Samsung DRAM 2,400+

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4D553238F-GC330

Samsung

GDDR1 DRAM

COMMERCIAL

144

LFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

2.5

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

65 Cel

8MX32

8M

0 Cel

BOTTOM

1

S-PBGA-B144

2.625 V

1.4 mm

12 mm

Not Qualified

268435456 bit

2.375 V

AUTO/SELF REFRESH

12 mm

.55 ns

K4S643232H-TC50

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

86

TSSOP

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

170 mA

2097152 words

1,2,4,8,FP

COMMON

3.3

3.3

32

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP86,.46,20

DRAMs

.5 mm

70 Cel

3-STATE

2MX32

2M

0 Cel

TIN LEAD

DUAL

R-PDSO-G86

3

200 MHz

Not Qualified

67108864 bit

e0

.002 Amp

1,2,4,8

4.5 ns

KMM364C1680BS-5

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

168

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

16777216 words

5

64

MICROELECTRONIC ASSEMBLY

70 Cel

16MX64

16M

0 Cel

DUAL

1

R-XDMA-N168

5.5 V

Not Qualified

1073741824 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

50 ns

KM416V1000AJ-F6

Samsung

FAST PAGE DRAM

COMMERCIAL

42

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

90 mA

1048576 words

NO

COMMON

3.3

3.3

16

SMALL OUTLINE

SOJ42,.44

DRAMs

1.27 mm

70 Cel

3-STATE

1MX16

1M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J42

3.6 V

3.56 mm

10.16 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0002 Amp

27.305 mm

60 ns

K4M563233E-EF1H

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

300 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

105 MHz

Not Qualified

268435456 bit

.0012 Amp

1,2,4,8

7 ns

M381L3323BT1-LA0

Samsung

KM416S16230AT-G/F8

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

3 V

22.22 mm

6 ns

K4S563233F-HG60

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

200 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

166 MHz

Not Qualified

268435456 bit

.0005 Amp

1,2,4,8

5.4 ns

KMM53216004BK-6

Samsung

EDO DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

880 mA

16777216 words

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

16MX32

16M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

536870912 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.008 Amp

60 ns

K4S51163LF-YL1H

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

280 mA

33554432 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B54

111 MHz

Not Qualified

536870912 bit

e0

.001 Amp

1,2,4,8

7 ns

KMM466S824AT2-F0

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

144

DIMM

4096

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

720 mA

8388608 words

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

R-PDMA-N144

29.21 mm

100 MHz

Not Qualified

536870912 bit

.016 Amp

7 ns

KMM372C803AS-6

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1260 mA

8388608 words

COMMON

5

5

72

MICROELECTRONIC ASSEMBLY

DIMM168

Other Memory ICs

1.27 mm

70 Cel

3-STATE

8MX72

8M

0 Cel

DUAL

1

R-XDMA-N168

5.5 V

31.75 mm

Not Qualified

603979776 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.03 Amp

60 ns

K4M513233C-SG750

Samsung

SYNCHRONOUS DRAM

OTHER

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

180 mA

16777216 words

1,2,4,8,FP

YES

COMMON

3

3/3.3

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-25 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B90

3.6 V

1 mm

133 MHz

11 mm

Not Qualified

536870912 bit

2.7 V

AUTO/SELF REFRESH

e0

.001 Amp

1,2,4,8

13 mm

5.4 ns

KMM377S6428T3-GL

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3780 mA

67108864 words

YES

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

100 MHz

Not Qualified

4831838208 bit

3 V

AUTO/SELF REFRESH

.038 Amp

6 ns

K4S561633F-XF1L0

Samsung

SYNCHRONOUS DRAM

OTHER

54

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

-25 Cel

BOTTOM

1

R-PBGA-B54

3.6 V

1.2 mm

8 mm

Not Qualified

268435456 bit

2.7 V

AUTO/SELF REFRESH

30

240

11 mm

7 ns

K4H511638C-ZIB00

Samsung

DDR1 DRAM

INDUSTRIAL

60

TFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

345 mA

33554432 words

2,4,8

YES

COMMON

2.5

2.5

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA60,9X12,40/32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-40 Cel

