| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
13 mm |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
100 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
30 |
240 |
.001 Amp |
20.95 mm |
60 ns |
|||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX32 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
5.4 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
8192 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
165 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX16 |
16M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
S-PBGA-B54 |
105 MHz |
Not Qualified |
268435456 bit |
e0 |
.0005 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||||
|
Samsung |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2430 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
TIN SILVER COPPER |
DUAL |
R-PDMA-N168 |
3 |
100 MHz |
Not Qualified |
1207959552 bit |
e1 |
.018 Amp |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
40 |
ZIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
105 mA |
262144 words |
NO |
COMMON |
5 |
5 |
16 |
IN-LINE |
ZIP40,.1 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-PZIP-T40 |
5.5 V |
12.07 mm |
2.96 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0001 Amp |
100 ns |
||||||||||||||||
|
Samsung |
VIDEO DRAM |
64 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
.8 mm |
256KX16 |
256K |
DUAL |
2 |
R-PDSO-G64 |
3.6 V |
3 mm |
11.43 mm |
Not Qualified |
4194304 bit |
3 V |
26.03 mm |
70 ns |
||||||||||||||||||||||||||||||
|
|
Samsung |
DDR DRAM MODULE |
OTHER |
200 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1120 mA |
67108864 words |
YES |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
95 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
333 MHz |
Not Qualified |
4294967296 bit |
1.7 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.064 Amp |
.45 ns |
||||||||||||||||
|
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
110 mA |
16777216 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G32 |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
60 ns |
|||||||||||||||||||||||||
|
|
Samsung |
DDR3 DRAM |
OTHER |
78 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
200 mA |
268435456 words |
COMMON |
1.5 |
1.5 |
8 |
GRID ARRAY, FINE PITCH |
BGA78,9X13,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
256MX8 |
256M |
0 Cel |
BOTTOM |
R-PBGA-B78 |
400 MHz |
Not Qualified |
2147483648 bit |
.02 Amp |
.4 ns |
||||||||||||||||||||||||||
|
Samsung |
EDO DRAM |
INDUSTRIAL |
50 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
20.95 mm |
60 ns |
|||||||||||||||
|
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
480 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX32 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N72 |
3.6 V |
25.4 mm |
Not Qualified |
134217728 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.0024 Amp |
80 ns |
||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
66 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
8388608 words |
2,4,8 |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G66 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.02 Amp |
2,4,8 |
22.22 mm |
||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
60 |
TBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
280 mA |
33554432 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
8 |
GRID ARRAY, THIN PROFILE |
BGA60,9X12,40/32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.7 V |
1.05 mm |
133 MHz |
8.1 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.003 Amp |
2,4,8 |
15.1 mm |
.75 ns |
||||||||||||
|
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
140 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B90 |
1 |
111 MHz |
Not Qualified |
268435456 bit |
e3 |
.0003 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||
|
|
Samsung |
GDDR4 DRAM |
OTHER |
136 |
FBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
1190 mA |
16777216 words |
8 |
COMMON |
1.8 |
1.8 |
32 |
GRID ARRAY, FINE PITCH |
BGA136,12X17,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX32 |
16M |
0 Cel |
BOTTOM |
R-PBGA-B136 |
1200 MHz |
Not Qualified |
536870912 bit |
.123 Amp |
8 |
.19 ns |
||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
16MX8 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
22.22 mm |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
460 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX64 |
1M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
100 MHz |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
.004 Amp |
8 ns |
|||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3270 mA |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
100 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
1.06 Amp |
||||||||||||||||||
|
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
60 mA |
4194304 words |
YES |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0002 Amp |
18.41 mm |
80 ns |
|||||||||||||||
|
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
LFBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
290 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B90 |
3 |
2.7 V |
1.45 mm |
105 MHz |
11 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
260 |
.0012 Amp |
1,2,4,8 |
13 mm |
7 ns |
||||||||||||
|
Samsung |
VIDEO DRAM |
COMMERCIAL |
64 |
SSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
262144 words |
YES |
3.3 |
16 |
SMALL OUTLINE, SHRINK PITCH |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
DUAL |
2 |
R-PDSO-G64 |
3.6 V |
3 mm |
11.43 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH; 512 X 16 SAM PORT |
26.03 mm |
80 ns |
|||||||||||||||||||||||
|
Samsung |
EDO DRAM |
INDUSTRIAL |
