Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
300 mA |
268435456 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
256MX4 |
256M |
0 Cel |
DUAL |
R-PDSO-G66 |
3 |
133 MHz |
Not Qualified |
1073741824 bit |
240 |
.008 Amp |
2,4,8 |
.75 ns |
|||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3060 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
100 MHz |
Not Qualified |
2415919104 bit |
3 V |
AUTO/SELF REFRESH |
.038 Amp |
6 ns |
|||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
50 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
20.95 mm |
60 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
125 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
1 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
|||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
336 mA |
8388608 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
301989888 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.006 Amp |
50 ns |
|||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP2-R |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
90 mA |
524288 words |
NO |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
YES |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0002 Amp |
18.41 mm |
80 ns |
||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
110 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
1 |
111 MHz |
Not Qualified |
67108864 bit |
.0005 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
873 mA |
2097152 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
25.4 mm |
Not Qualified |
75497472 bit |
.018 Amp |
70 ns |
||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
Not Qualified |
1073741824 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
||||||||||||||||||||||||||||||
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
DRAM CARD |
COMMERCIAL |
88 |
1024 |
UNSPECIFIED |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
MOS |
UNSPECIFIED |
ASYNCHRONOUS |
2097152 words |
3.3 |
32 |
MICROELECTRONIC ASSEMBLY |
16 |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
UNSPECIFIED |
1 |
X-XXMA-X88 |
3.6 V |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
70 ns |
||||||||||||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
1 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
2.7 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
14 mm |
.75 ns |
|||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP2 |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
65 mA |
65536 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.00015 Amp |
18.41 mm |
70 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
100 mA |
16777216 words |
NO |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX1 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
17.14 mm |
50 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP2 |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
80 mA |
262144 words |
NO |
COMMON |
5 |
5 |
18 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4718592 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0002 Amp |
18.41 mm |
80 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1818 mA |
33554432 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
50.8 mm |
Not Qualified |
2415919104 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
60 ns |
||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
220 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
240 |
.002 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2980 mA |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
100 MHz |
Not Qualified |
1207959552 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
|||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
320 mA |
33554432 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
32MX4 |
32M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G66 |
166 MHz |
Not Qualified |
134217728 bit |
e0 |
.003 Amp |
2,4,8 |
.7 ns |
|||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
24 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
75 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ20/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.76 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
15.88 mm |
60 ns |
|||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
340 mA |
134217728 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
128MX4 |
128M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.005 Amp |
2,4,8 |
22.22 mm |
.75 ns |
||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
28 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
110 mA |
2097152 words |
NO |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0002 Amp |
18.42 mm |
50 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
110 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX32 |
16M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
133 MHz |
Not Qualified |
536870912 bit |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
100 mA |
2097152 words |
YES |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0002 Amp |
18.415 mm |
60 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
640 mA |
8388608 words |
COMMON |
5 |
5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
5.5 V |
Not Qualified |
536870912 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
60 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
5000 mA |
134217728 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
133 MHz |
Not Qualified |
9663676416 bit |
3 V |
AUTO/SELF REFRESH |
.074 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
FAST PAGE DRAM |
INDUSTRIAL |
32 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
120 mA |
16777216 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
85 Cel |
3-STATE |
16MX4 |
16M |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
20.95 mm |
45 ns |
|||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
42 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
90 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ42,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
DUAL |
R-PDSO-J42 |
Not Qualified |
16777216 bit |
.0005 Amp |
60 ns |
|||||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
44 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
1048576 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0002 Amp |
20.95 mm |
60 ns |
|||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1380 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
133 MHz |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
.024 Amp |
.75 ns |
|||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
90 mA |
524288 words |
NO |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
18.42 mm |
80 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
100 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G24 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
17.14 mm |
60 ns |
|||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1260 mA |
134217728 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
30.15 mm |
933 MHz |
4 mm |
Not Qualified |
9663676416 bit |
1.425 V |
AUTO/SELF REFRESH; WD-MAX |
260 |
.09 Amp |
133.35 mm |
.195 ns |
||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
640 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N72 |
3.6 V |
25.4 mm |
Not Qualified |
134217728 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.0024 Amp |
60 ns |
||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
MULTI BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
5910 mA |
268435456 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
DRAMs |
1 mm |
95 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
3 |
1.9 V |
333 MHz |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.85 Amp |
.45 ns |
||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
Not Qualified |
1207959552 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
Not Qualified |
1073741824 bit |
2.5 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.65 ns |
||||||||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
640 mA |
4194304 words |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
134217728 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.008 Amp |
60 ns |
|||||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
290 mA |
33554432 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
32MX4 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.003 Amp |
2,4,8 |
22.22 mm |
.75 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
8192 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
150 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
1 |
111 MHz |
Not Qualified |
536870912 bit |
.0003 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1980 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
133 MHz |
Not Qualified |
1207959552 bit |
3 V |
AUTO/SELF REFRESH |
.018 Amp |
5.4 ns |
||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
90 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G28 |
Not Qualified |
16777216 bit |
e0 |
.0003 Amp |
50 ns |
|||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2340 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
36 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
31.75 mm |
Not Qualified |
1207959552 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
70 ns |
|||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1440 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
2 |
R-XDMA-N168 |
3.6 V |
25.4 mm |
Not Qualified |
301989888 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.009 Amp |
60 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2130 mA |
134217728 words |
YES |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
400 MHz |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
260 |
.09 Amp |
.4 ns |
|||||||||||||||||
|
Samsung |
DDR2 DRAM |
OTHER |
90 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
280 mA |
33554432 words |
4,8 |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
95 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B90 |
1 |
400 MHz |
Not Qualified |
536870912 bit |
e3 |
.005 Amp |
4,8 |
.4 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.