BOTTOM

1

R-PBGA-B60

2.7 V

1.2 mm

133 MHz

10 mm

Not Qualified

536870912 bit

2.3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

.005 Amp

2,4,8

12 mm

.75 ns

M383L1713CT1-CA2

Samsung

DDR DRAM MODULE

COMMERCIAL

184

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

16777216 words

YES

2.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

16MX72

16M

0 Cel

DUAL

1

R-XDMA-N184

1

2.7 V

Not Qualified

1207959552 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

KMM364C804CS-5

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

580 mA

8388608 words

COMMON

5

5

64

MICROELECTRONIC ASSEMBLY

DIMM168

DRAMs

1.27 mm

70 Cel

3-STATE

8MX64

8M

0 Cel

DUAL

1

R-XDMA-N168

5.5 V

Not Qualified

536870912 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.03 Amp

50 ns

M53633201CE0-C60

Samsung

EDO DRAM MODULE

COMMERCIAL

72

SIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1224 mA

33554432 words

COMMON

5

5

36

MICROELECTRONIC ASSEMBLY

SSIM72

DRAMs

1.27 mm

70 Cel

3-STATE

32MX36

32M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

1207959552 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.024 Amp

60 ns

K4F640812E-JL45

Samsung

FAST PAGE DRAM

COMMERCIAL

32

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

J BEND

ASYNCHRONOUS

120 mA

8388608 words

YES

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J32

3.6 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

e0

.0002 Amp

20.96 mm

45 ns

M53230800CB0-C60

Samsung

EDO DRAM MODULE

COMMERCIAL

72

RECTANGULAR

UNSPECIFIED

FAST PAGE WITH EDO

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

8388608 words

5

32

MICROELECTRONIC ASSEMBLY

70 Cel

8MX32

8M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

Not Qualified

268435456 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

60 ns

K4H561638J-LCB3T

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

270 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

166 MHz

10.16 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e3/e6

.003 Amp

2,4,8

22.22 mm

.7 ns

M966G5115AP0-C60

Samsung

SYNCHRONOUS GRAPHICS RAM MODULE

COMMERCIAL

144

DIMM

2048

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

520 mA

524288 words

YES

COMMON

3.3

3.3

64

MICROELECTRONIC ASSEMBLY

DIMM144,32

DRAMs

.8 mm

70 Cel

3-STATE

512KX64

512K

0 Cel

DUAL

1

R-XDMA-N144

3.6 V

166 MHz

Not Qualified

33554432 bit

3 V

AUTO/SELF REFRESH

.004 Amp

5.5 ns

K4H561638D-GCB0

Samsung

DDR1 DRAM

COMMERCIAL

60

TBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

300 mA

16777216 words

2,4,8

YES

COMMON

2.5

2.5

16

GRID ARRAY, THIN PROFILE

BGA60,9X12,40/32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

0 Cel

TIN LEAD

BOTTOM

1

R-PBGA-B60

2.7 V

1.05 mm

133 MHz

8.1 mm

Not Qualified

268435456 bit

2.3 V

AUTO/SELF REFRESH

e0

.003 Amp

2,4,8

15.1 mm

.75 ns

K4E660812D-TL50

Samsung

EDO DRAM

COMMERCIAL

32

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

110 mA

8388608 words

YES

COMMON

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP32,.46

DRAMs

1.27 mm

70 Cel

3-STATE

8MX8

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G32

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

e0

.0002 Amp

20.95 mm

50 ns

KM44C4103BS-6

Samsung

FAST PAGE DRAM

COMMERCIAL

24

TSOP2

2048

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

100 mA

4194304 words

NO

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP28,.46

DRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

e0

.001 Amp

17.14 mm

60 ns

KM432V502T-L8

Samsung

FAST PAGE DRAM

COMMERCIAL

70

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

70 mA

524288 words

