Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
3 mA |
8192 words |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
65536 bit |
e4 |
260 |
.000001 Amp |
||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
5 |
3/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
64X16 |
64 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
2 MHz |
3.9 mm |
Not Qualified |
5 ms |
MICROWIRE |
1024 bit |
2.5 V |
e4 |
260 |
.00001 Amp |
4.9 mm |
|||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
5 |
3/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
128X16 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
2 MHz |
3.9 mm |
Not Qualified |
5 ms |
MICROWIRE |
2048 bit |
2.5 V |
e4 |
260 |
.000005 Amp |
4.9 mm |
|||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
5 |
3/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
10 MHz |
3 mm |
Not Qualified |
5 ms |
SPI |
4096 bit |
2.5 V |
e4 |
40 |
260 |
.000001 Amp |
4.4 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.95 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
DUAL |
R-PDSO-G5 |
5.5 V |
1.1 mm |
1 MHz |
1.6 mm |
5 ms |
I2C |
1024 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.9 mm |
||||||||||||||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3.9 mm |
Not Qualified |
20 ms |
I2C |
32768 bit |
1.8 V |
e0 |
.000001 Amp |
4.9 mm |
||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
131072 words |
2.5 |
8 |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.65 mm |
1 MHz |
3.9 mm |
5 ms |
I2C |
1048576 bit |
1.7 V |
SEATED HT-CALCULATED |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
65536 words |
2.5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.71 mm |
1 MHz |
4.4 mm |
5 ms |
I2C |
524288 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8 mA |
32768 words |
1.8 |
1.8/5 |
8 |
SMALL OUTLINE, LOW PROFILE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.6 mm |
1000000 Write/Erase Cycles |
20 MHz |
4.4 mm |
Not Qualified |
5 ms |
SPI |
262144 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
5 mm |
|||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
16 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
3.3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP16,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
3-STATE |
2KX8 |
2K |
-40 Cel |
1010000R |
DUAL |
HARDWARE |
R-PDSO-G16 |
5.5 V |
1.25 mm |
1000000 Write/Erase Cycles |
.4 MHz |
4.4 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
3 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0001 Amp |
5 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
256 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
5 MHz |
3 mm |
Not Qualified |
5 ms |
SPI |
2048 bit |
1.8 V |
e4 |
40 |
260 |
.0000005 Amp |
4.4 mm |
||||||||||||||||||||||
Defense Logistics Agency |
EEPROM |
MILITARY |
DFP |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
FLAT |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
FLATPACK |
1.27 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
5.5 V |
3.02 mm |
10.16 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
18.285 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
100 |
.65 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.1 MHz |
3 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.8 V |
DATA RETENTION = 100 YEARS |
e0 |
.000003 Amp |
4.4 mm |
|||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.73 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
4.5 V |
2-WIRE SERIAL INTERFACE |
e0 |
.000018 Amp |
4.89 mm |
|||||||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1024 words |
3 |
8 |
SMALL OUTLINE |
100 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.7 V |
DATA RETENTION = 100 YEARS |
e3 |
40 |
260 |
4.9 mm |
|||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
3 mA |
16384 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
EEPROMs |
40 |
.5 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
HARDWARE/SOFTWARE |
R-XDSO-N8 |
3.6 V |
.6 mm |
1000000 Write/Erase Cycles |
1 MHz |
2 mm |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.8 V |
e4 |
260 |
.000001 Amp |
3 mm |
|||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
100 |
1.27 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
1010MMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
1 MHz |
3.9 mm |
5 ms |
I2C |
16384 bit |
1.8 V |
.000006 Amp |
4.9 mm |
5 |
|||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
-40 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
2.1 MHz |
3.9 mm |
Not Qualified |
10 ms |
SPI |
32768 bit |
2.7 V |
DATA RETENTION > 100 YEARS |
e0 |
.0000005 Amp |
4.9 mm |
||||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
65536 words |
5 |
YES |
5 |
16 |
IN-LINE |
DIP40,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-CDIP-T40 |
5.5 V |
4.06 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
AUTOMATIC WRITE; PAGE WRITE |
64 |
e0 |
.0004 Amp |
50.755 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
40 |
.5 mm |
85 Cel |
3-STATE |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-N8 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
.4 MHz |
2 mm |
5 ms |
I2C |
2048 bit |
1.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
3 mm |
2.5 |
|||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
512 words |
2.5 |
8 |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.65 mm |
.4 MHz |
3.9 mm |
5 ms |
I2C |
4096 bit |
1.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16384 words |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
S-PDSO-G8 |
5.5 V |
1.1 mm |
1 MHz |
3 mm |
5 ms |
I2C |
131072 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
2.5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
.9 mm |
1 MHz |
2.8 mm |
5 ms |
I2C |
65536 bit |
1.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
2.9 mm |
||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
8192 words |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
40 |
.65 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
5 ms |
I2C |
65536 bit |
