M312L6420JUS-CB0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4765 mA

67108864 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM184

Other Memory ICs

1.27 mm

70 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N184

3

2.7 V

133 MHz

Not Qualified

4831838208 bit

2.3 V

AUTO/SELF REFRESH

260

.379 Amp

.75 ns

KM41C4000BSLP-6

Samsung

FAST PAGE DRAM

COMMERCIAL

18

DIP

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

NO

1

CMOS

THROUGH-HOLE

ASYNCHRONOUS

90 mA

4194304 words

NO

SEPARATE

5

5

1

IN-LINE

DIP18,.3

DRAMs

2.54 mm

70 Cel

3-STATE

4MX1

4M

0 Cel

TIN LEAD

DUAL

1

R-PDIP-T18

5.5 V

4.65 mm

7.62 mm

Not Qualified

4194304 bit

4.5 V

RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH

e0

.0001 Amp

22.02 mm

60 ns

KM41V4000CLLJ-7

Samsung

FAST PAGE DRAM

COMMERCIAL

20

SOJ

1024

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

55 mA

4194304 words

YES

SEPARATE

3.3

3.3

1

SMALL OUTLINE

SOJ20/26,.34

DRAMs

1.27 mm

70 Cel

3-STATE

4MX1

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J20

3.6 V

3.68 mm

7.62 mm

Not Qualified

4194304 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0001 Amp

17.145 mm

70 ns

KM416C1204BT-45

Samsung

EDO DRAM

COMMERCIAL

44

TSOP

1024

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

170 mA

1048576 words

NO

COMMON

5

5

16

SMALL OUTLINE, THIN PROFILE

TSOP44/50,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G44

Not Qualified

16777216 bit

e0

.001 Amp

45 ns

K4S560832C-TI7C

Samsung

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

3.3

8

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

32MX8

32M

-40 Cel

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

22.22 mm

5.4 ns

K4S560832C-TP1H

Samsung

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

3.3

8

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

32MX8

32M

-40 Cel

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

22.22 mm

6 ns

K4S56323PF-FF1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

160 mA

8388608 words

1,2,4,8,FP

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

8MX32

8M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

111 MHz

Not Qualified

268435456 bit

e0

.0003 Amp

1,2,4,8

7 ns

KM44C4100AS-6

Samsung

FAST PAGE DRAM

COMMERCIAL

24

TSOP2

2048

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

100 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP24/26,.36

DRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.14 mm

60 ns

K4M563233G-FG7L0

Samsung

SYNCHRONOUS DRAM

OTHER

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

160 mA

8388608 words

1,2,4,8,FP

YES

COMMON

3

3/3.3

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

BOTTOM

1

R-PBGA-B90

3.6 V

1 mm

133 MHz

8 mm

Not Qualified

268435456 bit

2.7 V

AUTO/SELF REFRESH

30

240

.001 Amp

1,2,4,8

13 mm

5.4 ns

K4M51163PC-RE1L0

Samsung

SYNCHRONOUS DRAM

OTHER

54

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

150 mA

33554432 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-25 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B54

1.95 V

1 mm

111 MHz

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e0

.0003 Amp

1,2,4,8

11.5 mm

7 ns

K4F170112C-FC60

Samsung

FAST PAGE DRAM

COMMERCIAL

24

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

16777216 words

NO

SEPARATE

5

3.3

1

SMALL OUTLINE, THIN PROFILE

TSOP24/26,.36

DRAMs

1.27 mm

70 Cel

3-STATE

16MX1

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.0005 Amp

17.14 mm

60 ns

KMM5321204BWG-6

Samsung

EDO DRAM MODULE

COMMERCIAL

72

SIMM

1024

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

300 mA

1048576 words

NO

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

16

DRAMs

1.27 mm

70 Cel

3-STATE

1MX32

1M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

19.05 mm

Not Qualified

33554432 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.002 Amp

60 ns

K4H510438B-VLB3

Samsung

DDR1 DRAM

COMMERCIAL

54

TSSOP

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

134217728 words

2,4,8

COMMON

2.5

2.5

4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP54,.46,16

DRAMs

.4 mm

70 Cel

3-STATE

128MX4

128M

0 Cel

MATTE TIN

DUAL

R-PDSO-G54

1

166 MHz

Not Qualified

536870912 bit

e3

.005 Amp

2,4,8

.7 ns

K4H511638F-LLB30

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

380 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

DUAL

1

R-PDSO-G66

3

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

260

.005 Amp

2,4,8

22.22 mm

.7 ns

KMM366S823CTS-GL

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1000 mA

8388608 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

100 MHz

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6 ns

KMM965G512BPN-G8

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

1024

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

630 mA

524288 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

512KX64

512K

0 Cel

ZIG-ZAG

1

R-XZMA-N144

3.6 V

125 MHz

Not Qualified

33554432 bit

3 V

AUTO/SELF REFRESH

.008 Amp

6.5 ns

K4T1G164QJ-BIE70

Samsung

DDR2 DRAM

INDUSTRIAL

84

VFBGA

RECTANGULAR

PLASTIC/EPOXY

MULTI BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

67108864 words

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX16

64M

-40 Cel

BOTTOM

1

R-PBGA-B84

1.9 V

1 mm

7.5 mm

1073741824 bit

1.7 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

12.5 mm

.4 ns

MR16R0824BM0-CK8

Samsung

RAMBUS DRAM MODULE

184

DIMM

RECTANGULAR

UNSPECIFIED

BLOCK ORIENTED PROTOCOL

NO

1

CMOS

NO LEAD

SYNCHRONOUS

33554432 words

YES

COMMON

2.5

1.8/2.5,2.5

16

MICROELECTRONIC ASSEMBLY

DIMM184,40

DRAMs

1 mm

3-STATE

32MX16

32M

DUAL

1

R-XDMA-N184

2.63 V

800 MHz

Not Qualified

536870912 bit

2.37 V

SELF CONTAINED REFRESH

45 ns

KM48S8030AT-G10TD

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

150 mA

8388608 words

1,2,4,8,FP

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

R-PDSO-G54

3

100 MHz

Not Qualified

67108864 bit

e0

.002 Amp

4,8

7 ns

K4M28163LH-BL1LT

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

8388608 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B54

1

111 MHz

Not Qualified

134217728 bit

e3

.0005 Amp

1,2,4,8

7 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.