Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
1 |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
100000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
64 |
e3 |
30 |
260 |
.0001 Amp |
17.9 mm |
70 ns |
5 |
YES |
|||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
10 |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T28 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
64 |
e3 |
.0002 Amp |
37.0205 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
10 |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
1 |
R-PDIP-T28 |
5.5 V |
4.826 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e3 |
.0001 Amp |
37.0205 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
64 |
e3 |
30 |
260 |
.0002 Amp |
17.9 mm |
150 ns |
5 |
YES |
||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class C |
FLAT |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F28 |
1 |
5.5 V |
3.02 mm |
10000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
200 ns |
5 |
YES |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
1 |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
100000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e3 |
30 |
260 |
.0001 Amp |
17.9 mm |
150 ns |
5 |
YES |
||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
8 |
SMALL OUTLINE |
SOP28,.4 |
10 |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
1 |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
100000 Write/Erase Cycles |
7.5 mm |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e3 |
30 |
260 |
.0001 Amp |
17.9 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class C |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
10 ms |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
37.215 mm |
250 ns |
5 |
|||||||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
10 |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F28 |
5.5 V |
3.02 mm |
10000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
2.65 mm |
7.5 mm |
10 ms |
262144 bit |
4.5 V |
17.9 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||||||||
|
Catalyst Semiconductor |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
MATTE TIN |
DUAL |
R-PDIP-T28 |
5.5 V |
5.08 mm |
1000000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
32 |
e3 |
.0001 Amp |
36.695 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||||
|
Onsemi |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
30 mA |
8192 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
TIN |
DUAL |
R-PDIP-T28 |
5.5 V |
5.08 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
5 ms |
65536 bit |
4.5 V |
32 |
e3 |
.0001 Amp |
36.695 mm |
120 ns |
5 |
YES |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
100000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e3 |
30 |
260 |
.0002 Amp |
17.9 mm |
150 ns |
5 |
YES |
|||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G28 |
3 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
2.7 V |
AUTOMATIC WRITE |
64 |
e3 |
30 |
260 |
.00005 Amp |
17.9 mm |
200 ns |
3 |
YES |
||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
100000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
64 |
e3 |
30 |
260 |
.0003 Amp |
17.9 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3.3 |
YES |
3.3 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
3.465 V |
5.59 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
3.135 V |
AUTOMATIC WRITE |
64 |
e0 |
.00005 Amp |
36.95 mm |
250 ns |
3 |
YES |
||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
PGA |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 Class C |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
GRID ARRAY |
PGA28,5X6 |
EEPROMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
PERPENDICULAR |
R-CPGA-P28 |
5.5 V |
4.4 mm |
10000 Write/Erase Cycles |
13.97 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
16.51 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3.3 |
YES |
3.3 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
3.465 V |
5.59 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
3.135 V |
AUTOMATIC WRITE |
64 |
e0 |
.00002 Amp |
36.95 mm |
250 ns |
3 |
YES |
||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
10 |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
37.25 mm |
350 ns |
5 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
7.5 mm |
10 ms |
262144 bit |
4.5 V |
e3 |
30 |
260 |
17.9 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
7.5 mm |
3 ms |
262144 bit |
4.5 V |
e3 |
30 |
260 |
17.9 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
64 |
e3 |
30 |
260 |
.0002 Amp |
17.9 mm |
150 ns |
5 |
YES |
||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
30 |
240 |
.0002 Amp |
37.0205 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
7.5 mm |
10 ms |
262144 bit |
4.5 V |
e3 |
30 |
260 |
17.9 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
8 |
SMALL OUTLINE |
SOP28,.4 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G28 |
3 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
10 ms |
262144 bit |
2.7 V |
THE PART EXISTS IN EEPROM3V |
64 |
e3 |
30 |
260 |
.00005 Amp |
17.9 mm |
200 ns |
3 |
||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
10 |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
30 |
225 |
.0002 Amp |
37.0205 mm |
150 ns |
5 |
YES |
|||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
8 |
IN-LINE |
DIP28,.6 |
10 |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
NO |
DUAL |
1 |
R-GDIP-T28 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
3 ms |
262144 bit |
4.5 V |
64 |
NOT SPECIFIED |
NOT SPECIFIED |
.0003 Amp |
37.215 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
11.8 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
10 |
.55 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
e3 |
11.8 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
11.8 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
1 |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
100000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
64 |
e3 |
30 |
260 |
.0001 Amp |
17.9 mm |
90 ns |
5 |
YES |
|||||||||||||||||
Renesas Electronics |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
2.65 mm |
7.5 mm |
5 ms |
262144 bit |
4.5 V |
17.9 mm |
120 ns |
5 |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class C |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
8 |
IN-LINE |
DIP28,.6 |
10 |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
NO |
DUAL |
HARDWARE/SOFTWARE |
R-GDIP-T28 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
10 ms |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0003 Amp |
37.215 mm |
200 ns |
5 |
YES |
|||||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0002 Amp |
37.0205 mm |
250 ns |
5 |
YES |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
64 |
e3 |
30 |
260 |
17.9 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
DUAL |
R-PDSO-G28 |
1 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
5 ms |
262144 bit |
4.5 V |
10000 PROGRAM/ERASE CYCLES |
64 |
.00015 Amp |
11.8 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0002 Amp |
37.0205 mm |
250 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
1.27 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
2.7 V |
AUTOMATIC WRITE |
64 |
e0 |
240 |
.00002 Amp |
17.9 mm |
200 ns |
3 |
YES |
|||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G28 |
2 |
3.6 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
2.7 V |
AUTOMATIC WRITE |
64 |
e0 |
240 |
.00005 Amp |
17.9 mm |
200 ns |
3 |
YES |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
8192 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
10 |
.55 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
65536 bit |
4.5 V |
100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
64 |
e3 |
.0001 Amp |
11.8 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||
Hitachi |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
25 mA |
8192 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
10 |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
TIN LEAD |
YES |
DUAL |
R-PDIP-T28 |
5.5 V |
5.7 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; 32 BYTE PAGE WRITE; AUTOMATIC WRITE |
32 |
e0 |
.001 Amp |
35.6 mm |
250 ns |
5 |
YES |
|||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-STD-883 Class C |
FLAT |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
FLATPACK |
FL28,.4 |
EEPROMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-CDFP-F28 |
1 |
5.5 V |
3.02 mm |
10000 Write/Erase Cycles |
10.16 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
18.285 mm |
150 ns |
5 |
YES |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
64 |
e3 |
30 |
260 |
.0003 Amp |
17.9 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
EEPROMs |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
64 |
e3 |
.0003 Amp |
11.8 mm |
90 ns |
5 |
YES |
||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.55 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
8 mm |
10 ms |
262144 bit |
4.5 V |
11.8 mm |
90 ns |
5 |
|||||||||||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
10 ms |
262144 bit |
4.5 V |
64 |
e0 |
37.215 mm |
150 ns |
5 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
8 |
IN-LINE |
DIP28,.6 |
10 |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
NO |
DUAL |
1 |
R-GDIP-T28 |
5.5 V |
5.72 mm |
100000 Write/Erase Cycles |
15.24 mm |
10 ms |
262144 bit |
4.5 V |
64 |
NOT SPECIFIED |
NOT SPECIFIED |
.0003 Amp |
37.215 mm |
250 ns |
5 |
YES |
|||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
2.65 mm |
7.5 mm |
10 ms |
65536 bit |
4.5 V |
17.9 mm |
150 ns |
5 |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.