1.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
4.4 mm |
2.5 |
|||||||||||||||||||||||||
|
ROHM |
EEPROM |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
8192 words |
2.5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSSOP8,.16 |
50 |
.65 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
.9 mm |
4000000 Write/Erase Cycles |
1 MHz |
2.8 mm |
3.5 ms |
I2C |
65536 bit |
1.7 V |
.00001 Amp |
2.9 mm |
2.5 |
|||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
TIN COPPER |
1010DMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.78 mm |
1000000 Write/Erase Cycles |
.4 MHz |
4.4 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.8 V |
e2 |
10 |
260 |
.000002 Amp |
5 mm |
|||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
TIN COPPER |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.78 mm |
1000000 Write/Erase Cycles |
.4 MHz |
4.4 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
1.7 V |
e2 |
10 |
260 |
.000002 Amp |
5 mm |
|||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
1.8/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP8,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.35 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
Not Qualified |
5 ms |
MICROWIRE |
2048 bit |
1.6 V |
SEATED HT-CALCULATED |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
4.4 mm |
||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2 mA |
8192 words |
2.5 |
1.8/5 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.11,20 |
EEPROMs |
40 |
.5 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-N8 |
1 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
.4 MHz |
2 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
1.6 V |
e3 |
.000002 Amp |
3 mm |
|||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, LOW PROFILE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.65 mm |
20 MHz |
3.9 mm |
5 ms |
SPI |
65536 bit |
4.5 V |
ALSO OPERATES AT 1.6V WITH 3MHZ ,1.7V WITH 5MHZ AND 2.5V WITH 10MHZ AND SEATED HT-CALCULATED |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
SERIAL |
3 mA |
1024 words |
1.8/5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
1KX16 |
1K |
-40 Cel |
DUAL |
SOFTWARE |
R-PDSO-G8 |
1000000 Write/Erase Cycles |
Not Qualified |
3-WIRE |
16384 bit |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3 |
5.5 V |
3.55 mm |
1000000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
64 |
e3 |
30 |
245 |
.0002 Amp |
13.97 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
128X8 |
128 |
-40 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
2.7 V |
DATA RETENTION = 100 YEARS |
e0 |
.000004 Amp |
9.271 mm |
|||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP14,.25 |
EEPROMs |
100 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
256X8 |
256 |
0 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G14 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
4.5 V |
2-WIRE SERIAL INTERFACE |
e0 |
.000018 Amp |
8.65 mm |
|||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
32768 words |
3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
10100DDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
262144 bit |
2.7 V |
HARDWARE & SOFTWARE DATA PROTECTION; DATA RETENTION 40 YEARS |
e0 |
.0000005 Amp |
9.271 mm |
||||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
65536 words |
3.6 |
8 |
SMALL OUTLINE |
SOP8,.3 |
40 |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
2.16 mm |
1000000 Write/Erase Cycles |
1 MHz |
5.24 mm |
5 ms |
I2C |
524288 bit |
2.5 V |
128 |
.000006 Amp |
5.29 mm |
3.6 |
||||||||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
EEPROMs |
.5 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
1048576 bit |
4.5 V |
AUTOMATIC WRITE |
128 |
e0 |
240 |
.0002 Amp |
18.4 mm |
150 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2048 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G24 |
5.5 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
1 ms |
16384 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
.0001 Amp |
15.4 mm |
200 ns |
5 |
YES |
||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
45 mA |
2048 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP24,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
2KX8 |
2K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T24 |
5.5 V |
5.59 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
.2 ms |
16384 bit |
4.5 V |
AUTOMATIC WRITE |
e0 |
.0001 Amp |
31.9 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e0 |
225 |
.0001 Amp |
13.97 mm |
200 ns |
5 |
YES |
|||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3.3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
3.465 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
3.135 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.00002 Amp |
13.97 mm |
200 ns |
3 |
YES |
||||||||||||||||||||
|
ROHM |
EEPROM |
PURE TIN |
1 |
10 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2.5 mA |
32768 words |
2.5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
40 |
.65 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3 mm |
5 ms |
I2C |
262144 bit |
1.6 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
4.4 mm |
2.5 |
|||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
4096 words |
2.5 |
8 |
SMALL OUTLINE, LOW PROFILE |
SOP8,.25 |
40 |
1.27 mm |
85 Cel |
3-STATE |
4KX8 |
4K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.65 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
5 ms |
I2C |
32768 bit |
1.6 V |
SEATED HT-CALCULATED |
NOT SPECIFIED |
NOT SPECIFIED |
.000002 Amp |
4.9 mm |
2.5 |
||||||||||||||||||||||||
|
ROHM |
EEPROM |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-N8 |
5.5 V |
.6 mm |
1 MHz |
2 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
ROHM |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
32768 words |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-G8 |
5.5 V |
1.71 mm |
1 MHz |
4.4 mm |
3.5 ms |
I2C |
262144 bit |
1.7 V |
SEATED HGT CALCULATED |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.