Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
133 MHz |
Not Qualified |
2415919104 bit |
2.3 V |
AUTO/SELF REFRESH |
.75 ns |
|||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
1MX1 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.55 mm |
7.7 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
17.15 mm |
60 ns |
|||||||||||||||||||||||
Toshiba |
NIBBLE MODE DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NIBBLE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.75 mm |
7.7 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.15 mm |
70 ns |
||||||||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
CMOS |
4194304 words |
18 |
4MX18 |
4M |
1 |
Not Qualified |
75497472 bit |
80 ns |
||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2097152 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
18 |
70 Cel |
2MX36 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
75497472 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
80 ns |
|||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
110 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
7 ns |
||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
262144 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
256KX8 |
256K |
0 Cel |
SINGLE |
1 |
R-XSMA-N30 |
5.5 V |
Not Qualified |
2097152 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
100 ns |
|||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
50 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T18 |
Not Qualified |
1048576 bit |
e0 |
.0003 Amp |
120 ns |
||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
24 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
4194304 words |
5 |
4 |
IN-LINE |
4MX4 |
4M |
ZIG-ZAG |
1 |
R-PZIP-T24 |
5.5 V |
Not Qualified |
16777216 bit |
4.5 V |
70 ns |
|||||||||||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
20 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
4194304 words |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
4MX4 |
4M |
DUAL |
1 |
R-PDSO-G20 |
5.5 V |
1.2 mm |
7.7 mm |
Not Qualified |
16777216 bit |
4.5 V |
17.14 mm |
50 ns |
|||||||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
24 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
4194304 words |
5 |
4 |
IN-LINE |
4MX4 |
4M |
ZIG-ZAG |
1 |
R-PZIP-T24 |
5.5 V |
Not Qualified |
16777216 bit |
4.5 V |
70 ns |
|||||||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
24.6 mm |
60 ns |
|||||||||||||||||||||||
Toshiba |
NIBBLE MODE DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
60 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T18 |
Not Qualified |
1048576 bit |
e0 |
.001 Amp |
100 ns |
||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8388608 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.45 V |
Not Qualified |
536870912 bit |
3.15 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
4 |
SMALL OUTLINE |
.8 mm |
70 Cel |
32MX4 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
22.22 mm |
||||||||||||||||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
50 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
130 mA |
4194304 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
8 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
.0003 Amp |
20.95 mm |
50 ns |
||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
18 |
DIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
22 mm |
80 ns |
||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
512KX8 |
512K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.7 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
18.42 mm |
80 ns |
|||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
1MX1 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.55 mm |
7.7 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
17.15 mm |
70 ns |
|||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
86 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
2097152 words |
YES |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
2MX32 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G86 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
22.22 mm |
6 ns |
|||||||||||||||||||||||
Toshiba |
OTHER DRAM |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
4194304 words |
5 |
4 |
SMALL OUTLINE |
4MX4 |
4M |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
Not Qualified |
16777216 bit |
4.5 V |
50 ns |
|||||||||||||||||||||||||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
100 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
e0 |
.0002 Amp |
20.95 mm |
50 ns |
||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
CMOS |
4194304 words |
8 |
4MX8 |
4M |
1 |
Not Qualified |
33554432 bit |
60 ns |
||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
STATIC COLUMN |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
24.6 mm |
70 ns |
|||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
40 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
262144 words |
5 |
18 |
SMALL OUTLINE |
1.27 mm |
256KX18 |
256K |
TIN LEAD |
DUAL |
1 |
R-PDSO-J40 |
5.5 V |
3.7 mm |
10.16 mm |
Not Qualified |
4718592 bit |
4.5 V |
e0 |
26.04 mm |
80 ns |
|||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
24.6 mm |
60 ns |
||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
66 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
4 |
SMALL OUTLINE, THIN PROFILE |
.65 mm |
70 Cel |
32MX4 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G66 |
2.7 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
2.3 V |
AUTO/SELF REFRESH |
22.22 mm |
.8 ns |
|||||||||||||||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4194304 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.47 V |
Not Qualified |
268435456 bit |
3.13 V |
50 ns |
||||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
18 |
DIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
22 mm |
80 ns |
||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
160 mA |
33554432 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Toshiba |
OTHER DRAM |
20 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
4194304 words |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
4MX4 |
4M |
DUAL |
1 |
R-PDSO-G20 |
3.6 V |
1.2 mm |
7.7 mm |
Not Qualified |
16777216 bit |
3 V |
17.14 mm |
70 ns |
|||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1350 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
34.98 mm |
125 MHz |
2.8 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH; WD-MAX |
.009 Amp |
133.35 mm |
6 ns |
||||||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX72 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.47 V |
Not Qualified |
603979776 bit |
3.13 V |
40 ns |
|||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
134217728 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
128MX4 |
128M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
|||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
INDUSTRIAL |
86 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
140 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE |
TSSOP86,.46,20 |
DRAMs |
.5 mm |
85 Cel |
3-STATE |
2MX32 |
2M |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G86 |
3.6 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
4.4 ns |
||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
170 mA |
67108864 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
64MX4 |
64M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
144 |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
ZIG-ZAG |
1 |
R-XZMA-N144 |
3.47 V |
Not Qualified |
536870912 bit |
3.13 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
50 ns |
|||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
19 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
STATIC COLUMN |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
1.27 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-PZIP-T19 |
5.5 V |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
100 ns |
||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
28 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
524288 words |
YES |
5 |
9 |
IN-LINE |
1.27 mm |
512KX9 |
512K |
TIN LEAD |
ZIG-ZAG |
1 |
R-PZIP-T28 |
5.5 V |
10.16 mm |
Not Qualified |
4718592 bit |
4.5 V |
SELF REFRESH |
e0 |
36.2 mm |
70 ns |
||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
105 mA |
2097152 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP28,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G28 |
Not Qualified |
16777216 bit |
e0 |
.0002 Amp |
70 ns |
|||||||||||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
4194304 words |
8 |
4MX8 |
4M |
1 |
Not Qualified |
33554432 bit |
80 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
5.4 ns |
||||||||||||||||||||||||||||||
Toshiba |
VIDEO DRAM |
COMMERCIAL |
40 |
TSOP2 |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST AND PIPELINED PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
262144 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
3-STATE |
256KX8 |
256K |
0 Cel |
TIN LEAD |
DUAL |
2 |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
2097152 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/AUTO/HIDDEN REFRESH |
e0 |
18.41 mm |
80 ns |
||||||||||||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1440 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
32 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX72 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.47 V |
25.4 mm |
Not Qualified |
603979776 bit |
3.13 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.0045 Amp |
40 ns |
|||||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
2097152 words |
40 |
2MX40 |
2M |
1 |
Not Qualified |
83886080 bit |
80 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
18 |
DIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
22 mm |
100 ns |
||||||||||||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
16777216 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.47 V |
Not Qualified |
1073741824 bit |
3.13 V |
40 ns |
|||||||||||||||||||||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
120 mA |
8388608 words |
NO |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
e0 |
.0005 Amp |
20.95 mm |
40 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.