Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
16777216 words |
YES |
3.3 |
1 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
16MX1 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G24 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH |
17.14 mm |
60 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2097152 words |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
2MX32 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
67108864 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
60 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
18.41 mm |
70 ns |
|||||||||||||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM |
MILITARY |
50 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
FLAT |
SYNCHRONOUS |
1048576 words |
3.3 |
16 |
FLATPACK |
.8 mm |
125 Cel |
1MX16 |
1M |
-55 Cel |
DUAL |
1 |
R-CDFP-F50 |
3.465 V |
3.55 mm |
16.5 mm |
Not Qualified |
16777216 bit |
3.135 V |
AUTO REFRESH |
21 mm |
8 ns |
||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
42 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
YES |
3.3 |
16 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-J42 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH |
27.38 mm |
80 ns |
||||||||||||||||||||||||
Texas Instruments |
EDO DRAM |
COMMERCIAL |
42 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
16 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-J42 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
27.305 mm |
60 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
20 |
ZIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
3.3 |
1 |
IN-LINE |
1.27 mm |
70 Cel |
4MX1 |
4M |
0 Cel |
ZIG-ZAG |
1 |
R-PZIP-T20 |
3.6 V |
10.16 mm |
2.8 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
80 ns |
||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
3.3 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-J24 |
3.6 V |
3.76 mm |
7.57 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
17.145 mm |
100 ns |
|||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1048576 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
18 |
70 Cel |
3-STATE |
1MX36 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
37748736 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
80 ns |
||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1048576 words |
5 |
40 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1MX40 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
41943040 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
70 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
50 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE |
SOJ24/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-J24 |
3.6 V |
3.76 mm |
7.62 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.0003 Amp |
17.145 mm |
80 ns |
|||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
150 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
125 MHz |
Not Qualified |
268435456 bit |
3 V |
.001 Amp |
6 ns |
|||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
OTHER |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
110 Cel |
3-STATE |
256KX1 |
256K |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
262144 bit |
NOT SPECIFIED |
NOT SPECIFIED |
120 ns |
|||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
512 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
970 mA |
524288 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
18 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.25 V |
25.4 mm |
Not Qualified |
18874368 bit |
4.75 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.04 Amp |
60 ns |
|||||||||||||||||||
Texas Instruments |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
MOS |
NO LEAD |
ASYNCHRONOUS |
960 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX64 |
2M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
134217728 bit |
3 V |
CAS BEFORE RAS REFRESH |
.008 Amp |
13 ns |
|||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP2 |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
160 mA |
262144 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
DUAL |
1 |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.00035 Amp |
18.41 mm |
70 ns |
|||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM |
MILITARY |
50 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
FLAT |
SYNCHRONOUS |
1048576 words |
3.3 |
16 |
FLATPACK |
125 Cel |
1MX16 |
1M |
-55 Cel |
DUAL |
1 |
R-CDFP-F50 |
3.465 V |
Not Qualified |
16777216 bit |
3.135 V |
AUTO REFRESH |
8 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2-R |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G24 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
17.14 mm |
80 ns |
|||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP2 |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
140 mA |
262144 words |
YES |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
DUAL |
1 |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.00035 Amp |
18.41 mm |
80 ns |
|||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
80 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
1048576 bit |
NOT SPECIFIED |
NOT SPECIFIED |
.002 Amp |
70 ns |
||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
512 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
520 mA |
262144 words |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
25.5778 mm |
Not Qualified |
8388608 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.008 Amp |
100 ns |
|||||||||||||||||||
Texas Instruments |
NIBBLE MODE DRAM |
COMMERCIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NIBBLE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
75 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ20/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
1.83 mm |
7.47 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.002 Amp |
16.51 mm |
80 ns |
||||||||||||||||
Texas Instruments |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
SINGLE BANK PAGE BURST |
NO |
1 |
MOS |
NO LEAD |
SYNCHRONOUS |
1280 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
GOLD |
DUAL |
1 |
R-PDMA-N168 |
3.6 V |
25.53 mm |
Not Qualified |
301989888 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
e4 |
.016 Amp |
133.35 mm |
70 ns |
||||||||||||||||
Texas Instruments |
EDO DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1048576 words |
YES |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
16 |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
