CONFIGURATION MEMORY EEPROM 685

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

EPC1213PC

Altera

CONFIGURATION MEMORY

COMMERCIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

26624 words

COMMON

5

5

8

IN-LINE

DIP8,.3

OTP ROMs

2.54 mm

70 Cel

3-STATE

26KX8

26K

0 Cel

TIN LEAD

DUAL

R-PDIP-T8

5.25 V

4.318 mm

8 MHz

7.62 mm

Not Qualified

212992 bit

4.75 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

e0

220

9.398 mm

EPC1064TC

Altera

CONFIGURATION MEMORY

COMMERCIAL

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

65536 words

5

1

FLATPACK, LOW PROFILE

.8 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

TIN LEAD

QUAD

S-PQFP-G32

5.25 V

1.27 mm

7 mm

Not Qualified

65536 bit

4.75 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

e0

7 mm

EPC1064VLM

Altera

CONFIGURATION MEMORY

MILITARY

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

SERIAL

SYNCHRONOUS

65536 words

3.3

1

CHIP CARRIER

1.27 mm

125 Cel

3-STATE

64KX1

64K

-55 Cel

QUAD

S-PQCC-J20

3.6 V

4.57 mm

8.9662 mm

Not Qualified

65536 bit

3 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

8.9662 mm

EPC1064LI

Altera

CONFIGURATION MEMORY

INDUSTRIAL

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

SERIAL

SYNCHRONOUS

65536 words

5

1

CHIP CARRIER

1.27 mm

85 Cel

3-STATE

64KX1

64K

-40 Cel

TIN LEAD

QUAD

S-PQCC-J20

5.25 V

4.57 mm

8.9662 mm

Not Qualified

65536 bit

4.75 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

e0

8.9662 mm

EPC1213PC8

Altera

CONFIGURATION MEMORY

COMMERCIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

MOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

212942 words

COMMON

5

5

1

IN-LINE

DIP8,.3

OTP ROMs

2.54 mm

70 Cel

3-STATE

212942X1

212942

0 Cel

TIN LEAD

DUAL

R-PDIP-T8

1

5.25 V

4.318 mm

6 MHz

7.62 mm

Not Qualified

212942 bit

4.75 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

e0

9.398 mm

EPC1064LCI20

Altera

CONFIGURATION MEMORY

INDUSTRIAL

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

J BEND

SYNCHRONOUS

65536 words

5

1

CHIP CARRIER

85 Cel

64KX1

64K

-40 Cel

QUAD

S-PQCC-J20

5.5 V

Not Qualified

65536 bit

4.5 V

EPC1213DM8

Altera

CONFIGURATION MEMORY

MILITARY

8

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

26624 words

COMMON

5

5

8

IN-LINE

DIP8,.3

OTP ROMs

2.54 mm

125 Cel

3-STATE

26KX8

26K

-55 Cel

TIN LEAD

DUAL

R-GDIP-T8

5.25 V

5.08 mm

6 MHz

7.62 mm

Not Qualified

212992 bit

4.75 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES, ALSO OPERATES WITH 3V-3.6V

e0

220

9.65 mm

EPC1064VPC

Altera

CONFIGURATION MEMORY

COMMERCIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

65536 words

3.3

1

IN-LINE

2.54 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

TIN LEAD

DUAL

R-PDIP-T8

3.6 V

4.318 mm

7.62 mm

Not Qualified

65536 bit

3 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

e0

9.398 mm

EPC1064TI

Altera

CONFIGURATION MEMORY

INDUSTRIAL

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

65536 words

5

1

FLATPACK, LOW PROFILE

.8 mm

85 Cel

3-STATE

64KX1

64K

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

5.25 V

1.27 mm

7 mm

Not Qualified

65536 bit

4.75 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

e0

7 mm

EPC1064VTI32

Altera

CONFIGURATION MEMORY

INDUSTRIAL

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

MOS

GULL WING

SYNCHRONOUS

65536 words

COMMON

3.3

3.3

1

FLATPACK, LOW PROFILE

TQFP32,.35SQ,32

OTP ROMs

.8 mm

85 Cel

3-STATE

64KX1

64K

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

3

3.6 V

1.27 mm

4 MHz

7 mm

Not Qualified

65536 bit

3 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

e0

220

7 mm

EPC4QI100N

Altera

CONFIGURATION MEMORY

INDUSTRIAL

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

90 mA

262144 words

3.3

3.3

16

FLATPACK

QFP100,.7X.9

Flash Memories

.65 mm

85 Cel

256KX16

256K

-40 Cel

MATTE TIN

QUAD

R-PQFP-G100

3

3.6 V

3.4 mm

66.7 MHz

14 mm

Not Qualified

4194304 bit

3 V

e3

30

245

NOR TYPE

.00015 Amp

20 mm

5962-9474501MPX

Altera

CONFIGURATION MEMORY

MILITARY

8

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

MIL-STD-883

THROUGH-HOLE

SERIAL

SYNCHRONOUS

262144 words

5

1

IN-LINE

2.54 mm

125 Cel

256KX1

256K

-55 Cel

TIN LEAD

DUAL

R-GDIP-T8

5.25 V

5.08 mm

6 MHz

7.62 mm

Not Qualified

262144 bit

4.75 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

e0

9.65 mm

5962-9474501MPA

Altera

CONFIGURATION MEMORY

MILITARY

8

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

MIL-STD-883

THROUGH-HOLE

SERIAL

SYNCHRONOUS

262144 words

5

1

IN-LINE

2.54 mm

125 Cel

3-STATE

256KX1

256K

-55 Cel

TIN LEAD

DUAL

R-GDIP-T8

5.25 V

5.08 mm

6 MHz

7.62 mm

Not Qualified

262144 bit

4.75 V

4 WIRE INTERFACE TO FLEX 8000 DEVICES

e0

220

9.65 mm

EEPROM

EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.

EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.

One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.

EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.

One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.