Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
GDDR1 DRAM |
COMMERCIAL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
2.5 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
65 Cel |
8MX32 |
8M |
0 Cel |
BOTTOM |
1 |
S-PBGA-B144 |
2.625 V |
1.4 mm |
12 mm |
Not Qualified |
268435456 bit |
2.375 V |
AUTO/SELF REFRESH |
12 mm |
.55 ns |
|||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
86 |
TSSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
170 mA |
2097152 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP86,.46,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G86 |
3 |
200 MHz |
Not Qualified |
67108864 bit |
e0 |
.002 Amp |
1,2,4,8 |
4.5 ns |
||||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
16777216 words |
5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
5.5 V |
Not Qualified |
1073741824 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
50 ns |
|||||||||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
42 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
90 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ42,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-J42 |
3.6 V |
3.56 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0002 Amp |
27.305 mm |
60 ns |
|||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
300 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
70 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
105 MHz |
Not Qualified |
268435456 bit |
.0012 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||||||
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
22.22 mm |
6 ns |
|||||||||||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
FBGA |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
200 mA |
8388608 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
32 |
GRID ARRAY, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
8MX32 |
8M |
-25 Cel |
BOTTOM |
R-PBGA-B90 |
166 MHz |
Not Qualified |
268435456 bit |
.0005 Amp |
1,2,4,8 |
5.4 ns |
||||||||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
880 mA |
16777216 words |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX32 |
16M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
536870912 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.008 Amp |
60 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
8192 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
280 mA |
33554432 words |
1,2,4,8,FP |
COMMON |
1.8/2.5,2.5 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX16 |
32M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
S-PBGA-B54 |
111 MHz |
Not Qualified |
536870912 bit |
e0 |
.001 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
720 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
R-PDMA-N144 |
29.21 mm |
100 MHz |
Not Qualified |
536870912 bit |
.016 Amp |
7 ns |
||||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1260 mA |
8388608 words |
COMMON |
5 |
5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
5.5 V |
31.75 mm |
Not Qualified |
603979776 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
60 ns |
||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
90 |
VFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
180 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3 |
3/3.3 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA90,9X15,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX32 |
16M |
-25 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B90 |
3.6 V |
1 mm |
133 MHz |
11 mm |
Not Qualified |
536870912 bit |
2.7 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
13 mm |
5.4 ns |
||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3780 mA |
67108864 words |
YES |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
100 MHz |
Not Qualified |
4831838208 bit |
3 V |
AUTO/SELF REFRESH |
.038 Amp |
6 ns |
|||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX16 |
16M |
-25 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
268435456 bit |
2.7 V |
AUTO/SELF REFRESH |
30 |
240 |
11 mm |
7 ns |
|||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
INDUSTRIAL |
60 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
345 mA |
33554432 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA60,9X12,40/32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
32MX16 |
32M |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
2.7 V |
1.2 mm |
133 MHz |
10 mm |
Not Qualified |
536870912 bit |
2.3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.005 Amp |
2,4,8 |
12 mm |
.75 ns |
|||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
1 |
2.7 V |
Not Qualified |
1207959552 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
580 mA |
8388608 words |
COMMON |
5 |
5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
5.5 V |
Not Qualified |
536870912 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
50 ns |
|||||||||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1224 mA |
33554432 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX36 |
32M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
1207959552 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.024 Amp |
60 ns |
|||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
32 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
120 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J32 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
20.96 mm |
45 ns |
|||||||||||||||
Samsung |
EDO DRAM MODULE |
COMMERCIAL |
72 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX32 |
8M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
268435456 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
60 ns |
|||||||||||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
270 mA |
16777216 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2 |
2.7 V |
1.2 mm |
166 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
e3/e6 |
.003 Amp |
2,4,8 |
22.22 mm |
.7 ns |
|||||||||||
Samsung |
SYNCHRONOUS GRAPHICS RAM MODULE |
COMMERCIAL |
144 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
520 mA |
524288 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
512KX64 |
512K |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
166 MHz |
Not Qualified |
33554432 bit |
3 V |
AUTO/SELF REFRESH |
.004 Amp |
5.5 ns |
|||||||||||||||||||
Samsung |
DDR1 DRAM |
COMMERCIAL |
60 |
TBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
300 mA |
16777216 words |
2,4,8 |
YES |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