33554432 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
80 ns |
|||||||||||||||||||||||||||
Texas Instruments |
NIBBLE MODE DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
DUAL |
R-PDIP-T18 |
Not Qualified |
1048576 bit |
150 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM |
COMMERCIAL |
44 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
130 mA |
4194304 words |
1,2,4,8 |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
DUAL |
R-PDSO-G44 |
100 MHz |
Not Qualified |
16777216 bit |
.002 Amp |
1,2,4,8 |
7.5 ns |
|||||||||||||||||||||||||
Texas Instruments |
NIBBLE MODE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
262144 bit |
120 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
EDO DRAM |
COMMERCIAL |
28 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
2097152 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
18.415 mm |
80 ns |
||||||||||||||||||||||||
Texas Instruments |
VIDEO DRAM |
MILITARY |
28 |
DIP |
512 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
3-STATE |
256KX4 |
256K |
-55 Cel |
DUAL |
2 |
R-CDIP-T28 |
5.25 V |
4.445 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.75 V |
CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT |
36.83 mm |
100 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
220 mA |
1048576 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
25.527 mm |
Not Qualified |
37748736 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.003 Amp |
80 ns |
||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
28 |
DFP |
4096 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
FLAT |
SYNCHRONOUS |
70 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
FLATPACK |
FL28,.5 |
DRAMs |
1.27 mm |
125 Cel |
3-STATE |
4MX4 |
4M |
-55 Cel |
DUAL |
1 |
R-CDFP-F28 |
5.5 V |
3.32 mm |
11.43 mm |
Not Qualified |
16777216 bit |
4.5 V |
CAS BEFORE RAS REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.001 Amp |
19.655 mm |
80 ns |
||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
OTHER |
18 |
QCCN |
256 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
PAGE |
YES |
1 |
NMOS |
NO LEAD |
ASYNCHRONOUS |
65536 words |
5 |
4 |
CHIP CARRIER |
1.27 mm |
110 Cel |
3-STATE |
64KX4 |
64K |
-55 Cel |
QUAD |
1 |
R-CQCC-N18 |
5.5 V |
2.18 mm |
7.24 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
12.32 mm |
150 ns |
||||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
COMMERCIAL |
30 |
SIMM |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
NO LEAD |
262144 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX9 |
256K |
0 Cel |
SINGLE |
R-PSMA-N30 |
16.51 mm |
Not Qualified |
2359296 bit |
200 ns |
|||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1184 mA |
8388608 words |
NO |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
33.147 mm |
Not Qualified |
301989888 bit |
4.5 V |
RAS ONLY, CAS BEFORE RAS, HIDDEN REFRESH |
.024 Amp |
70 ns |
|||||||||||||||||||
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM |
MILITARY |
50 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
MIL-STD-883 |
GULL WING |
SYNCHRONOUS |
180 mA |
1048576 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
DRAMs |
.8 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
-55 Cel |
DUAL |
1 |
R-PDSO-G50 |
3.465 V |
1.2 mm |
83 MHz |
10.16 mm |
Not Qualified |
16777216 bit |
3.135 V |
AUTO REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.002 Amp |
1,2,4,8 |
20.95 mm |
12 ns |
||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
255 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N30 |
5.5 V |
20.4978 mm |
Not Qualified |
9437184 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.003 Amp |
70 ns |
||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
20 |
ZIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
YES |
3.3 |
1 |
IN-LINE |
1.27 mm |
70 Cel |
4MX1 |
4M |
0 Cel |
ZIG-ZAG |
1 |
R-PZIP-T20 |
3.6 V |
10.16 mm |
2.8 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH |
70 ns |
|||||||||||||||||||||||||
Texas Instruments |
VIDEO DRAM |
MILITARY |
64 |
GDFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
PAGE |
YES |
1 |
CMOS |
FLAT |
ASYNCHRONOUS |
262144 words |
5 |
16 |
FLATPACK, GUARD RING |
.5 mm |
125 Cel |
256KX16 |
256K |
-55 Cel |
DUAL |
2 |
R-CDFP-F64 |
3.81 mm |
10.985 mm |
Not Qualified |
4194304 bit |
CAS BEFORE RAS/HIDDEN REFRESH |
18.485 mm |
80 ns |
||||||||||||||||||||||||||||
Texas Instruments |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1980 mA |
16777216 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
1207959552 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.009 Amp |
30 ns |
|||||||||||||||||||||
Texas Instruments |
EDO DRAM |
COMMERCIAL |
42 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
110 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ42,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-J42 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/BATTERY BACKUP/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.00015 Amp |
27.305 mm |
60 ns |
|||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
20 |
SOJ |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
262144 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
256KX4 |
256K |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-XDSO-J20 |
5.5 V |
2.54 mm |
8.385 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.145 mm |
150 ns |
||||||||||||||||||||||||
Texas Instruments |
VIDEO DRAM |
MILITARY |
28 |
ZIP |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
ASYNCHRONOUS |
110 mA |
262144 words |
5 |
5 |
4 |
IN-LINE |
ZIP28,.1 |
Other Memory ICs |
1.27 mm |
125 Cel |
256KX4 |
256K |
-55 Cel |
ZIG-ZAG |
2 |
R-XZIP-T28 |
5.5 V |
13.08 mm |
2.92 mm |
Not Qualified |
1048576 bit |
4.5 V |
CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.015 Amp |
36.83 mm |
120 ns |
||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
60 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE |
SOJ24/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-J24 |
3.6 V |
3.76 mm |
7.62 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.0002 Amp |
17.145 mm |
70 ns |
|||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM |
COMMERCIAL |
44 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
130 mA |
2097152 words |
1,2,4,8 |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
DUAL |
R-PDSO-G44 |
100 MHz |
Not Qualified |
16777216 bit |
.002 Amp |
1,2,4,8 |
7.5 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.