Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
1 MHz |
.674 mm |
5 ms |
I2C |
32768 bit |
1.8 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.645 mm |
1 MHz |
.959 mm |
5 ms |
I2C |
65536 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.073 mm |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
.4 MHz |
.674 mm |
10 ms |
I2C |
32768 bit |
1.6 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.635 mm |
.4 MHz |
1.4 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.805 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.33 mm |
1 MHz |
.959 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.073 mm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
131072 words |
2.5 |
2/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,3X5,17/10 |
EEPROMs |
200 |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
5.5 V |
.58 mm |
4000000 Write/Erase Cycles |
16 MHz |
1.698 mm |
Not Qualified |
5 ms |
SPI |
1048576 bit |
1.8 V |
.000001 Amp |
2.56 mm |
|||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
125 Cel |
32X8 |
32 |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.65 mm |
5 MHz |
1.785 mm |
5 ms |
SPI |
256 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.97 mm |
60 ns |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
2/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA5,3X3,14/8 |
EEPROMs |
40 |
.2 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B5 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
1 MHz |
.959 mm |
Not Qualified |
I2C |
65536 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
1.073 mm |
||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32768 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.58 mm |
1 MHz |
1.271 mm |
5 ms |
I2C |
262144 bit |
1.7 V |
1.358 mm |
||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
1.8 |
2/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,3X3,16 |
EEPROMs |
40 |
.4 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
1 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
3.5 MHz |
1.35 mm |
Not Qualified |
5 ms |
SPI |
16384 bit |
1.7 V |
e3 |
.000001 Amp |
1.365 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
32768 words |
1.8 |
1.8/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,3X5,14/8 |
EEPROMs |
200 |
.4 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
.58 mm |
4000000 Write/Erase Cycles |
1 MHz |
1.271 mm |
Not Qualified |
5 ms |
I2C |
262144 bit |
1.7 V |
.000001 Amp |
1.358 mm |
||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
OTHER |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
16KX8 |
16K |
-20 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.635 mm |
.4 MHz |
1.4 mm |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.805 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
16384 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.635 mm |
.4 MHz |
1.4 mm |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.805 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.33 mm |
1 MHz |
.959 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.073 mm |
||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
32768 words |
2.5 |
2/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,3X5,14/8 |
1 |
EEPROMs |
200 |
.5 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
.65 mm |
4000000 Write/Erase Cycles |
.4 MHz |
1.785 mm |
Not Qualified |
5 ms |
I2C |
262144 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
1.97 mm |
5 |
||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
1 MHz |
.674 mm |
5 ms |
I2C |
65536 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.795 mm |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.33 mm |
1 MHz |
.959 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
1.073 mm |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
1.8/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA5,3X3,14/8 |
EEPROMs |
40 |
.346 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B5 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
1 MHz |
.959 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
1.073 mm |
|||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.33 mm |
20 MHz |
.959 mm |
5 ms |
SPI |
65536 bit |
4.5 V |
ALSO OPERATES 1.7 V SUPPLY AT 5MHZ |
NOT SPECIFIED |
NOT SPECIFIED |
1.073 mm |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
S-PBGA-B4 |
1 |
5.5 V |
.33 mm |
1 MHz |
.833 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
.833 mm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
.4 MHz |
.674 mm |
5 ms |
I2C |
65536 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.795 mm |
|||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
32768 words |
5 |
2/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,3X5,17/10 |
EEPROMs |
40 |
.5 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
5.5 V |
.65 mm |
1000000 Write/Erase Cycles |
5 MHz |
1.785 mm |
Not Qualified |
5 ms |
SPI |
262144 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000003 Amp |
1.97 mm |
|||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.645 mm |
1 MHz |
.959 mm |
5 ms |
I2C |
65536 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.073 mm |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2048 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.346 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.6 mm |
.4 MHz |
1.21 mm |
5 ms |
I2C |
16384 bit |
2.5 V |
1.255 mm |
||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
1024 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
85 Cel |