YES

COMMON

3.3

3.3

32

SMALL OUTLINE, THIN PROFILE

TSSOP70,.46

DRAMs

.65 mm

70 Cel

3-STATE

512KX32

512K

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G70

3.6 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0005 Amp

23.49 mm

80 ns

KMM372V400AS-6

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1440 mA

4194304 words

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

36

Other Memory ICs

1.27 mm

70 Cel

3-STATE

4MX72

4M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

25.4 mm

Not Qualified

301989888 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.05 Amp

60 ns

KMMR18R4GC1L-M8

Samsung

RAMBUS DRAM MODULE

184

DIMM

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

67108864 words

COMMON

1.8/2.5,2.5

18

MICROELECTRONIC ASSEMBLY

DIMM184,40

DRAMs

1 mm

3-STATE

64MX18

64M

DUAL

R-PDMA-N184

800 MHz

Not Qualified

1207959552 bit

40 ns

KMM390S6450AT1-GA0

Samsung

SYNCHRONOUS DRAM MODULE

COMMERCIAL

168

DIMM

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

3.3

72

MICROELECTRONIC ASSEMBLY

70 Cel

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

Not Qualified

4831838208 bit

3 V

AUTO/SELF REFRESH

5.4 ns

M381L6423CT1-CLA20

Samsung

DDR DRAM MODULE

COMMERCIAL

184

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

2.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

Not Qualified

4831838208 bit

2.3 V

AUTO/SELF REFRESH

.75 ns

M392B1K73DM0-CH9

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

8192

RECTANGULAR

UNSPECIFIED

FOUR BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2335 mA

1073741824 words

YES

COMMON

1.5

1.5

72

MICROELECTRONIC ASSEMBLY

DIMM240,40

Other Memory ICs

1 mm

85 Cel

3-STATE

1GX72

1G

0 Cel

DUAL

1

R-XDMA-N240

1.575 V

18.9 mm

667 MHz

Not Qualified

77309411328 bit

1.425 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

1.012 Amp

133.35 mm

20 ns

KMM372V213AJ-6

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

168

DIMM

2048

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

900 mA

2097152 words

NO

COMMON

3.3

3.3

72

MICROELECTRONIC ASSEMBLY

DIMM168

32

Other Memory ICs

1.27 mm

70 Cel

3-STATE

2MX72

2M

0 Cel

DUAL

1

R-XDMA-N168

3.6 V

25.4 mm

Not Qualified

150994944 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.05 Amp

60 ns

K4E660812D-JP60

Samsung

EDO DRAM

INDUSTRIAL

32

SOJ

8192

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

100 mA

8388608 words

YES

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ32,.44

DRAMs

1.27 mm

85 Cel

3-STATE

8MX8

8M

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-J32

3.6 V

3.76 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

e0

.0002 Amp

20.96 mm

60 ns

MR18R326GAG0-CT9

Samsung

RAMBUS DRAM MODULE

184

DIMM

RECTANGULAR

UNSPECIFIED

BLOCK ORIENTED PROTOCOL

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3330 mA

536870912 words

YES

COMMON

2.5

1.8/2.5,2.5

18

MICROELECTRONIC ASSEMBLY

DIMM184,40

DRAMs

1 mm

3-STATE

512MX18

512M

DUAL

1

R-XDMA-N184

3

2.63 V

1066 MHz

Not Qualified

9663676416 bit

2.37 V

SELF CONTAINED REFRESH

260

32 ns

KMM372C400BS-6

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

168

DIMM

4096

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1440 mA

4194304 words

COMMON

5

5

72

MICROELECTRONIC ASSEMBLY

DIMM168

36

Other Memory ICs

1.27 mm

70 Cel

3-STATE

4MX72

4M

0 Cel

DUAL

1

R-XDMA-N168

5.5 V

25.4 mm

Not Qualified

301989888 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.03 Amp

60 ns

KM44C4002ALLS-5

Samsung

STATIC COLUMN DRAM

COMMERCIAL

24

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

STATIC COLUMN

YES

1

CMOS

GULL WING