BGA60,9X12,40/32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B60 |
2.7 V |
1.05 mm |
133 MHz |
8.1 mm |
Not Qualified |
268435456 bit |
2.3 V |
AUTO/SELF REFRESH |
e0 |
.003 Amp |
2,4,8 |
15.1 mm |
.75 ns |
||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
20.95 mm |
50 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
100 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
17.14 mm |
60 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM |
COMMERCIAL |
70 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
70 mA |
524288 words |
YES |
COMMON |
3.3 |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE |
TSSOP70,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX32 |
512K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G70 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0005 Amp |
23.49 mm |
80 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1440 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
36 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
25.4 mm |
Not Qualified |
301989888 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.05 Amp |
60 ns |
|||||||||||||||||||
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
67108864 words |
COMMON |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
64MX18 |
64M |
DUAL |
R-PDMA-N184 |
800 MHz |
Not Qualified |
1207959552 bit |
40 ns |
||||||||||||||||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
4831838208 bit |
3 V |
AUTO/SELF REFRESH |
5.4 ns |
|||||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
2335 mA |
1073741824 words |
YES |
COMMON |
1.5 |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
85 Cel |
3-STATE |
1GX72 |
1G |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
18.9 mm |
667 MHz |
Not Qualified |
77309411328 bit |
1.425 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
1.012 Amp |
133.35 mm |
20 ns |
||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
900 mA |
2097152 words |
NO |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
32 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
2MX72 |
2M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
25.4 mm |
Not Qualified |
150994944 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.05 Amp |
60 ns |
||||||||||||||||||
Samsung |
EDO DRAM |
INDUSTRIAL |
32 |
SOJ |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
100 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
DRAMs |
1.27 mm |
85 Cel |
3-STATE |
8MX8 |
8M |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-J32 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e0 |
.0002 Amp |
20.96 mm |
60 ns |
|||||||||||||||
|
Samsung |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
3330 mA |
536870912 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
512MX18 |
512M |
DUAL |
1 |
R-XDMA-N184 |
3 |
2.63 V |
1066 MHz |
Not Qualified |
9663676416 bit |
2.37 V |
SELF CONTAINED REFRESH |
260 |
32 ns |
|||||||||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1440 mA |
4194304 words |
COMMON |
5 |
5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
36 |
Other Memory ICs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
5.5 V |
25.4 mm |
Not Qualified |
301989888 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.03 Amp |
60 ns |
|||||||||||||||||||
Samsung |
STATIC COLUMN DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
STATIC COLUMN |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
90 mA |
4194304 words |
YES |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/26,.36 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0002 Amp |
17.14 mm |
50 ns |
|||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
4096 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
120 mA |
4194304 words |
1,2,4,8,FP |
COMMON |
3/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-25 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
S-PBGA-B54 |
105 MHz |
Not Qualified |
67108864 bit |
e0 |
.0005 Amp |
1,2,4,8 |
7 ns |
||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
1048576 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
20.95 mm |
50 ns |
|||||||||||||||||||||||||||
|
Samsung |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
310 mA |
33554432 words |
2,4,8 |
YES |
COMMON |
2.6 |
2.6 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2 |
2.7 V |
1.2 mm |
200 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
2.5 V |
AUTO/SELF REFRESH |
.004 Amp |
2,4,8 |
22.22 mm |
.65 ns |
||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
8192 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
75 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
16MX16 |
16M |
-25 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B54 |
1 |
133 MHz |
Not Qualified |
268435456 bit |
e3 |
.00001 Amp |
1,2,4,8 |
6 ns |
|||||||||||||||||||||
Samsung |
FAST PAGE DRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
8388608 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
85 Cel |
8MX8 |
8M |
-40 Cel |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
20.95 mm |
50 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
2 |
1.9 V |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||
Samsung |
DDR DRAM MODULE |
COMMERCIAL |
184 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
Not Qualified |
4831838208 bit |
2.3 V |
AUTO/SELF REFRESH |
.8 ns |
||||||||||||||||||||||||||||||
Samsung |
EDO DRAM |
COMMERCIAL |
28 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
60 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
3.6 V |
3.76 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0003 Amp |
18.42 mm |
80 ns |
|||||||||||||||
Samsung |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
440 mA |
2097152 words |
NO |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
25.4 mm |
Not Qualified |
67108864 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.004 Amp |
50 ns |
||||||||||||||||||
|
Samsung |
SYNCHRONOUS DRAM |
OTHER |
54 |
FBGA |
8192 |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
120 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
2.5 |
2.5 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,9X9,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
-25 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B54 |
1 |
133 MHz |
Not Qualified |
268435456 bit |
e3 |
.001 Amp |
1,2,4,8 |
5.4 ns |
|||||||||||||||||||||
Samsung |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.22 mm |
6 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.