Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba |
EDO DRAM |
COMMERCIAL |
50 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
160 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP50,.46,32 |
8 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G50 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
20.95 mm |
40 ns |
||||||||||||||
Toshiba |
DDR1 DRAM |
COMMERCIAL |
66 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
GULL WING |
SYNCHRONOUS |
190 mA |
33554432 words |
2,4 |
YES |
COMMON |
2.5 |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP66,.46 |
DRAMs |
.65 mm |
70 Cel |
3-STATE |
32MX8 |
32M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G66 |
2.65 V |
1.2 mm |
200 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
2.35 V |
AUTO/SELF REFRESH |
e0 |
.002 Amp |
2,4 |
22.22 mm |
.65 ns |
|||||||||||||
Toshiba |
OTHER DRAM |
42 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
1048576 words |
3.3 |
16 |
SMALL OUTLINE |
1.27 mm |
1MX16 |
1M |
DUAL |
1 |
R-PDSO-J42 |
3.6 V |
3.7 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
27.31 mm |
80 ns |
|||||||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
2097152 words |
5 |
9 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
2MX9 |
2M |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
18874368 bit |
4.5 V |
20.95 mm |
70 ns |
|||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
304 mA |
2097152 words |
COMMON |
5 |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
0 Cel |
SINGLE |
R-PSMA-N72 |
17.78 mm |
Not Qualified |
75497472 bit |
.004 Amp |
70 ns |
|||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
1048576 words |
3.3 |
18 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
1MX18 |
1M |
DUAL |
1 |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
18874368 bit |
3 V |
20.95 mm |
80 ns |
|||||||||||||||||||||||||||||||
Toshiba |
DDR1 DRAM |
OTHER |
144 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
BALL |
SYNCHRONOUS |
8388608 words |
2,4 |
YES |
COMMON |
2.5 |
1.5/1.8,2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA144,12X18,40/32 |
DRAMs |
1 mm |
85 Cel |
3-STATE |
8MX36 |
8M |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B144 |
2.625 V |
1.2 mm |
200 MHz |
11 mm |
Not Qualified |
301989888 bit |
2.375 V |
AUTO/SELF REFRESH |
e0 |
2,4 |
18.5 mm |
.6 ns |
|||||||||||||||
Toshiba |
DRAM MODULE |
72 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
1048576 words |
32 |
SMALL OUTLINE |
1MX32 |
1M |
DUAL |
1 |
R-PDSO-G72 |
Not Qualified |
33554432 bit |
50 ns |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
26 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
4194304 words |
5 |
4 |
SMALL OUTLINE |
4MX4 |
4M |
DUAL |
1 |
R-PDSO-J26 |
5.5 V |
Not Qualified |
16777216 bit |
4.5 V |
50 ns |
|||||||||||||||||||||||||||||||||||
Toshiba |
DRAM MODULE |
1 |
4194304 words |
33 |
4MX33 |
4M |
1 |
Not Qualified |
138412032 bit |
60 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
20 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
1048576 words |
5 |
1 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
1MX1 |
1M |
DUAL |
1 |
R-PDSO-G20 |
5.5 V |
1.2 mm |
6 mm |
Not Qualified |
1048576 bit |
4.5 V |
14.4 mm |
80 ns |
|||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP2 |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
2097152 words |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
1.2 mm |
7.7 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
18.41 mm |
60 ns |
|||||||||||||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
32 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
8388608 words |
YES |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J32 |
3.6 V |
3.7 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
e0 |
20.96 mm |
40 ns |
|||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
205 mA |
524288 words |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX32 |
512K |
0 Cel |
SINGLE |
R-PSMA-N72 |
Not Qualified |
16777216 bit |
.001 Amp |
60 ns |
||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
ZIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
50 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
ZIP20,.1 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T20 |
Not Qualified |
1048576 bit |
e0 |
.0003 Amp |
120 ns |
||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
170 mA |
16777216 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX16 |
16M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
143 MHz |
10.16 mm |
Not Qualified |
268435456 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
1MX1 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.55 mm |
7.7 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
17.15 mm |
80 ns |
|||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
95 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
16777216 bit |
e0 |
.001 Amp |
70 ns |
|||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.4 mm |
70 Cel |
16MX8 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
11.2 mm |
6 ns |
|||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
262144 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
256KX8 |
256K |
0 Cel |
SINGLE |
1 |
R-XSMA-N30 |
5.5 V |
Not Qualified |
2097152 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
80 ns |
|||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G24 |
3.6 V |
1.2 mm |
7.7 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.14 mm |
50 ns |
||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
INDUSTRIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
160 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
85 Cel |
3-STATE |
8MX16 |
8M |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
133 MHz |
10.16 mm |
Not Qualified |
134217728 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
5.4 ns |
||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
TSSOP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
55 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20/26,.36 |
DRAMs |
.635 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
4194304 bit |
e0 |
.00015 Amp |
100 ns |
|||||||||||||||||||||||||
Toshiba |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