1KX8 |
1K |
-20 Cel |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.33 mm |
.4 MHz |
1.025 mm |
5 ms |
I2C |
8192 bit |
2.5 V |
ALSO AVALIABLE IN 100 KHZ AND VOLATGE AND TEMPERATURE CAPTURED BASED ON ORDERING INFORMATION |
1.215 mm |
||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
131072 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.58 mm |
1 MHz |
1.698 mm |
5 ms |
I2C |
1048576 bit |
1.8 V |
2.56 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
1 MHz |
.674 mm |
5 ms |
I2C |
65536 bit |
2.5 V |
.795 mm |
||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.32 mm |
1 MHz |
.674 mm |
5 ms |
I2C |
32768 bit |
2.5 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.645 mm |
1 MHz |
.959 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
1.073 mm |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
32768 words |
2.5 |
2/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,3X5,14/8 |
EEPROMs |
200 |
.4 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
1010DDDR |
BOTTOM |
HARDWARE |
R-PBGA-B8 |
5.5 V |
.58 mm |
4000000 Write/Erase Cycles |
1 MHz |
1.271 mm |
Not Qualified |
5 ms |
I2C |
262144 bit |
1.8 V |
.000001 Amp |
1.358 mm |
||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.345 mm |
1 MHz |
.674 mm |
5 ms |
I2C |
32768 bit |
1.7 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.33 mm |
10 MHz |
.959 mm |
5 ms |
SPI |
65536 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.073 mm |
||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
32X8 |
32 |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.65 mm |
5 MHz |
1.785 mm |
5 ms |
SPI |
256 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.97 mm |
80 ns |
||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
1024 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.33 mm |
.4 MHz |
.685 mm |
5 ms |
I2C |
8192 bit |
1.8 V |
.695 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
.8 mA |
1024 words |
2.5 |
2/5 |
8 |
GRID ARRAY |
BGA5,3X3,14/8 |
EEPROMs |
40 |
.4 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
1010DMMR |
BOTTOM |
HARDWARE |
R-PBGA-B5 |
5.5 V |
.595 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.025 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
1.215 mm |
900 ns |
|||||||||||||||||||||||
STMicroelectronics |
EEPROM |
OTHER |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
5 mA |
4096 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
4KX8 |
4K |
-20 Cel |
BOTTOM |
R-PBGA-B4 |
5.5 V |
.32 mm |
1 MHz |
.674 mm |
5 ms |
I2C |
32768 bit |
2.5 V |
.795 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
16384 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.58 mm |
20 MHz |
1.081 mm |
5 ms |
SPI |
131072 bit |
2.5 V |
1.271 mm |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.33 mm |
1 MHz |
.959 mm |
5 ms |
I2C |
65536 bit |
1.8 V |
1.073 mm |
|||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2.5 mA |
8192 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.645 mm |
1 MHz |
.959 mm |
5 ms |
I2C |
65536 bit |
1.8 V |
1.073 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2048 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.6 mm |
10 MHz |
1.35 mm |
5 ms |
SPI |
16384 bit |
2.5 V |
1.365 mm |
||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32 words |
5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
125 Cel |
32X8 |
32 |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.65 mm |
5 MHz |
1.785 mm |
5 ms |
SPI |
256 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.97 mm |
60 ns |
|||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
1.8 |
2/5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA8,3X3,16 |
EEPROMs |
40 |
.4 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B8 |
5.5 V |
.6 mm |
1000000 Write/Erase Cycles |
3.5 MHz |
1.35 mm |
Not Qualified |
5 ms |
SPI |
16384 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
1.365 mm |
|||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
AUTOMOTIVE |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4096 words |
2.7 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
125 Cel |
4KX8 |
4K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.635 mm |
.4 MHz |
1.4 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
2.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.805 mm |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
131072 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
85 Cel |
128KX8 |
128K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.32 mm |
1 MHz |
1.698 mm |
5 ms |
I2C |
1048576 bit |
1.8 V |
ALSO OPERATES AT 400KHZ |
2.56 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
32768 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.58 mm |
20 MHz |
1.271 mm |
5 ms |
SPI |
262144 bit |
1.7 V |
1.358 mm |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
4096 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.635 mm |
.4 MHz |
1.4 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
1.805 mm |
|||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2048 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
BOTTOM |
R-PBGA-B8 |
5.5 V |
.6 mm |
5 MHz |
1.35 mm |
5 ms |
SPI |
16384 bit |
1.7 V |
1.365 mm |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
1024 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.346 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
BOTTOM |
R-PBGA-B5 |
5.5 V |
.33 mm |
.4 MHz |
1.025 mm |
5 ms |
I2C |
8192 bit |
1.7 V |
1.215 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.