ASYNCHRONOUS

90 mA

4194304 words

YES

COMMON

5

5

4

SMALL OUTLINE, THIN PROFILE

TSOP24/26,.36

SRAMs

1.27 mm

70 Cel

3-STATE

4MX4

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G24

5.5 V

1.2 mm

7.62 mm

Not Qualified

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0002 Amp

17.14 mm

50 ns

K4S641633H-RN1H

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

4194304 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B54

105 MHz

Not Qualified

67108864 bit

e0

.0005 Amp

1,2,4,8

7 ns

K4E151611C-T5000

Samsung

EDO DRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

GULL WING

ASYNCHRONOUS

1048576 words

5

16

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

1MX16

1M

0 Cel

DUAL

1

R-PDSO-G44

5.5 V

1.2 mm

10.16 mm

16777216 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

20.95 mm

50 ns

K4H560838F-UCCC0

Samsung

DDR1 DRAM

COMMERCIAL

66

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

310 mA

33554432 words

2,4,8

YES

COMMON

2.6

2.6

8

SMALL OUTLINE, THIN PROFILE

TSSOP66,.46

DRAMs

.65 mm

70 Cel

3-STATE

32MX8

32M

0 Cel

DUAL

1

R-PDSO-G66

2

2.7 V

1.2 mm

200 MHz

10.16 mm

Not Qualified

268435456 bit

2.5 V

AUTO/SELF REFRESH

.004 Amp

2,4,8

22.22 mm

.65 ns

K4M56163PG-BG75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

75 mA

16777216 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B54

1

133 MHz

Not Qualified

268435456 bit

e3

.00001 Amp

1,2,4,8

6 ns

K4F660812E-TP50

Samsung

FAST PAGE DRAM

INDUSTRIAL

32

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE

YES

1

CMOS

GULL WING

ASYNCHRONOUS

8388608 words

YES

3.3

8

SMALL OUTLINE, THIN PROFILE

1.27 mm

85 Cel

8MX8

8M

-40 Cel

DUAL

1

R-PDSO-G32

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH

20.95 mm

50 ns

M395T6553CZ4-CD501

Samsung

DDR DRAM MODULE

OTHER

240

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

1.8

72

MICROELECTRONIC ASSEMBLY

85 Cel

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N240

2

1.9 V

Not Qualified

4831838208 bit

1.7 V

AUTO/SELF REFRESH

M381L6423CTL-CA0

Samsung

DDR DRAM MODULE

COMMERCIAL

184

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

67108864 words

YES

2.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

64MX72

64M

0 Cel

DUAL

1

R-XDMA-N184

2.7 V

Not Qualified

4831838208 bit

2.3 V

AUTO/SELF REFRESH

.8 ns

KM48V2004BK-L8

Samsung

EDO DRAM

COMMERCIAL

28

SOJ

4096

RECTANGULAR

PLASTIC/EPOXY

FAST PAGE WITH EDO

YES

1

CMOS

J BEND

ASYNCHRONOUS

60 mA

2097152 words

YES

COMMON

3.3

3.3

8

SMALL OUTLINE

SOJ28,.34

DRAMs

1.27 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-J28

3.6 V

3.76 mm

7.62 mm

Not Qualified

16777216 bit

3 V

RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH

e0

.0003 Amp

18.42 mm

80 ns

KMM5322100BKU-5

Samsung

FAST PAGE DRAM MODULE

COMMERCIAL

72

SIMM

2048

RECTANGULAR

UNSPECIFIED

FAST PAGE

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

440 mA

2097152 words

NO

COMMON

5

5

32

MICROELECTRONIC ASSEMBLY

SSIM72

16

DRAMs

1.27 mm

70 Cel

3-STATE

2MX32

2M

0 Cel

SINGLE

1

R-XSMA-N72

5.5 V

25.4 mm

Not Qualified

67108864 bit

4.5 V

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

.004 Amp

50 ns

K4M56163LG-BL75T

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

16777216 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B54

1

133 MHz

Not Qualified

268435456 bit

e3

.001 Amp

1,2,4,8

5.4 ns

K4S561632B-TC1H0

Samsung

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

16MX16

16M

0 Cel

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

NOT SPECIFIED

NOT SPECIFIED

22.22 mm

6 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.