16777216 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX64 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.47 V |
Not Qualified |
1073741824 bit |
3.13 V |
50 ns |
|||||||||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
26 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
4194304 words |
5 |
4 |
SMALL OUTLINE |
4MX4 |
4M |
DUAL |
1 |
R-PDSO-J26 |
5.5 V |
Not Qualified |
16777216 bit |
4.5 V |
60 ns |
|||||||||||||||||||||||||||||||||||
Toshiba |
NIBBLE MODE DRAM |
COMMERCIAL |
20 |
ZIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NIBBLE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
IN-LINE |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-PZIP-T20 |
5.5 V |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
25.8 mm |
60 ns |
|||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
20 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
STATIC COLUMN |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
262144 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
256KX4 |
256K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.55 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.145 mm |
70 ns |
||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.7 mm |
7.7 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
17.15 mm |
40 ns |
||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
FAST PAGE |
1 |
CMOS |
16777216 words |
5 |
1 |
16MX1 |
16M |
1 |
5.5 V |
Not Qualified |
16777216 bit |
4.5 V |
60 ns |
||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
16777216 words |
YES |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
16MX72 |
16M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
1207959552 bit |
3 V |
AUTO/SELF REFRESH |
5.4 ns |
||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
125 mA |
2097152 words |
NO |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ28,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
16777216 bit |
e0 |
.0005 Amp |
60 ns |
|||||||||||||||||||||||||
Toshiba |
OTHER DRAM |
40 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
65536 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
64KX16 |
64K |
DUAL |
1 |
R-PDSO-G40 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
18.41 mm |
10 ns |
|||||||||||||||||||||||||||||||
Toshiba |
DRAM MODULE |
72 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
1048576 words |
36 |
SMALL OUTLINE |
1MX36 |
1M |
DUAL |
1 |
R-PDSO-G72 |
Not Qualified |
37748736 bit |
70 ns |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.75 mm |
7.7 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH |
e0 |
17.15 mm |
60 ns |
||||||||||||||||||||||
Toshiba |
OTHER DRAM |
20 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
262144 words |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
256KX4 |
256K |
DUAL |
1 |
R-PDSO-G20 |
5.5 V |
1.2 mm |
6 mm |
Not Qualified |
1048576 bit |
4.5 V |
14.4 mm |
80 ns |
|||||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
MOS |
NO LEAD |
ASYNCHRONOUS |
1048576 words |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
16 |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
33554432 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
80 ns |
||||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2980 mA |
67108864 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
R-PDMA-N168 |
125 MHz |
Not Qualified |
4831838208 bit |
.049 Amp |
6 ns |
|||||||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
110 mA |
8388608 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX8 |
8M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
100 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
7 ns |
||||||||||||
Toshiba |
VIDEO DRAM |
COMMERCIAL |
64 |
TSOP2 |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST AND PIPELINED PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.65 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
TIN LEAD |
DUAL |
2 |
R-PDSO-G64 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
23.45 mm |
70 ns |
||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
70 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T18 |
Not Qualified |
1048576 bit |
e0 |
.001 Amp |
85 ns |
||||||||||||||||||||||||||
Toshiba |
PAGE MODE DRAM |
COMMERCIAL |
18 |
QCCJ |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
MOS |
J BEND |
262144 words |
SEPARATE |
5 |
5 |
1 |
CHIP CARRIER |
LDCC18,.33X.53 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQCC-J18 |
Not Qualified |
262144 bit |
e0 |
150 ns |
||||||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
80 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP24/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G24 |
Not Qualified |
16777216 bit |
e0 |
.001 Amp |
60 ns |
|||||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM |
COMMERCIAL |
20 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
1MX1 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.55 mm |
7.7 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
17.15 mm |
100 ns |
|||||||||||||||||||||||
Toshiba |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
CMOS |
GULL WING |
SYNCHRONOUS |
67108864 words |
1,2,4,8,FP |
YES |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
64MX8 |
64M |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
e0 |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
|||||||||||||
Toshiba |
DRAM MODULE |
1 |
16777216 words |
8 |
16MX8 |
16M |
1 |
Not Qualified |
134217728 bit |
60 ns |
|||||||||||||||||||||||||||||||||||||||||||||||||
Toshiba |
STATIC COLUMN DRAM |
COMMERCIAL |
20 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
STATIC COLUMN |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J20 |
5.5 V |
3.75 mm |
8.89 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
17.15 mm |
60 ns |
||||||||||||||||||||||
Toshiba |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
480 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
SINGLE |
R-PSMA-N30 |
20.32 mm |
Not Qualified |
8388608 bit |
.008 Amp |
100 ns |
|||||||||||||||||||||||||||
Toshiba |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
16777216 words |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
CAS BEFORE RAS/HIDDEN REFRESH |
20.95 mm |
40 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.