50 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
20.95 mm |
50 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
32MX16 |
32M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
11.5 mm |
5.4 ns |
|||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
125 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G54 |
100 MHz |
Not Qualified |
67108864 bit |
e0 |
.001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||||
|
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1980 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
31.75 mm |
Not Qualified |
1207959552 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
50 ns |
||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
135 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G54 |
83 MHz |
Not Qualified |
67108864 bit |
e0 |
.002 Amp |
4,8 |
8 ns |
|||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
.6 mm |
85 Cel |
512MX72 |
512M |
0 Cel |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
30.13 mm |
3.8 mm |
38654705664 bit |
1.425 V |
AUTO/SELF REFRESH; WD-MAX |
67.6 mm |
|||||||||||||||||||||||||||
|
Samsung |
EDO DRAM |
COMMERCIAL |
50 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
90 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G50 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
20.95 mm |
60 ns |
|||||||||||||||
|
Samsung |
SYNCHRONOUS GRAPHICS RAM |
COMMERCIAL |
100 |
QFP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
300 mA |
262144 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK |
QFP100,.7X.9 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
3 mm |
143 MHz |
14 mm |
Not Qualified |
8388608 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
4,8 |
20 mm |
6 ns |
||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
120 mA |
2097152 words |
1,2,4,8,FP |
COMMON |
1.8/2.5,2.5 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B90 |
166 MHz |
Not Qualified |
67108864 bit |
e0 |
.0005 Amp |
1,2,4,8 |
5.4 ns |
||||||||||||||||||||||||
|
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1980 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
1207959552 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.009 Amp |
50 ns |
|||||||||||||||||||||
|
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
75 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
.0002 Amp |
17.14 mm |
60 ns |
||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1025 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N200 |
3.6 V |
100 MHz |
Not Qualified |
603979776 bit |
3 V |
AUTO/SELF REFRESH |
.009 Amp |
6 ns |
|||||||||||||||||||
|
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
4194304 words |
YES |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
4MX16 |
4M |
-25 Cel |
BOTTOM |
1 |
S-PBGA-B54 |
3 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
67108864 bit |
2.7 V |
AUTO/SELF REFRESH |
8 mm |
7 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
210 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX4 |
32M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
|
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2097152 words |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
16 |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
67108864 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
60 ns |
||||||||||||||||||||||||||||
|
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
16MX16 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3 |
2.7 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
11 mm |
7 ns |
|||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
140 mA |
4194304 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
|
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1125 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
125 MHz |
Not Qualified |
603979776 bit |
3 V |
AUTO/SELF REFRESH |
.009 Amp |
6 ns |
||||||||||||||||||
|
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2147483648 words |
YES |
1.35 |
72 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
2GX72 |
2G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.45 V |
Not Qualified |
154618822656 bit |
1.283 V |
AUTO/SELF REFRESH |
133.35 mm |
.225 ns |
|||||||||||||||||||||||||||
|
Samsung |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
130 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0005 Amp |
20.95 mm |
70 ns |
|||||||||||||||
|
Samsung |
EDO DRAM |
COMMERCIAL |
50 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
120 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
20.95 mm |
50 ns |
|||||||||||||||
|
Samsung |
DDR DRAM MODULE |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
128MX72 |
128M |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
9663676416 bit |
1.7 V |
SELF CONTAINED REFRESH |
30 |
230 |
.45 ns |
||||||||||||||||||||||||||||||
|
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
8192 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
180 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
BOTTOM |
S-PBGA-B54 |
111 MHz |
Not Qualified |
536870912 bit |
.001 Amp |
1,2,4,8 |
7 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX64 |
32M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
133 MHz |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.75 ns |
|||||||||||||||||||
|
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSSOP |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
345 mA |
33554432 words |
2,4,8 |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP66,.46 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
32MX16 |
32M |
0 Cel |
DUAL |
R-PDSO-G66 |
3 |
133 MHz |
Not Qualified |
536870912 bit |
260 |
.005 Amp |
2,4,8 |
.75 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.