Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
DDR1 DRAM |
OTHER |
60 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
2.5 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16MX18 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B60 |
2.625 V |
1.2 mm |
9 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
.5 ns |
|||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
16 |
70 Cel |
8MX32 |
8M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
268435456 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
60 ns |
|||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
512 |
PLASTIC/EPOXY |
NO |
CMOS |
560 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
SIP30,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
SINGLE |
22.86 mm |
Not Qualified |
8388608 bit |
e0 |
.008 Amp |
85 ns |
||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.75 mm |
8.89 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.15 mm |
100 ns |
||||||||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
1048576 words |
40 |
1MX40 |
1M |
1 |
Not Qualified |
41943040 bit |
70 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
125 MHz |
Not Qualified |
1207959552 bit |
2.3 V |
AUTO/SELF REFRESH |
.8 ns |
|||||||||||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX72 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.47 V |
Not Qualified |
603979776 bit |
3.13 V |
50 ns |
||||||||||||||||||||||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
24 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G24 |
3.6 V |
1.2 mm |
7.7 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS /HIDDEN REFRESH |
e0 |
17.14 mm |
60 ns |
||||||||||||||||||||||||
Toshiba |
RAMBUS DRAM |
62 |
TFBGA |
16384 |
RECTANGULAR |
PLASTIC/EPOXY |
BLOCK ORIENTED PROTOCOL |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
8388608 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA62,12X9,40/32 |
DRAMs |
.8 mm |
3-STATE |
8MX18 |
8M |
Tin/Lead (Sn/Pb) |
BOTTOM |
1 |
R-PBGA-B62 |
2.63 V |
1.2 mm |
600 MHz |
11.66 mm |
Not Qualified |
150994944 bit |
2.37 V |
SELF CONTAINED REFRESH |
e0 |
12.92 mm |
||||||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
4194304 words |
40 |
4MX40 |
4M |
1 |
Not Qualified |
167772160 bit |
60 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
600 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
25.4 mm |
125 MHz |
Not Qualified |
268435456 bit |
3 V |
.001 Amp |
6 ns |
||||||||||||||||||||
Toshiba |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX18 |
32M |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
31.75 mm |
600 MHz |
4.8 mm |
Not Qualified |
603979776 bit |
2.37 V |
SELF CONTAINED REFRESH; WD-MAX |
133.35 mm |
53 ns |
||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1360 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
143 MHz |
Not Qualified |
1073741824 bit |
3 V |
AUTO/SELF REFRESH |
.008 Amp |
5.4 ns |
|||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
1MX1 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
22 mm |
60 ns |
|||||||||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
CMOS |
4194304 words |
18 |
4MX18 |
4M |
1 |
Not Qualified |
75497472 bit |
50 ns |
||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
150 mA |
16777216 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX8 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
7 ns |
||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
MOS |
NO LEAD |
ASYNCHRONOUS |
1048576 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
18 |
70 Cel |
3-STATE |
1MX36 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
37748736 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
80 ns |
||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
760 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
125 MHz |
Not Qualified |
536870912 bit |
3 V |
.002 Amp |
6 ns |
|||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
86 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
125 mA |
2097152 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
32 |
SMALL OUTLINE, THIN PROFILE |
TSSOP86,.46,20 |
DRAMs |
.5 mm |
70 Cel |
3-STATE |
2MX32 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G86 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.7 mm |
7.7 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
18.42 mm |
40 ns |
||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
24 |
TSOP1-R |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
262144 words |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
256KX4 |
256K |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
6 mm |
Not Qualified |
1048576 bit |
4.5 V |
14.4 mm |
80 ns |
|||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
19 |
ZIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
IN-LINE |
1.27 mm |
70 Cel |
1MX1 |
1M |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-PZIP-T19 |
5.5 V |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
25.8 mm |
60 ns |
||||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
16 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32MX16 |
32M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B64 |
2.65 V |
1.2 mm |
12.7 mm |
Not Qualified |
536870912 bit |
2.35 V |
AUTO/SELF REFRESH |
e0 |
16.5 mm |
26 ns |
|||||||||||||||||||||||
Toshiba |
DRAM MODULE |
72 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
4194304 words |
3.3 |
32 |
SMALL OUTLINE |
4MX32 |
4M |
DUAL |
1 |
R-PDSO-G72 |
Not Qualified |
134217728 bit |
60 ns |
||||||||||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
640 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
25.53 mm |
133 MHz |
2.8 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH; WD-MAX |
.004 Amp |
133.35 mm |
5.4 ns |
||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
2097152 words |
YES |
2.5 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
2MX32 |
2M |
0 Cel |
QUAD |
1 |
R-PQFP-G100 |
2.7 V |
1.27 mm |
14 mm |
Not Qualified |
67108864 bit |
2.3 V |
AUTO/SELF REFRESH |
20 mm |
.7 ns |
|||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
8388608 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.4 mm |
70 Cel |
8MX16 |
8M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
11.2 mm |
6 ns |
|||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
40 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
262144 words |
3.3 |
16 |
SMALL OUTLINE |
1.27 mm |
256KX16 |
256K |
DUAL |
1 |
R-PDSO-J40 |
3.6 V |
3.7 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
26.04 mm |
70 ns |
|||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
50 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
1048576 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
20.95 mm |
9 ns |
|||||||||||||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
42 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
175 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ42,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J42 |
Not Qualified |
16777216 bit |
e0 |
.0002 Amp |
60 ns |
|||||||||||||||||||||||||
Toshiba |
VIDEO DRAM |
COMMERCIAL |
64 |
SSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST AND PIPELINED PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
TIN LEAD |
DUAL |
2 |
R-PDSO-G64 |
5.5 V |
3 mm |
11.2 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
26 mm |
70 ns |
||||||||||||||||||||||
Toshiba |
TIN LEAD |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.47 V |
Not Qualified |
536870912 bit |
3.13 V |
CAS BEFORE RAS/HIDDEN REFRESH |
40 ns |
||||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
1048576 bit |
e0 |
120 ns |
||||||||||||||||||||||||||||
Toshiba |
NIBBLE MODE DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NIBBLE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.75 mm |
7.7 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.15 mm |
80 ns |
||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
33554432 words |
YES |
3.3 |
4 |
SMALL OUTLINE |
.8 mm |
70 Cel |
32MX4 |
32M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
22.22 mm |
||||||||||||||||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
120 mA |
16777216 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
e0 |
.0005 Amp |
20.95 mm |
40 ns |
||||||||||||||||
Toshiba |
NIBBLE MODE DRAM |
COMMERCIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NIBBLE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
1MX1 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.55 mm |
7.7 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
17.15 mm |
60 ns |
|||||||||||||||||||||||
Toshiba |
DRAM MODULE |
72 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
1048576 words |
36 |
SMALL OUTLINE |
1MX36 |
1M |
DUAL |
1 |
R-PDSO-G72 |
Not Qualified |
37748736 bit |
80 ns |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1320 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
R-PDMA-N168 |
27.94 mm |
100 MHz |
Not Qualified |
268435456 bit |
.032 Amp |
8.5 ns |
||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
2.54 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T20 |
5.5 V |
4.4 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
24.6 mm |
100 ns |
|||||||||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
4194304 words |
32 |
4MX32 |
4M |
1 |
Not Qualified |
134217728 bit |
80 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
STATIC COLUMN |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
1MX1 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.55 mm |
7.7 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
17.15 mm |
60 ns |
|||||||||||||||||||||||
Toshiba |
OTHER DRAM |
24 |
TSOP1-R |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
262144 words |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
256KX4 |
256K |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
6 mm |
Not Qualified |
1048576 bit |
4.5 V |
14.4 mm |
10 ns |
|||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
85 mA |
262144 words |
NO |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
YES |
3-STATE |
256KX16 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G40 |
Not Qualified |
4194304 bit |
e0 |
.001 Amp |
80 ns |
||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
60 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
16MX16 |
16M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B60 |
3.6 V |
1.2 mm |
7.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
15.72 mm |
6 ns |
|||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1280 mA |
33554432 words |
YES |
COMMON |
3.3 |
3.3 |
8 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
34.98 mm |
133 MHz |
2.8 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH; WD-MAX |
.008 Amp |
133.35 mm |
5.4 ns |
||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
UNSPECIFIED |
SYNCHRONOUS |
600 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-X168 |
3.6 V |
2.8 mm |
100 MHz |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
.004 Amp |
133.35 mm |
7 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.